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AMD XC7V2000T-2FLG1925C
- Part No.:
- XC7V2000T-2FLG1925C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7V2000T-2FLG1925C.pdf
- Description:
- IC FPGA 1200 I/O 1925FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,339
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Product details
Overview
XC7V2000T-2FLG1925C from AMD is a high-capacity Virtex-7 FPGA featuring 1,954,560 logic cells, 3,600 DSP slices, and 60.8 MB of block RAM. It supports transceiver line rates up to 13.1 Gbps and operates at -2 speed grade with industrial temperature range (0°C to 85°C). It is deployed in high-throughput radar signal processing systems requiring deterministic low-latency data path acceleration.
For engineers reviewing the XC7V2000T-2FLG1925C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (72 GTs), I/O voltage support (1.2 V to 3.3 V), configuration interface (JTAG/SelectMAP), and thermal design power (49.5 W typical).
Technical Context
The XC7V2000T-2FLG1925C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x8, 10 Gigabit Ethernet MAC, and AXI interconnect. It integrates 72 multi-protocol GT transceivers supporting protocols including CPRI, SRIO, and 10GBASE-R.
Configuration is performed via Master SPI or SelectMAP mode using external flash or processor-controlled parallel interface. The device uses 28 nm HKMG process technology and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,954,560 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 3,600 - dedicated arithmetic units supporting 25×18-bit multiply-accumulate per slice |
| Block RAM | 60.8 MB - distributed memory capacity usable as FIFOs, buffers, or lookup tables |
| GT Transceivers | 72 × 13.1 Gbps - serial I/O lanes supporting CPRI, SRIO, and 10GBASE-R protocols |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage interfaces from 1.2 V to 3.3 V |
| Thermal Design Power | 49.5 W (typical) - defines heatsink and airflow requirements for sustained operation |
| Speed Grade | -2 - guarantees timing closure at specified maximum clock frequencies across industrial temp range |
Pinout & Package
The XC7V2000T-2FLG1925C is housed in a 1925-ball Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch and standard JEDEC MO-271AC footprint. Thermal pad on underside requires solder paste stencil opening and ground plane connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable bank-shared pins supporting PS peripherals including SDIO, UART, SPI, and I2C |
| HR[0:167] | High-Range I/O | 1.2–3.3 V tolerant banks with programmable slew rate and drive strength |
| HP[0:215] | High-Performance I/O | 1.2–1.8 V optimized banks for DDR3/DDR4 memory interface timing compliance |
| GTGREFCLK[0:3] | Transceiver Reference Clock | Dedicated differential inputs for GT transceiver PLL reference clocks |
| CONFIG_MODE[0:2] | Configuration Mode Select | Three-pin strap defining boot source: JTAG, Master SPI, or SelectMAP |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate supplies for core logic (0.95 V), auxiliary circuitry (1.8 V), and I/O banks (1.2–3.3 V) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Integrated endpoint/root complex controller eliminating soft-core resource usage and latency overhead |
| Partial Reconfiguration Support | Enables runtime logic module swapping without full device reboot or system interruption |
| AXI Interconnect Fabric | Scalable on-chip bus infrastructure supporting concurrent master-slave transactions across PS/PL boundaries |
| UltraScale+ Compatible Configuration | Uses same bitstream format and tools flow as later UltraScale families, easing migration paths |
| Industrial Temperature Range | Validated operation from 0°C to +85°C ambient, suitable for non-automotive harsh environments |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; GT transceivers interface directly to ADC/DAC JESD204B links. Use Value: 72 GT lanes enable simultaneous multi-channel JESD204B v1.1 capture at 12.5 Gbps per lane, reducing front-end interface complexity. | Use Scenario: Multi-sensor synchronized sampling in test instrumentation with sub-nanosecond timestamp alignment. IC Role / Device Role / Timing Role: Central timing and control hub coordinating 32-channel ADCs via deterministic delay-locked loops and programmable I/O delays. Use Value: HP I/O banks provide <10 ps channel-to-channel skew for precise TDC calibration and trigger distribution. |
| 5G Wireless Baseband | Medical Imaging Acceleration |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations with real-time precoding and channel estimation. IC Role / Device Role / Timing Role: DSP-rich fabric performs matrix inversion and FFT operations; GT transceivers handle CPRI fronthaul at 24.33 Gbps aggregate. Use Value: 3,600 DSP slices deliver >2.1 TMAC/s throughput for LTE-A Pro and 5G NR waveform generation. | Use Scenario: Real-time image reconstruction pipeline in PET/MRI hybrid scanners requiring low-latency backprojection. IC Role / Device Role / Timing Role: Dedicated hardware accelerators offload iterative reconstruction kernels from host CPU; block RAM serves as local frame buffer. Use Value: 60.8 MB of block RAM enables dual-buffered 4K×4K sinogram storage with zero external DRAM access latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture; higher DSP density (5,520 slices); lower max transceiver rate (16.3 Gbps vs 13.1 Gbps) | Targeted at AI inference acceleration and next-gen 5G mmWave where higher compute density outweighs legacy protocol support | Select when migrating to newer toolchain and requiring higher arithmetic throughput per watt |
| XC7VX690T-2FFG1927I | Same Virtex-7 family; 690K logic cells (65% smaller); 52 GT transceivers; -2I industrial grade | Suitable for mid-scale radar subsystems where full XC7V2000T capacity is unused and board space is constrained | Select when cost and thermal envelope are prioritized over peak bandwidth and logic scalability |
Compared with XC7V2000T-2FLG1925C, the XCVU13P-2FLGA2577E offers greater computational density but requires Vivado 2019.1+, while the XC7VX690T-2FFG1927I retains identical tooling and pin compatibility within the Virtex-7 family but reduces transceiver count and logic resources by ~65%.
