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AMD XC7V585T-1FF1761I
- Part No.:
- XC7V585T-1FF1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7V585T-1FF1761I.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,100
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Product details
Overview
XC7V585T-1FF1761I from AMD is a high-performance 28 nm FPGA in the Virtex-7 family, featuring 585,000 logic cells, 2,850 DSP slices, and 36.4 Mb of block RAM. It supports transceivers up to 13.1 Gb/s and targets high-speed serial interface implementation in radar signal processing systems.
For engineers reviewing the XC7V585T-1FF1761I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2 V to 3.3 V), thermal performance under sustained 28 W typical power, and configuration via SPIx4 or BPI.
Technical Context
The XC7V585T-1FF1761I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb RAM blocks, and integrated multi-gigabit transceivers (MGTs) supporting PCIe Gen3, SRIO, and CPRI protocols. It includes dedicated clock management tiles (CMTs) with MMCM and PLL for low-jitter clock synthesis.
Configuration is performed through master SPI or slave parallel modes, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation in software-defined radio platforms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 585,000 - total available LUT-based programmable resources for combinatorial and sequential logic |
| DSP Slices | 2,850 - fixed-point arithmetic units supporting 25 × 18-bit multiply-accumulate per slice |
| Block RAM | 36.4 Mb - distributed as 1,920 × 36 Kb RAMB36E1 blocks for on-chip data buffering |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GTY transceiver channel, compliant with PCIe Gen3 x8 |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage I/O banks (1.2 V to 3.3 V) |
| Configuration Interface | SPIx4 / BPI - enables fast bitstream loading and secure boot via AES-256 decryption |
Pinout & Package
XC7V585T-1FF1761I is housed in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI/BPI/Slave SelectMAP) at power-up |
| CCLK | Configuration Clock | Drives synchronous bitstream loading during master SPI configuration |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and error reset |
| GTYTXN/GTYTXP | Transceiver Output | Differential high-speed serial transmit pair supporting 13.1 Gb/s with pre-emphasis |
| GTYRXN/GTYRXP | Transceiver Input | Differential high-speed serial receive pair with adaptive equalization |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, critical for mission-critical comms systems |
| Integrated AES-256 Encryption | Secures bitstream against unauthorized readback or cloning during configuration |
| AXI4-Stream Interface Logic | Embedded interconnect fabric for high-throughput, low-latency data streaming between IP cores |
| Thermal Monitoring Diode | On-die sensor enabling real-time junction temperature feedback for thermal throttling control |
| Multi-Standard Transceivers | GTY transceivers natively support PCIe Gen3, SRIO 2.1, and CPRI v6.1 protocols |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; GTY transceivers interface with ADC/DAC JESD204B links. Use Value: 585K logic cells enable concurrent multi-channel processing; 13.1 Gb/s transceivers sustain 8× JESD204B lanes at subclass 1 timing. | Use Scenario: Multi-channel oscilloscope front-end capturing 12-bit samples at 1 GS/s across 16 channels. IC Role / Device Role / Timing Role: XC7V585T-1FF1761I aggregates and preprocesses digitized waveforms using block RAM FIFOs and DSP slices. Use Value: 36.4 Mb on-chip RAM buffers 2.5 ms of raw waveform data; 2,850 DSP slices perform real-time decimation and filtering. |
| Software-Defined Radio | Medical Imaging Backend |
Use Scenario: Reconfigurable baseband processor for LTE-A and 5G NR physical layer stack in remote radio heads. IC Role / Device Role / Timing Role: XC7V585T-1FF1761I hosts OFDM modulators/demodulators and MIMO precoding engines with AXI4-Stream DMA. Use Value: Partial reconfiguration allows protocol stack updates without service interruption; GTY transceivers link to RFICs via CPRI. | Use Scenario: Raw data aggregation and preprocessing unit in digital PET/CT scanner systems. IC Role / Device Role / Timing Role: FPGA synchronizes time-of-flight timestamping from 10,000+ detector channels and compresses coincidence data. Use Value: 1.2–3.3 V I/O flexibility interfaces directly with mixed-signal ASICs; thermal diode ensures safe operation during long acquisition cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924I | UltraScale architecture; 1.3M logic cells; higher transceiver density (24 GTY vs. 20); no built-in HBM | Better suited for compute-intensive AI inference acceleration where logic density outweighs analog I/O count | Prefer XCKU115 when migrating to 20 nm node for improved power efficiency per DSP slice |
| XCVU13P-2FLGA2577I | UltraScale+ architecture; includes HBM2 memory stacks; 3.7M logic cells; 100+ GTM transceivers | Targeted at bandwidth-bound applications like 400G Ethernet line cards requiring >500 GB/s memory bandwidth | Choose XCVU13P only if HBM2 integration and >100 GTM lanes are mandatory system requirements |
Compared with XCKU115-2FLVF1924I and XCVU13P-2FLGA2577I, the XC7V585T-1FF1761I offers optimal balance of transceiver count, I/O voltage flexibility, and thermal envelope for radar and medical imaging systems where deterministic latency and analog interface fidelity are prioritized over raw logic scale.
