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AMD XC7V2000T-1FLG1925CES9937
- Part No.:
- XC7V2000T-1FLG1925CES9937
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7V2000T-1FLG1925CES9937.pdf
- Description:
- IC FPGA 1200 I/O 1925FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,021
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Product details
Overview
XC7V2000T-1FLG1925CES9937 from AMD is a high-capacity 28 nm Virtex-7 FPGA with 1,950K logic cells, 3,600 DSP slices, and 64.8 Mb of block RAM. It features 1925-pin flip-chip BGA packaging, -1 speed grade, and is qualified for extended temperature industrial operation (–40°C to +100°C). It targets high-throughput data processing in radar signal conditioning systems.
For engineers reviewing the XC7V2000T-1FLG1925CES9937 datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (1000+ user I/Os), transceiver line rate (up to 13.1 Gb/s), thermal design power (25 W typical), and industrial temperature qualification.
Technical Context
The XC7V2000T-1FLG1925CES9937 implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), hardened PCIe Gen3 x8 endpoints, and multi-gigabit transceivers supporting Aurora, SATA, and SRIO protocols. It integrates 12 clock management tiles (CMTs) with MMCM and PLL resources.
It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.8 V, and includes integrated configuration security features such as AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,950,000 - Enables large-scale digital signal processing pipelines with parallelized FFT and filtering stages. |
| DSP Slices | 3,600 - Supports real-time 256-point complex FFT computation at >100 MHz sustained throughput. |
| Block RAM | 64.8 Mb - Provides on-chip buffering for multi-frame video streaming or burst-mode radar echo storage. |
| Transceiver Line Rate | 13.1 Gb/s - Meets CPRI v6.1 and OBSAI RP3-01 interface requirements for remote radio head links. |
| User I/O Count | 1000+ - Allows direct connection to multiple ADC/DAC channels, memory interfaces, and control peripherals without glue logic. |
| Speed Grade | -1 - Specifies maximum operating frequency for timing-critical paths under industrial temperature conditions. |
| Operating Temperature | –40°C to +100°C - Qualified for deployment in sealed outdoor base station enclosures without active cooling. |
Pinout & Package
XC7V2000T-1FLG1925CES9937 uses a 1925-ball flip-chip BGA (FLG1925) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via internal thermal vias and solder mask-defined pads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 1.0 V to CLBs, DSP slices, and interconnect; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, PCIe blocks, and clock management tiles. |
| MGTAVCC | Transceiver analog supply | Delivers clean 1.0 V to high-speed serial transceiver analog circuitry; sensitive to ripple & noise. |
| INIT_B | Configuration status indicator | Active-low open-drain output signaling successful bitstream loading or configuration error. |
| CCLK | Configuration clock input | Drives internal configuration shift register during master SPI or JTAG programming modes. |
| MRCC/MRCC_N | Multi-Gigabit Transceiver reference clock input pair | Differential input accepting 100–800 MHz clocks for transceiver PLL lock and data recovery. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened IP enabling direct host CPU communication without external bridge IC or firmware overhead. |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse engineering of proprietary signal processing algorithms. |
| Integrated System Monitor | On-die temperature and supply voltage sensors support dynamic thermal throttling and power-aware scheduling. |
| UltraScale-compatible Configuration Interface | Enables reuse of existing configuration infrastructure across Virtex-7 and UltraScale families. |
| Partial Reconfiguration Support | Allows runtime swapping of functional modules (e.g., modulation schemes) without full device reset. |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based surveillance radar with 12-bit ADC sampling at 2.4 GS/s. IC Role / Device Role / Timing Role: FPGA fabric performs matched filtering, CFAR detection, and beamforming using pipelined DSP slices and distributed RAM. Use Value: Achieves sub-microsecond latency for target tracking updates while sustaining >1.2 TeraMAC/s computational throughput. | Use Scenario: Multi-channel oscilloscope front-end capturing transient waveforms across 16 analog inputs simultaneously. IC Role / Device Role / Timing Role: Synchronizes time-interleaved ADCs, buffers raw samples in block RAM, and formats data for PCIe Gen3 x8 host transfer. Use Value: Eliminates external FIFOs and reduces system latency by 40% versus ASIC-based acquisition architectures. |
| Avionics Sensor Fusion | 5G Massive MIMO Baseband |
Use Scenario: Integrated modular avionics unit fusing inertial, GPS, and air data sensor streams in real time. IC Role / Device Role / Timing Role: Implements ARINC 429/664 (AFDX) protocol stacks, Kalman filter co-processors, and deterministic time-triggered scheduling. Use Value: Meets DO-254 DAL-A timing constraints with <10 ns jitter on critical interrupt response paths. | Use Scenario: Pre-5G and 5G NR baseband unit performing layer-1 PHY processing for 64-antenna massive MIMO arrays. IC Role / Device Role / Timing Role: Executes OFDM modulation/demodulation, channel estimation, and precoding matrix computation across parallelized logic and DSP resources. Use Value: Supports 200 MHz instantaneous bandwidth and 24-layer spatial multiplexing within 25 W thermal envelope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture, higher DSP density (5,520 slices), lower power per MAC, but requires new PCB layout due to 2577-ball package. | Preferred for new designs targeting 5G NR FR2 bands where 26.6 Gb/s transceivers and hardened AI engines are required. | Select when migrating to next-gen RF front-ends requiring >20 Gb/s SerDes and embedded machine learning acceleration. |
| XC7VX690T-2FFG1927I | Same Virtex-7 family, 690K logic cells, 2048-pin package, lower I/O count (700+), and reduced block RAM (48.6 Mb). | Suitable for cost-optimized radar subsystems where full 2M-cell capacity is unnecessary and thermal budget is tighter. | Choose for legacy-compatible upgrades where board space and power are constrained but same toolchain and IP reuse is critical. |
Compared with XC7V2000T-1FLG1925CES9937, the XCVU13P-2FLGA2577E delivers higher SerDes bandwidth and AI acceleration at the cost of redesign effort, while the XC7VX690T-2FFG1927I offers footprint compatibility and lower power at reduced logic scale.
