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AMD XC7V2000T-2FHG1761C
- Part No.:
- XC7V2000T-2FHG1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7V2000T-2FHG1761C.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,732
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Product details
Overview
XC7V2000T-2FHG1761C from AMD is a high-capacity 28 nm Virtex-7 FPGA with 1,954,560 logic cells, 3,995 DSP slices, and 60.8 MB of block RAM. It supports transceiver line rates up to 13.1 Gb/s and operates at -2 speed grade (1.2 V core, industrial temperature range). It is used in high-throughput radar signal processing systems requiring deterministic low-latency data path implementation.
For engineers reviewing the XC7V2000T-2FHG1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (80 GTs), I/O bank voltage support (1.2/1.35/1.5/1.8/2.5/3.3 V), and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XC7V2000T-2FHG1761C implements a segmented architecture with 24 clock management tiles (CMTs), each containing a PLL and MMCM, enabling independent clock domain synthesis and jitter attenuation. It integrates 80 multi-protocol GT transceivers supporting PCIe Gen3, SRIO 2.1, and CPRI.
Configuration is performed via dual-boot capable 32-bit parallel SelectMAP or quad-SPI x4 mode, with AES-256 bitstream encryption and HMAC authentication. The device uses High-Performance (HP) and High-Density (HD) I/O banks with programmable slew rate and drive strength per pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,954,560 - determines maximum combinational and sequential logic capacity for complex RTL implementations |
| DSP Slices | 3,995 - enables concurrent execution of >3,900 multiply-accumulate operations per clock cycle |
| Block RAM | 60.8 MB - supports large on-chip buffering for video frame stores or packet reassembly buffers |
| GT Transceivers | 80 × 13.1 Gb/s - provides native interfaces for 100G Ethernet (4×25G), CPRI Option 10, or 8× PCIe Gen3 lanes |
| I/O Pins | 700 - supports high-pin-count parallel buses, DDR3/DDR4 memory interfaces, and multi-lane serial protocols |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply with operation up to 100°C junction temperature |
| Configuration Interface | Quad-SPI x4 / SelectMAP / JTAG - enables secure, field-upgradable bitstream loading with fallback capability |
Pinout & Package
XC7V2000T-2FHG1761C is housed in a 1761-ball Fine-Pitch Flip-Chip BGA (F-HBGA) package with 0.8 mm ball pitch, thermal lid, and standard JEDEC MO-271AC mechanical outline. Ball map includes dedicated configuration, JTAG, GT reference clocks, and HP/HD I/O banks distributed across four sides.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master SPI or SelectMAP programming |
| DIN | Serial Configuration Data Input | Accepts encrypted bitstream in quad-SPI x4 mode with 4-bit wide data bus |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low signal that clears configuration memory and restarts boot sequence |
| GTREFCLK0 | Transceiver Reference Clock Input | Provides low-jitter 100–800 MHz reference for adjacent GT transceiver quads |
| VCCINT | Core Power Supply | Supplies 1.2 V ±3% to FPGA fabric and CLBs; requires tight regulation and local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale-compatible architecture | Enables migration path to UltraScale+ devices while retaining toolchain compatibility with Vivado 2018.2+ |
| AES-256 + HMAC security | Prevents unauthorized bitstream cloning and ensures integrity verification before configuration load |
| Dual-boot configuration | Supports fail-safe field updates by storing primary and backup bitstreams in external flash |
| Multi-voltage I/O banks | Allows direct interfacing to 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without level shifters |
| Transceiver protocol hard IP | Integrates native PCIe Gen3, SRIO 2.1, and CPRI physical layer blocks reducing RTL integration effort |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric implements time-critical FFT, CFAR, and STAP algorithms; GT transceivers handle ADC/DAC data streaming at 5–12 Gb/s. Use Value: Deterministic latency under 200 ns and 80 GT lanes enable simultaneous multi-channel RF sampling and digital down-conversion. | Use Scenario: Automated test equipment for high-speed SerDes compliance validation (PCIe, USB3.2, SATA). IC Role / Device Role / Timing Role: Generates and analyzes PRBS patterns, performs eye diagram measurement, and executes protocol-aware packet injection. Use Value: On-chip 13.1 Gb/s GTs and 3,995 DSP slices allow real-time jitter tolerance analysis and BER calculation without external digitizers. |
| 5G Wireless Baseband | Medical Imaging Acceleration |
Use Scenario: Massive MIMO baseband processing in macrocell and small-cell 5G NR infrastructure. IC Role / Device Role / Timing Role: Implements Layer 1 PHY functions including channel coding (LDPC/Polar), OFDM modulation, and precoding matrix computation. Use Value: 60.8 MB block RAM supports multi-sector channel estimation buffers; 1,954K logic cells host parallel FFT engines for 200+ subcarriers. | Use Scenario: Real-time reconstruction pipeline for CT and MRI scanners using iterative algorithms (e.g., SART, MBIR). IC Role / Device Role / Timing Role: Accelerates back-projection and forward projection kernels; interfaces to high-bandwidth DDR4 memory subsystems and GPU co-processors. Use Value: 700 I/O pins enable direct connection to 32-bit DDR4-2400 controllers; 3,995 DSP slices deliver >2.1 TFLOPS peak compute for voxel-wise computation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 16 nm UltraScale+ architecture; 1,182,240 LUTs; 5,520 DSP slices; 58.8 MB BRAM; 128 GTY transceivers up to 32.75 Gb/s | Higher transceiver bandwidth and lower power per DSP slice; lacks native CPRI hard IP | Preferred for new 400G Ethernet or CXL-based designs where process node advantage and higher GTY density outweigh legacy IP reuse needs |
| XC7VX690T-2FFG1927C | Same 28 nm Virtex-7 family; 693,120 logic cells; 3,600 DSP slices; 42.5 MB BRAM; 60 GT transceivers | Lower capacity and I/O count; identical GT protocol support and configuration security features | Suitable for cost-optimized radar front-end or mid-tier test equipment where full XC7V2000T resources are unused |
Compared with XC7V2000T-2FHG1761C, the XCVU13P offers superior transceiver bandwidth and power efficiency but requires toolchain and IP migration, while the XC7VX690T delivers identical architectural compatibility at reduced scale-enabling reuse of verified PCIe/CPRI subsystems without redesign.
