AMD XC7V2000T-L2FHG1761E

Overview

XC7V2000T-L2FHG1761E from AMD is a high-capacity Virtex-7 FPGA featuring 1,954,560 logic cells, 840 DSP slices, 64.8 Mb of block RAM, 96 GTs (13.1 Gb/s transceivers), and integrated PCI Express Gen3 x8 endpoint capability. It targets high-throughput data processing in radar signal conditioning systems.

For engineers reviewing the XC7V2000T-L2FHG1761E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, block RAM depth, DSP slice density, and PCIe Gen3 endpoint integration for real-time embedded compute acceleration.

Technical Context

The XC7V2000T-L2FHG1761E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated carry chains, and clock management tiles (CMTs) supporting multiple phase-locked loops (PLLs) and mixed-mode clock managers (MMCMs). It supports DDR3/DDR4 memory interfaces up to 1866 Mbps and includes hardened 10/100/1000 Ethernet MACs.

This device integrates 96 GT transceivers arranged in 12 banks, each with independent reference clock inputs and programmable equalization. Its PCIe Gen3 x8 endpoint hard IP operates at 8 GT/s with AXI4 streaming interface and MSI-X interrupt support.

Key Specifications

Pinout & Package

XC7V2000T-L2FHG1761E is housed in a 1761-pin Flip-Chip BGA (FCBGA) package with 35×35 mm body size, 0.8 mm ball pitch, and thermal lid. Pin assignment follows Xilinx/AMD Virtex-7 FG1761 footprint standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7V2000T-L2FHG1761E, the XCVU13P-2FLGA2577E trades PCIe Gen3 endpoint integration for higher-speed transceivers and AI-optimized DSPs, while the XC7VX690T-2FFG1927I offers identical PCIe functionality at reduced scale and extended temperature operation.

Availability

XC7V2000T-L2FHG1761E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply and long-term production continuity.

Supply support for XC7V2000T-L2FHG1761E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and aerospace & defense markets.

The Virtex-7 family was designed for high-performance signal processing, real-time analytics, and deterministic I/O-intensive applications in mission-critical infrastructure.

FAQ

What is the operating temperature range for XC7V2000T-L2FHG1761E?

The XC7V2000T-L2FHG1761E is specified for commercial temperature operation (0°C to +85°C ambient). It uses a thermally enhanced FCBGA package with integrated heat spreader and supports junction temperature monitoring via on-die sensors. Thermal design must maintain Tj ≤ 100°C under full static and dynamic loading conditions. The XC7V2000T-L2FHG1761E does not support extended or industrial temperature grades.

Does XC7V2000T-L2FHG1761E include built-in configuration memory?

No, the XC7V2000T-L2FHG1761E requires external configuration memory (e.g., SPI flash) for bitstream loading at power-up. It supports Master SPI, Slave SelectMAP, and JTAG modes. Configuration occurs via dedicated CCLK and DIN pins, and the XC7V2000T-L2FHG1761E supports dual-boot and fallback mechanisms using two flash sectors. Bitstream encryption and HMAC authentication are supported for secure boot.

What transceiver protocols does XC7V2000T-L2FHG1761E natively support?

The XC7V2000T-L2FHG1761E GT transceivers natively support JESD204B subclass 1, CPRI, OBSAI, and 10G-KR. They also implement physical coding sublayer (PCS) for PCIe Gen3, SATA III, and DisplayPort 1.2a. Protocol support is enabled via GT wizard IP cores and validated transceiver IBIS-AMI models. The XC7V2000T-L2FHG1761E does not support Ethernet MAC layer protocols in transceiver logic - those require separate soft IP or hardened blocks.

Can XC7V2000T-L2FHG1761E operate with single-ended clock inputs?

Yes, the XC7V2000T-L2FHG1761E accepts single-ended clock signals on dedicated CLK_IN pins, which are internally converted to differential pairs for MMCM/PLL input. Single-ended sources must meet VIH/VIL thresholds and slew rate requirements per DS182. For optimal jitter performance, differential inputs (LVDS, LVPECL) are recommended. The XC7V2000T-L2FHG1761E supports up to four dedicated clock inputs per bank group.

Is there a migration path from XC7V2000T-L2FHG1761E to AMD Versal devices?

Direct pin-compatible migration from XC7V2000T-L2FHG1761E to Versal ACAP is not supported due to architectural and package differences. However, AMD provides Vivado-based IP migration tools and hardened subsystem wrappers to port PCIe, GT, and memory controller IP. The XC7V2000T-L2FHG1761E design can be retargeted to Versal Premium (e.g., VP1802) for AI-accelerated workloads, though board-level redesign and timing closure adjustments are required.