AMD XC7V585T-1FF1157I

Overview

XC7V585T-1FF1157I from AMD is a high-performance 28 nm Kintex-7 FPGA with 585,000 logic cells, 2,850 DSP slices, and 34.8 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch BGA (FF1157) package for high-speed serial interface and compute-accelerated embedded vision systems.

For engineers reviewing the XC7V585T-1FF1157I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), thermal design power (29.2 W typical), and -1 speed grade timing performance.

Technical Context

The XC7V585T-1FF1157I implements a 28 nm HKMG process-based architecture with integrated PCI Express® Gen3 x8 endpoint, 16 GTX transceivers supporting JESD204B, and dual 36-bit AXI-HP interfaces for high-bandwidth data movement. It supports partial reconfiguration and built-in system monitoring via on-chip temperature and voltage sensors.

This device targets deterministic low-latency processing in radar signal chains and real-time video pipelines, where its 2,850 DSP slices deliver up to 2,280 GMAC/s at 800 MHz, and its 500 user-configurable I/Os support LVDS, TMDS, and MIPI D-PHY standards.

Key Specifications

Pinout & Package

XC7V585T-1FF1157I is housed in a 1157-pin Flip-Chip Fine-Pitch BGA (FF1157) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for industrial-grade thermal dissipation (θ_JA = 3.8°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU060-2FFVA1156I and XC7VX690T-2FFG1927I, the XC7V585T-1FF1157I offers balanced logic density, PCIe Gen3 x8 integration, and industrial thermal packaging-making it optimal for space-constrained, thermally demanding radar and medical imaging platforms requiring deterministic latency and reliable field operation.

Availability

XC7V585T-1FF1157I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and industrial machine vision applications requiring stable component supply across extended product lifecycles.

Supply support for XC7V585T-1FF1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets.

The Kintex-7 family delivers high-performance, cost-optimized FPGA capabilities targeting compute-intensive, I/O-rich applications such as wireless infrastructure, video processing, and test equipment.

FAQ

What is the maximum transceiver line rate supported by XC7V585T-1FF1157I?

The XC7V585T-1FF1157I integrates 16 GTX transceivers, each supporting a maximum line rate of 13.1 Gb/s. This enables compliance with JESD204B subclass 1 for high-speed ADC/DAC interfacing and supports protocols including CPRI, SRIO, and 10GBASE-R. The XC7V585T-1FF1157I does not support higher-rate GTY or GTH transceivers found in UltraScale devices.

Does XC7V585T-1FF1157I support partial reconfiguration?

Yes, the XC7V585T-1FF1157I fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic swapping of logic modules without resetting the entire device. This capability is used in adaptive radar systems to update beamforming coefficients or waveform generators on-the-fly. The XC7V585T-1FF1157I's configuration logic and frame-based bitstream architecture enable secure, verified module replacement.

What is the thermal design power (TDP) of XC7V585T-1FF1157I?

The XC7V585T-1FF1157I has a typical thermal design power of 29.2 W under industrial operating conditions (-40°C to +100°C ambient). Its FF1157 package includes a thermal lid to improve heat dissipation, and the on-chip system monitor provides real-time die temperature readings. Power estimation for the XC7V585T-1FF1157I must account for I/O standard selection, transceiver usage, and logic utilization using Xilinx Power Estimator (XPE).

Which PCIe generation and lane count does XC7V585T-1FF1157I support?

The XC7V585T-1FF1157I implements a hard PCIe Gen3 endpoint with up to x8 lane configuration, providing 7.88 GB/s bidirectional bandwidth. It supports root port emulation and endpoint mode, with integrated DMA engines and AXI-PCIe bridges. The XC7V585T-1FF1157I does not support PCIe Gen4 or switch functionality-those require UltraScale+ or Versal architectures.

What I/O standards are supported by XC7V585T-1FF1157I?

The XC7V585T-1FF1157I supports 500 user-configurable I/Os across 24 banks, compatible with LVDS, LVPECL, TMDS, MIPI D-PHY, HSTL, SSTL, and differential signaling standards. Each bank operates independently at 1.2 V to 3.3 V, enabling mixed-voltage interface designs. The XC7V585T-1FF1157I does not support DDR4 or LPDDR4 memory interfaces natively-those require MIG IP cores and careful timing closure.