Availability
XC7V2000T-2FLG1925C is available at Aetrix Electronics and suitable for radar signal processing, 5G wireless infrastructure, and medical imaging acceleration requiring stable component supply across long-lifecycle programs.
Supply support for XC7V2000T-2FLG1925C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt leadership.
The Virtex-7 family was designed for high-bandwidth, high-compute applications including defense radar, wired/wireless communications, and scientific instrumentation requiring deterministic latency and protocol flexibility.
FAQ
What is the maximum supported transceiver line rate for XC7V2000T-2FLG1925C?
The XC7V2000T-2FLG1925C supports a maximum transceiver line rate of 13.1 Gbps per GT lane. This rate is validated across all 72 transceivers under industrial temperature conditions and applies to protocols including CPRI, SRIO, and 10GBASE-R. The device does not support PAM4 signaling or rates above 13.1 Gbps in production configuration.
Does XC7V2000T-2FLG1925C support partial reconfiguration?
Yes, XC7V2000T-2FLG1925C supports partial reconfiguration through Xilinx Vivado Design Suite. This capability allows dynamic replacement of logic modules in designated reconfigurable partitions without resetting the entire device or halting system operation. Implementation requires use of the ICAP interface and proper partitioning during synthesis.
What configuration modes are available for XC7V2000T-2FLG1925C?
XC7V2000T-2FLG1925C supports three primary configuration modes: JTAG boundary-scan, Master SPI (using external quad-SPI flash), and SelectMAP (parallel interface with external processor or PROM). Mode selection is controlled by CONFIG_MODE[2:0] pins at power-up, and all modes are fully supported in industrial temperature range.
Is XC7V2000T-2FLG1925C pin-compatible with other Virtex-7 devices?
No, XC7V2000T-2FLG1925C is not pin-compatible with other Virtex-7 devices due to its unique 1925-ball FCBGA package and specific I/O bank allocation. While it shares the same family architecture and toolflow, mechanical and electrical pin mapping differs from XC7VX690T (1927-ball) and XC7VX1140T (2104-ball) variants.
What is the thermal design power (TDP) of XC7V2000T-2FLG1925C?
The thermal design power of XC7V2000T-2FLG1925C is 49.5 W under typical operating conditions, as defined in Xilinx UG475 v1.15. This value assumes full utilization of logic, DSP, and transceiver resources at 100 MHz system clock and 13.1 Gbps GT operation. Actual power varies based on design utilization and voltage scaling settings.
XC7V2000T-2FLG1925C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 152700
- Number of Logic Elements/Cells:
- 1954560
- Total RAM Bits:
- 47628288
- Number of I/O:
- 1200
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1925-FCBGA (45x45)
XC7V2000T-2FLG1925C FAQ
1.How can I place an order for XC7V2000T-2FLG1925C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V2000T-2FLG1925C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V2000T-2FLG1925C reliable?
The price and inventory of XC7V2000T-2FLG1925C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V2000T-2FLG1925C is usually 5 days.
3.What payment methods are accepted for XC7V2000T-2FLG1925C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V2000T-2FLG1925C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V2000T-2FLG1925C?
XC7V2000T-2FLG1925C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V2000T-2FLG1925C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V2000T-2FLG1925C?
For technical support, including XC7V2000T-2FLG1925C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V2000T-2FLG1925C requirements.
6.How does Aetrix verify that XC7V2000T-2FLG1925C is sourced from the original manufacturer or authorized distributors?
All XC7V2000T-2FLG1925C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V2000T-2FLG1925C meets industry standards.
7.What is the process for return or replacement of XC7V2000T-2FLG1925C?
All XC7V2000T-2FLG1925C units undergo pre-shipment inspection (PSI). If there is an issue with XC7V2000T-2FLG1925C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V2000T-2FLG1925C part is unused and in its original packaging.
Return procedure for XC7V2000T-2FLG1925C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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