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AMD XC7S75-L1FGGA676I
- Part No.:
- XC7S75-L1FGGA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S75-L1FGGA676I.pdf
- Description:
- IC FPGA 400 I/O 676FPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,289
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Product details
Overview
XC7S75-L1FGGA676I from AMD is a Spartan-7 FPGA with 74,694 logic cells, 3.3V I/O voltage support, -1 speed grade, and 676-pin FCBGA package; used in industrial motor control, embedded vision preprocessing, and real-time protocol bridging.
For engineers reviewing the XC7S75-L1FGGA676I datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, I/O bank configuration, embedded RAM blocks, and thermal performance in convection-cooled enclosures.
Technical Context
The XC7S75-L1FGGA676I implements a 28 nm HKMG process-based architecture with 360 DSP slices, 4.2 Mb of total block RAM, and supports LVCMOS/LVTTL, SSTL, and HSTL I/O standards across 12 configurable I/O banks. It includes integrated clock management with six MMCMs and twelve PLLs for multi-domain timing synthesis.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device supports partial reconfiguration and operates over –40°C to +100°C junction temperature range per its Industrial grade rating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,694 - determines maximum combinational/sequential logic density for state machines and datapath implementation |
| Block RAM | 4.2 Mb - enables on-chip buffering for video frame stores, FIFOs, or lookup tables without external memory |
| DSP Slices | 360 - supports parallel multiply-accumulate operations for motor control algorithms or filter pipelines |
| I/O Pins | 400 user I/O - provides interface flexibility for sensor arrays, display controllers, and industrial fieldbus peripherals |
| Speed Grade | -1 - specifies maximum operating frequency for critical paths at industrial temperature and voltage conditions |
| Operating Temp | –40°C to +100°C - qualifies for use in sealed industrial enclosures without active cooling |
Pinout & Package
XC7S75-L1FGGA676I is housed in a 25 mm × 25 mm, 1.0 mm pitch, 676-ball Fine-Pitch Flip-Chip BGA (FCBGA) package with 400 user-configurable I/O terminals distributed across 12 banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Supply | Supplies 1.35–3.3V to Bank 0 I/Os; must be decoupled locally for signal integrity |
| VRP_1 / VRN_1 | Reference Voltage Pair | Provides termination reference for differential standards (e.g., LVDS) in Bank 1 |
| M0–M2 | Mode Configuration | Set boot mode (SPI/JTAG) at power-up; tied high/low during reset assertion |
| CCLK | Configuration Clock | Drives internal configuration logic during Master SPI programming; externally generated |
| INIT_B | Configuration Status | Active-low open-drain output indicating bitstream load readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MMCM/PLL | Six MMCMs and twelve PLLs enable precise clock domain crossing and jitter reduction for multi-sensor sync |
| SEU Mitigation | Configurable CRC checking and single-event upset correction protect configuration memory in radiation-prone environments |
| Partial Reconfiguration | Allows dynamic logic module swapping without full system reset-critical for adaptive industrial protocols |
| UltraScale-compatible Toolflow | Supports Vivado 2022.2+ with consistent IP integration and timing closure methodology across Xilinx/AMD families |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time current/voltage sampling and PWM generation for servo drives in CNC machinery. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID control with sub-µs latency; MMCMs synchronize ADC sampling and gate driver timing. Use Value: Enables deterministic jitter < 50 ps across 16 PWM channels, meeting IEC 61800-3 EMC requirements. | Use Scenario: On-camera Bayer demosaicing, histogram equalization, and ROI cropping before JPEG encoding. IC Role / Device Role / Timing Role: Configurable logic processes pixel streams at 120 MP/s; block RAM buffers two full HD frames. Use Value: Reduces host CPU load by 70% and eliminates external frame buffer ICs in compact vision modules. |
| Real-Time Protocol Bridging | Condition Monitoring Edge Node |
Use Scenario: Converting EtherCAT slave frames to CAN FD messages for legacy actuator networks. IC Role / Device Role / Timing Role: Dual-port BRAM handles protocol translation; DSP slices perform CRC recalculation and timestamp alignment. Use Value: Achieves < 2 µs bridge latency with hardware-timed synchronization to master clock domain. | Use Scenario: Vibration spectral analysis using FFT on accelerometer data streams from rotating equipment. IC Role / Device Role / Timing Role: FPGA implements streaming 1024-point FFT with 24-bit precision; DSP slices execute butterfly stages in pipeline. Use Value: Delivers 20 kHz real-time spectrum updates with < 100 ms end-to-end latency including analog front-end interfacing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based industrial control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | Higher logic density (356K LC), Kintex UltraScale architecture, 16 nm process, no industrial temp grade | Targeted at high-throughput data acquisition; requires active cooling and higher power budget | Select only if >200K logic cells and PCIe Gen3 interface are required; not drop-in compatible |
| XC7A75T-2FGG676I | Artix-7 family, same 676-pin FGG package, but lower logic count (74K LC), fewer DSP slices (180), and no SEU mitigation | Cost-optimized for non-safety-critical automation; lacks ECC for configuration memory | Consider when thermal envelope is tighter and radiation tolerance is not required |
Compared with XC7S75-L1FGGA676I, the XCKU035 demands more board area and power delivery headroom, while the XC7A75T trades industrial reliability for lower BOM cost-making XC7S75-L1FGGA676I optimal for sealed, fanless industrial edge nodes requiring long-term stability.
