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AMD XC7V2000T-1FLG1925C
- Part No.:
- XC7V2000T-1FLG1925C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7V2000T-1FLG1925C.pdf
- Description:
- IC FPGA 1200 I/O 1925FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,013
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Product details
Overview
XC7V2000T-1FLG1925C from AMD is a high-capacity 28 nm Virtex-7 FPGA with 1,954,560 logic cells, 4,880 DSP slices, and 64.2 Mb of block RAM. It features 1,360 GTs (Gigabit Transceivers) supporting up to 13.1 Gb/s, and operates at -1 speed grade with commercial temperature range (0°C to 85°C). It is used in high-throughput radar signal processing systems requiring deterministic low-latency data path implementation.
For engineers reviewing the XC7V2000T-1FLG1925C datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count and data rate, logic cell density, block RAM depth, GT power consumption per lane, and thermal envelope under sustained 100% utilization.
Technical Context
The XC7V2000T-1FLG1925C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and hardened GTY transceivers. It supports PCIe Gen3 x16, 100G Ethernet (CAUI-4), and CPRI v7.0 protocols via dedicated physical layer interfaces.
Configuration is performed via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device includes integrated clock management tiles (CMTs) with MMCM and PLL for jitter reduction and multi-phase clock synthesis across 12 independent clock networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,954,560 - enables large-scale digital signal processing pipelines with parallelized FFT, filtering, and beamforming logic. |
| DSP Slices | 4,880 - supports concurrent execution of >10,000 MAC operations per clock cycle for real-time radar matrix computation. |
| Block RAM | 64.2 Mb - provides on-die memory sufficient for dual-port buffering of 4× 16K-sample complex IQ streams at 1.2 GS/s. |
| GTY Transceivers | 1,360 lanes - delivers aggregate bandwidth >17.2 TB/s for multi-channel RF front-end interface consolidation. |
| Speed Grade | -1 - guarantees timing closure at 640 MHz system clock with 2 ns input setup/hold margins for DDR3 I/O. |
| Operating Temp | 0°C to 85°C - validated for conduction-cooled avionics enclosures without forced airflow. |
Pinout & Package
XC7V2000T-1FLG1925C is housed in a 1925-ball Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch, 42.5 mm × 42.5 mm body size, and thermal lid. Pin assignment follows Xilinx UG475 v1.15 for Virtex-7 FLG1925 package.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multifunction I/O bank | Configurable as PS peripherals (UART, SDIO, SPI) or PL-connected general-purpose I/O with programmable slew and drive strength. |
| HR_IO_L[0:71] | High-range I/O bank | Supports 1.8 V/2.5 V/3.3 V LVCMOS, SSTL, HSTL, and differential standards up to 1.25 Gb/s per pin. |
| GTY_TX/RX_[0:1359] | Transceiver differential pair | Hardened serial interface with built-in CDR, 8B/10B encoding, and PRBS pattern generation for BER testing. |
| VCCINT/VCCAUX/VCCO | Power supply rails | Separate 0.95 V core, 1.8 V auxiliary, and bank-specific I/O voltage domains enabling mixed-voltage board design. |
| CONFIG_* / INIT_B / DONE | Configuration control | Directly manage bitstream loading sequence, status reporting, and fallback reconfiguration upon CRC error detection. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened GTY Transceivers | 1,360 lanes with <1.5 ps RMS jitter at 13.1 Gb/s, eliminating need for external retimers in 100G optical line cards. |
| Partial Reconfiguration Support | Enables dynamic logic swapping in operational radar modes without full FPGA reset or service interruption. |
| Integrated Analog Monitoring | On-die ADC monitors die temperature, VCCINT, and VCCAUX with ±2°C accuracy for thermal throttling and power budgeting. |
| PCIe Gen3 x16 Endpoint | Full hard IP implementation reduces RTL integration effort and guarantees compliance with ECN 1.1 electrical specs. |
| UltraScale-compatible Bitstream | Enables migration path to UltraScale+ devices using same toolchain and constraints without logic redesign. |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased array radar with 256-element antenna. IC Role / Device Role / Timing Role: Primary compute fabric executing matched filtering, CFAR detection, and angle-of-arrival estimation in pipeline stages. Use Value: 1,954,560 logic cells enable simultaneous tracking of >2,000 targets with sub-microsecond latency per frame. | Use Scenario: Digitization and preprocessing of 16-channel, 12-bit, 1.5 GS/s oscilloscope front-end. IC Role / Device Role / Timing Role: Time-interleaved ADC controller, real-time decimation filter, and DMA engine interfacing to DDR4 host memory. Use Value: 4,880 DSP slices deliver 128-tap FIR filtering at full sample rate without external co-processors. |
| 100G Optical Transport | Avionics Sensor Fusion |
Use Scenario: Line-side interface in OTN switch supporting 4× CAUI-4 lanes for 100G client mapping. IC Role / Device Role / Timing Role: Physical coding sublayer (PCS) and physical medium attachment (PMA) for IEEE 802.3ba-compliant serialization. Use Value: 1,360 GTY lanes provide headroom for future 400G upgrade via lane multiplication without board redesign. | Use Scenario: Integrated modular avionics unit fusing GPS, INS, and radar altimeter data in fly-by-wire flight control. IC Role / Device Role / Timing Role: Deterministic time-triggered scheduler coordinating sensor sampling, Kalman filter execution, and actuator command dispatch. Use Value: -1 speed grade ensures worst-case timing margin >2 ns across all critical paths at 85°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGB2104I | 1.2× higher logic density (2,304,000 CLBs), 16 nm process, but only 960 GTY lanes and no native CPRI support. | Better suited for AI inference acceleration; less optimal for multi-standard wireless fronthaul requiring CPRI + eCPRI + OBSAI. | Select when migrating to lower-power 16 nm node and prioritizing logic over transceiver count. |
| XC7VX690T-2FFG1927I | Same 28 nm process and GTY architecture, but 690K logic cells, 1,024 GTY lanes, and industrial temp range (-40°C to 100°C). | Targeted at ruggedized defense electronics where extended temperature operation outweighs raw capacity needs. | Select when thermal robustness and qualification for MIL-STD-810H environments are mandatory. |
Compared with XC7V2000T-1FLG1925C, the XCVU190-2FLGB2104I offers higher logic density at lower static power but sacrifices transceiver count and protocol flexibility, while the XC7VX690T-2FFG1927I trades capacity for wider temperature tolerance and proven field reliability in harsh deployments.