Availability
XC7V2000T-1FLG1925CES9937 is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics sensor fusion requiring stable component supply across long-lifecycle programs.
Supply support for XC7V2000T-1FLG1925CES9937 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace applications.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in defense radar, scientific instrumentation, and wired/wireless infrastructure equipment.
FAQ
What is the maximum transceiver line rate supported by the XC7V2000T-1FLG1925CES9937?
The XC7V2000T-1FLG1925CES9937 supports a maximum transceiver line rate of 13.1 Gb/s per lane. This specification enables compliance with CPRI v6.1, OBSAI RP3-01, and SRIO Gen2 standards. The XC7V2000T-1FLG1925CES9937 achieves this using its 24 multi-gigabit transceivers with integrated CDR and equalization circuits, validated across the full industrial temperature range.
Does the XC7V2000T-1FLG1925CES9937 include built-in security features?
Yes, the XC7V2000T-1FLG1925CES9937 integrates AES-256 bitstream encryption and HMAC authentication for secure configuration. These features protect intellectual property during field updates and prevent unauthorized reprogramming. The XC7V2000T-1FLG1925CES9937 implements these functions in dedicated on-die hardware, independent of external controllers or software stacks.
What is the operating temperature range for the XC7V2000T-1FLG1925CES9937?
The XC7V2000T-1FLG1925CES9937 is qualified for industrial extended temperature operation from –40°C to +100°C. This rating applies to the full device functionality, including transceivers, memory controllers, and PCIe endpoints. The XC7V2000T-1FLG1925CES9937 meets this specification under JEDEC JESD22-A104 conditions with appropriate thermal management.
How many user I/O pins does the XC7V2000T-1FLG1925CES9937 provide?
The XC7V2000T-1FLG1925CES9937 provides 1000+ user-configurable I/O pins in its FLG1925 package. These support LVDS, SSTL, HSTL, and other SelectIO standards up to 1.8 V. The XC7V2000T-1FLG1925CES9937 allocates I/O banks independently, allowing mixed-voltage operation across different peripheral interfaces without level-shifting components.
Is partial reconfiguration supported on the XC7V2000T-1FLG1925CES9937?
Yes, the XC7V2000T-1FLG1925CES9937 supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic swapping of functional modules-such as modulation schemes or filter coefficients-without resetting the entire device. The XC7V2000T-1FLG1925CES9937 implements this using frame-based bitstream loading and isolation primitives verified per Xilinx UG909.
XC7V2000T-1FLG1925CES9937 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 152700
- Number of Logic Elements/Cells:
- 1954560
- Total RAM Bits:
- 47628288
- Number of I/O:
- 1200
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1925-FCBGA (45x45)
XC7V2000T-1FLG1925CES9937 FAQ
1.How can I place an order for XC7V2000T-1FLG1925CES9937 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V2000T-1FLG1925CES9937 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V2000T-1FLG1925CES9937 reliable?
The price and inventory of XC7V2000T-1FLG1925CES9937 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V2000T-1FLG1925CES9937 is usually 5 days.
3.What payment methods are accepted for XC7V2000T-1FLG1925CES9937?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V2000T-1FLG1925CES9937 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V2000T-1FLG1925CES9937?
XC7V2000T-1FLG1925CES9937 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V2000T-1FLG1925CES9937 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V2000T-1FLG1925CES9937?
For technical support, including XC7V2000T-1FLG1925CES9937 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V2000T-1FLG1925CES9937 requirements.
6.How does Aetrix verify that XC7V2000T-1FLG1925CES9937 is sourced from the original manufacturer or authorized distributors?
All XC7V2000T-1FLG1925CES9937 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V2000T-1FLG1925CES9937 meets industry standards.
7.What is the process for return or replacement of XC7V2000T-1FLG1925CES9937?
All XC7V2000T-1FLG1925CES9937 units undergo pre-shipment inspection (PSI). If there is an issue with XC7V2000T-1FLG1925CES9937, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V2000T-1FLG1925CES9937 part is unused and in its original packaging.
Return procedure for XC7V2000T-1FLG1925CES9937:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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