Availability
XC7S75-L1FGGA676I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and real-time protocol bridging requiring stable component supply across extended product lifecycles.
Supply support for XC7S75-L1FGGA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Spartan-7 family targets cost-sensitive, thermally constrained industrial and automotive applications where reliability, small form factor, and low static power are prioritized over peak throughput.
FAQ
What is the maximum supported I/O standard voltage for XC7S75-L1FGGA676I?
XC7S75-L1FGGA676I supports I/O voltages from 1.2V to 3.3V across its 12 configurable banks. Each bank's VCCO can be independently set, enabling mixed-voltage interfaces-for example, 1.8V for MIPI CSI-2 receivers and 3.3V for industrial digital I/O-all within a single XC7S75-L1FGGA676I device.
Does XC7S75-L1FGGA676I support bitstream encryption?
Yes, XC7S75-L1FGGA676I includes AES-256 bitstream encryption with HMAC authentication. This feature secures configuration data against cloning or tampering and is enabled via eFUSE programming during manufacturing-ensuring that each deployed XC7S75-L1FGGA676I maintains unique cryptographic identity.
What thermal management is recommended for XC7S75-L1FGGA676I in industrial enclosures?
XC7S75-L1FGGA676I is rated for –40°C to +100°C junction temperature and designed for convection-only cooling. Recommended practice includes 2 oz copper PCB layers, thermal vias under the die, and a 25 mm × 25 mm thermal pad on the bottom side; no heatsink is required below 1.8 W typical power dissipation.
Can XC7S75-L1FGGA676I implement a dual-core RISC-V soft processor?
Yes, XC7S75-L1FGGA676I contains sufficient LUTs and block RAM to implement two independent 32-bit RISC-V cores (e.g., PicoRV32) with local instruction/data caches. The 74,694 logic cells allow concurrent execution, timer peripherals, and UART interfaces-enabling XC7S75-L1FGGA676I to serve as a dual-application controller in safety-diverse architectures.
Is partial reconfiguration supported on XC7S75-L1FGGA676I without external configuration memory?
Yes, XC7S75-L1FGGA676I supports internal partial reconfiguration using on-chip configuration access port (CAP) and ICAP interface. Bitstream segments can be loaded from internal BRAM or external QSPI flash-eliminating need for dedicated configuration PROMs and enabling XC7S75-L1FGGA676I to dynamically adapt logic for changing fieldbus protocols.
XC7S75-L1FGGA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6000
- Number of Logic Elements/Cells:
- 76800
- Total RAM Bits:
- 4331520
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.92V ~ 0.98V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S75-L1FGGA676I FAQ
1.How can I place an order for XC7S75-L1FGGA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S75-L1FGGA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S75-L1FGGA676I reliable?
The price and inventory of XC7S75-L1FGGA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S75-L1FGGA676I is usually 5 days.
3.What payment methods are accepted for XC7S75-L1FGGA676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S75-L1FGGA676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S75-L1FGGA676I?
XC7S75-L1FGGA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S75-L1FGGA676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S75-L1FGGA676I?
For technical support, including XC7S75-L1FGGA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S75-L1FGGA676I requirements.
6.How does Aetrix verify that XC7S75-L1FGGA676I is sourced from the original manufacturer or authorized distributors?
All XC7S75-L1FGGA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S75-L1FGGA676I meets industry standards.
7.What is the process for return or replacement of XC7S75-L1FGGA676I?
All XC7S75-L1FGGA676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S75-L1FGGA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S75-L1FGGA676I part is unused and in its original packaging.
Return procedure for XC7S75-L1FGGA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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