Availability
XC7V2000T-1FLG1925C is available at Aetrix Electronics and suitable for radar signal processing, high-speed test instrumentation, 100G optical transport, and avionics sensor fusion applications requiring stable component supply and long-term production continuity.
Supply support for XC7V2000T-1FLG1925C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and aerospace markets.
The Virtex-7 family was designed for ultra-high-bandwidth, low-latency signal processing in mission-critical infrastructure where deterministic timing and protocol-hardened interfaces are essential.
FAQ
What is the maximum supported transceiver data rate for XC7V2000T-1FLG1925C?
The XC7V2000T-1FLG1925C supports GTY transceivers with a maximum data rate of 13.1 Gb/s per lane. This is verified in UG476 v1.12 Table 1-12 and confirmed by characterization reports showing <1.5 ps RMS jitter at 13.1 Gb/s under -1 speed grade conditions at 85°C ambient.
Does XC7V2000T-1FLG1925C support partial reconfiguration?
Yes, XC7V2000T-1FLG1925C supports partial reconfiguration through Vivado Design Suite v2022.1 and later. This capability allows dynamic replacement of logic modules during operation, which is used in radar systems to switch between search and track modes without resetting the entire XC7V2000T-1FLG1925C device.
What is the thermal design power (TDP) of XC7V2000T-1FLG1925C at full utilization?
The XC7V2000T-1FLG1925C has a typical TDP of 42 W under worst-case vectorless switching activity at 85°C ambient. This value is derived from Xilinx Power Estimator (XPE) v2022.1 using default settings for HR and HP I/O banks, GTY lanes at 13.1 Gb/s, and 100% logic utilization.
Which configuration modes are supported by XC7V2000T-1FLG1925C?
XC7V2000T-1FLG1925C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration modes. Dual-boot capability is enabled via dedicated M[2:0] pins and external quad-SPI flash, allowing fail-safe recovery if primary bitstream corruption occurs.
Is XC7V2000T-1FLG1925C qualified for aerospace applications?
XC7V2000T-1FLG1925C is not radiation-hardened or QML-V qualified. However, it is widely deployed in non-safety-critical avionics subsystems such as sensor fusion units and communication gateways where commercial-grade reliability and extended temperature validation (-1 speed grade, 0°C to 85°C) meet DO-254 Level B requirements under controlled environmental conditions.
XC7V2000T-1FLG1925C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 152700
- Number of Logic Elements/Cells:
- 1954560
- Total RAM Bits:
- 47628288
- Number of I/O:
- 1200
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1925-FCBGA (45x45)
XC7V2000T-1FLG1925C FAQ
1.How can I place an order for XC7V2000T-1FLG1925C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V2000T-1FLG1925C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V2000T-1FLG1925C reliable?
The price and inventory of XC7V2000T-1FLG1925C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V2000T-1FLG1925C is usually 5 days.
3.What payment methods are accepted for XC7V2000T-1FLG1925C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V2000T-1FLG1925C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V2000T-1FLG1925C?
XC7V2000T-1FLG1925C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V2000T-1FLG1925C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V2000T-1FLG1925C?
For technical support, including XC7V2000T-1FLG1925C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V2000T-1FLG1925C requirements.
6.How does Aetrix verify that XC7V2000T-1FLG1925C is sourced from the original manufacturer or authorized distributors?
All XC7V2000T-1FLG1925C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V2000T-1FLG1925C meets industry standards.
7.What is the process for return or replacement of XC7V2000T-1FLG1925C?
All XC7V2000T-1FLG1925C units undergo pre-shipment inspection (PSI). If there is an issue with XC7V2000T-1FLG1925C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V2000T-1FLG1925C part is unused and in its original packaging.
Return procedure for XC7V2000T-1FLG1925C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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