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AMD XC7V585T-1FFG1157C
- Part No.:
- XC7V585T-1FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7V585T-1FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,842
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Product details
Overview
XC7V585T-1FFG1157C from AMD is a high-performance 28 nm FPGA with 585,000 logic cells, 36.4 Mb of block RAM, and 2,800 DSP slices, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-accelerated embedded systems.
For engineers reviewing the XC7V585T-1FFG1157C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), thermal design power (29.5 W typical), and support for PCIe Gen3 x8 endpoint configuration.
Technical Context
The XC7V585T-1FFG1157C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and 25×18-bit signed/unsigned multipliers in DSP slices. It integrates 32 GTs (Gigabit Transceivers) supporting protocols including PCIe Gen3, SATA, and SRIO.
Configuration is performed via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device supports partial reconfiguration and includes hardened IP for PCIe Gen3 endpoints, 10/100/1000 Ethernet MAC, and AXI interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 585,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 36.4 Mb - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 2,800 - enables high-throughput arithmetic for signal processing, filtering, and matrix operations |
| User I/O Pins | 500 - provides scalable parallel interface connectivity to ADCs, DACs, memory, and peripheral controllers |
| Gigabit Transceivers | 32 GTs @ 13.1 Gb/s - delivers multi-protocol serial I/O for PCIe Gen3 x8, SATA III, and SRIO 2.1 links |
| TDP | 29.5 W typical - defines thermal management requirements for board-level heatsinking and airflow design |
Pinout & Package
XC7V585T-1FFG1157C is housed in a 1157-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in compute-intensive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply voltage | 1.0 V ±3% supply for CLB, RAM, and DSP logic; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V ±3% supply for configuration, clocking, and transceiver reference circuits |
| VCCO | I/O bank supply | Programmable 1.2–3.3 V per bank; sets interface voltage level for connected peripherals |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated supply for GT transceiver analog circuitry |
| CLK_IN | Dedicated clock input | Single-ended or differential input for global clock distribution network |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 Hard IP | Integrated endpoint controller supporting x1/x2/x4/x8 lane widths with full link training and error reporting |
| Partial Reconfiguration | Enables dynamic logic module swapping without system reset, reducing downtime in mission-critical systems |
| AXI Interconnect | Hardened AMBA AXI4-Stream and AXI4-Lite infrastructure for high-bandwidth, low-latency SoC-style subsystem integration |
| UltraScale Architecture | 28 nm HKMG process with improved timing closure, reduced power per logic cell, and enhanced signal integrity |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; GT transceivers interface with high-speed ADC/DACs. Use Value: 2,800 DSP slices enable concurrent multi-channel processing; 13.1 Gb/s GTs sustain >10 GSPS data ingestion from RF front-ends. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers capturing transient waveforms at >1 GS/s. IC Role / Device Role / Timing Role: Synchronizes sampling clocks, buffers raw samples in block RAM, and compresses data before PCIe Gen3 upload. Use Value: 36.4 Mb block RAM allows >1 ms full-rate waveform capture; PCIe Gen3 x8 hard IP ensures <100 µs host transfer latency. |
| Medical Imaging Acceleration | Industrial Machine Vision |
Use Scenario: Real-time reconstruction of CT and MRI image volumes using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic implements back-projection kernels; GTs stream sensor data from detector arrays. Use Value: 585,000 logic cells support parallelized reconstruction pipelines; 1.0 V core supply enables predictable power budgeting. | Use Scenario: High-resolution, low-latency inspection of PCBs and semiconductor wafers using line-scan cameras. IC Role / Device Role / Timing Role: Processes pixel streams with sub-pixel edge detection and defect classification logic. Use Value: 500 user I/Os connect to multiple camera interfaces and industrial I/O; AXI interconnect simplifies integration with vision processors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | UltraScale Kintex with 1.1M logic cells, higher GT count (40), but lower block RAM (42.2 Mb) | Better suited for protocol-heavy designs requiring >32 GTs; less optimal for memory-bound imaging workloads | Select when GT density and PCIe Gen4 support outweigh RAM capacity needs |
| XCVU9P-2FLGB2104I | UltraScale+ Virtex with 2.5M logic cells, 64 GTs, and 72.2 Mb block RAM; 16 nm process | Targets next-gen AI inference acceleration and 100G Ethernet; higher cost and power than XC7V585T | Choose for future-proofing where scalability beyond 585K cells is required |
Compared with XCKU115-2FLVD1517I and XCVU9P-2FLGB2104I, the XC7V585T-1FFG1157C offers balanced logic, memory, and transceiver resources at lower power and cost-ideal for deployed radar, medical, and test equipment where maturity and qualification stability are critical.
Availability
XC7V585T-1FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC7V585T-1FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Virtex-7 family, including XC7V585T-1FFG1157C, was engineered for high-throughput, low-latency signal and packet processing in defense, aerospace, and scientific instrumentation systems.
FAQ
What is the maximum transceiver line rate supported by XC7V585T-1FFG1157C?
The XC7V585T-1FFG1157C supports a maximum transceiver line rate of 13.1 Gb/s per GT channel. This enables full compliance with PCIe Gen3 x8, SATA III, and SRIO 2.1 standards. All 32 GTs on the XC7V585T-1FFG1157C are rated for this speed under specified thermal and voltage conditions per AMD DS182.
Does XC7V585T-1FFG1157C support partial reconfiguration?
Yes, XC7V585T-1FFG1157C supports partial reconfiguration through its ICAP and PCIe-based configuration interfaces. This capability allows dynamic logic module updates without resetting the entire device, which is essential for mission-critical systems like radar and medical imaging where continuous operation is required. Implementation requires Vivado 2018.3 or later.
What is the I/O voltage range supported per bank on XC7V585T-1FFG1157C?
XC7V585T-1FFG1157C supports programmable I/O voltages from 1.2 V to 3.3 V per bank, enabling direct interfacing with legacy and modern peripherals including LVCMOS, SSTL, HSTL, and differential standards. Each of the 36 I/O banks is independently configurable, and voltage settings must match connected device specifications to ensure signal integrity.
Is XC7V585T-1FFG1157C qualified for automotive applications?
No, XC7V585T-1FFG1157C is not AEC-Q100 qualified and is not recommended for automotive safety-critical systems. It is rated for commercial and industrial temperature ranges (0°C to 85°C junction). For automotive use, AMD offers the XA7VX485T variant, which shares the same architecture but includes extended temperature screening and qualification documentation.
What configuration modes does XC7V585T-1FFG1157C support?
XC7V585T-1FFG1157C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration modes. Dual-boot capability is enabled via external SPI flash with fallback bitstream storage. Configuration is initiated automatically on power-up when using Master SelectMAP or SPI mode, and can be triggered manually via JTAG for debug and field updates.
XC7V585T-1FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45525
- Number of Logic Elements/Cells:
- 582720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7V585T-1FFG1157C FAQ
1.How can I place an order for XC7V585T-1FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V585T-1FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V585T-1FFG1157C reliable?
The price and inventory of XC7V585T-1FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-1FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7V585T-1FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-1FFG1157C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V585T-1FFG1157C?
XC7V585T-1FFG1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V585T-1FFG1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V585T-1FFG1157C?
For technical support, including XC7V585T-1FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-1FFG1157C requirements.
6.How does Aetrix verify that XC7V585T-1FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7V585T-1FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-1FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7V585T-1FFG1157C?
All XC7V585T-1FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-1FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V585T-1FFG1157C part is unused and in its original packaging.
Return procedure for XC7V585T-1FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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