Availability
XC7V2000T-2FHG1761C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-speed test instrumentation requiring stable component supply over extended production lifecycles.
Supply support for XC7V2000T-2FHG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, graphics, and AI acceleration technologies.
The Virtex-7 family was designed for high-performance signal processing, high-bandwidth interconnect, and deterministic real-time computing in defense, aerospace, and wired/wireless infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7V2000T-2FHG1761C?
The XC7V2000T-2FHG1761C supports GT transceivers operating at up to 13.1 Gb/s. This line rate enables compliance with PCIe Gen3 (8 GT/s encoded), CPRI Option 10 (10.1376 Gb/s), and 25G Ethernet KR/KP physical layers. Performance is guaranteed under industrial temperature conditions (-40°C to +100°C) at speed grade -2.
Does XC7V2000T-2FHG1761C support AES-256 bitstream encryption?
Yes, XC7V2000T-2FHG1761C includes hardware-accelerated AES-256 encryption and HMAC-SHA-256 authentication for bitstream confidentiality and integrity. The encryption engine operates during configuration loading from external flash, and keys are stored in on-chip eFUSE memory. This feature is active in all configuration modes including quad-SPI x4 and SelectMAP.
What I/O standards are supported by XC7V2000T-2FHG1761C?
XC7V2000T-2FHG1761C supports LVCMOS, LVDS, BLVDS, RSDS, TMDS, HSTL, SSTL, Differential Signaling, and MIPI D-PHY across its HP and HD I/O banks. Voltage levels include 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V. Each bank is independently configurable, allowing mixed-voltage interfaces on a single device.
Is XC7V2000T-2FHG1761C pin-compatible with other Virtex-7 devices?
No, XC7V2000T-2FHG1761C is not pin-compatible with other Virtex-7 FPGAs due to its unique 1761-ball F-HBGA package and I/O bank allocation. Pinouts differ significantly from 1156-ball (e.g., XC7VX690T) or 1927-ball (e.g., XC7VX980T) variants. Migration requires PCB redesign and I/O constraint revalidation.
What configuration modes does XC7V2000T-2FHG1761C support?
XC7V2000T-2FHG1761C supports three primary configuration modes: master quad-SPI x4 (with 4-bit data bus), slave SelectMAP (32-bit parallel), and JTAG boundary-scan. Dual-boot capability allows storage and selection between two independent bitstreams in external flash memory, enabling robust field updates and fail-safe recovery.
XC7V2000T-2FHG1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 152700
- Number of Logic Elements/Cells:
- 1954560
- Total RAM Bits:
- 47628288
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (45x45)
XC7V2000T-2FHG1761C FAQ
1.How can I place an order for XC7V2000T-2FHG1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V2000T-2FHG1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V2000T-2FHG1761C reliable?
The price and inventory of XC7V2000T-2FHG1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V2000T-2FHG1761C is usually 5 days.
3.What payment methods are accepted for XC7V2000T-2FHG1761C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V2000T-2FHG1761C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V2000T-2FHG1761C?
XC7V2000T-2FHG1761C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V2000T-2FHG1761C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V2000T-2FHG1761C?
For technical support, including XC7V2000T-2FHG1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V2000T-2FHG1761C requirements.
6.How does Aetrix verify that XC7V2000T-2FHG1761C is sourced from the original manufacturer or authorized distributors?
All XC7V2000T-2FHG1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V2000T-2FHG1761C meets industry standards.
7.What is the process for return or replacement of XC7V2000T-2FHG1761C?
All XC7V2000T-2FHG1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7V2000T-2FHG1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V2000T-2FHG1761C part is unused and in its original packaging.
Return procedure for XC7V2000T-2FHG1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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