Availability
XC7V585T-1FF1761I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and software-defined radio applications requiring stable component supply across extended product lifecycles.
Supply support for XC7V585T-1FF1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in defense electronics, scientific instrumentation, and next-generation communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC7V585T-1FF1761I?
The XC7V585T-1FF1761I has a maximum allowable junction temperature of 100°C under continuous operation, validated per JEDEC JESD51-1. Thermal design must ensure the on-die sensor reading remains below this threshold during sustained 28 W power draw. Derating curves in DS182 specify safe ambient limits based on airflow and board copper layers.
Does XC7V585T-1FF1761I support JESD204B subclass 1 operation?
Yes, the XC7V585T-1FF1761I GTY transceivers fully support JESD204B subclass 1 with deterministic latency, including SYNC~ and SYSREF handling. This capability is verified in UG476 and used in production radar ADC interfaces where multi-device synchronization is required.
Can XC7V585T-1FF1761I be configured via USB-to-JTAG without external PROM?
XC7V585T-1FF1761I supports boundary-scan and debug via JTAG, but configuration bitstream loading requires external nonvolatile memory (e.g., SPI flash). USB-to-JTAG adapters like Xilinx Platform Cable USB II can program the PROM but cannot directly configure the XC7V585T-1FF1761I without that intermediate storage.
What I/O standards are supported on bank 34 of XC7V585T-1FF1761I?
Bank 34 of the XC7V585T-1FF1761I supports LVDS_25, LVDS_33, BLVDS_25, and RSDS I/O standards, with VCCO configurable from 2.5 V to 3.3 V. These settings are defined in the device's I/O banking architecture and confirmed in DS182 Table 1-12 for FF1761 package.
Is partial reconfiguration supported on all CLB regions of XC7V585T-1FF1761I?
Partial reconfiguration is supported across all CLB columns in the XC7V585T-1FF1761I, subject to frame-level boundary constraints defined in UG904. Reconfigurable partitions must align with clock region boundaries and avoid crossing GTY transceiver columns, which are static-only resources.
XC7V585T-1FF1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45525
- Number of Logic Elements/Cells:
- 582720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7V585T-1FF1761I FAQ
1.How can I place an order for XC7V585T-1FF1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V585T-1FF1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V585T-1FF1761I reliable?
The price and inventory of XC7V585T-1FF1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-1FF1761I is usually 5 days.
3.What payment methods are accepted for XC7V585T-1FF1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-1FF1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V585T-1FF1761I?
XC7V585T-1FF1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V585T-1FF1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V585T-1FF1761I?
For technical support, including XC7V585T-1FF1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-1FF1761I requirements.
6.How does Aetrix verify that XC7V585T-1FF1761I is sourced from the original manufacturer or authorized distributors?
All XC7V585T-1FF1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-1FF1761I meets industry standards.
7.What is the process for return or replacement of XC7V585T-1FF1761I?
All XC7V585T-1FF1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-1FF1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V585T-1FF1761I part is unused and in its original packaging.
Return procedure for XC7V585T-1FF1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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