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AMD XC7V585T-1FFG1157I
- Part No.:
- XC7V585T-1FFG1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7V585T-1FFG1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,704
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Product details
Overview
XC7V585T-1FFG1157I from AMD is a high-performance 28 nm FPGA featuring 585,000 logic cells, 36.4 Mb of block RAM, and 2,800 DSP slices, configured in a 1157-pin flip-chip BGA package with 0.8 mm pitch, used in high-bandwidth radar signal processing systems.
For engineers reviewing the XC7V585T-1FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, thermal design power (19.2 W typical), and -40°C to +100°C industrial temperature grade.
Technical Context
The XC7V585T-1FFG1157I implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint capability, dual 10GbE MACs, and hardened AXI-4 interconnect fabric. It supports partial reconfiguration and includes 72 GTX transceivers with built-in PRBS generators and eye diagram monitors.
Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device integrates 12 clock management tiles (CMTs), each containing a PLL and MMCM for jitter attenuation and phase alignment across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 585,000 - determines maximum combinational/sequential logic capacity for complex control and datapath implementation |
| Block RAM | 36.4 Mb - supports large on-chip buffering for video frame stores, FFT pipelines, or packet buffering |
| DSP Slices | 2,800 - enables parallel execution of >10,000 MAC operations per cycle for real-time filtering and beamforming |
| GTX Transceivers | 72 × 13.1 Gbps - provides native serial connectivity for JESD204B ADC/DAC interfaces and optical backplanes |
| I/O Standards | LVDS, SSTL, HSTL, TMDS, MIPI D-PHY - allows direct interface to image sensors, memory, displays, and high-speed serdes |
| Operating Temp | -40°C to +100°C - qualified for deployment in sealed industrial enclosures and outdoor base station cabinets |
| TDP | 19.2 W typical - defines heatsink sizing and airflow requirements for conduction-cooled carrier board designs |
Pinout & Package
XC7V585T-1FFG1157I is housed in a 1157-pin flip-chip BGA (FFG) package with 0.8 mm ball pitch, 35 mm × 35 mm body size, and thermal lid for enhanced heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, routing, and configuration logic |
| VCCAUX | Auxiliary supply | 1.8 V ±3% powering configuration logic, PCIe blocks, and clock management tiles |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V output driver voltage per bank, enabling mixed-voltage interface design |
| MRCC/MRCC_N | Multi-Gigabit RefClk | Differential reference clock inputs for GTX transceivers, supporting 100 MHz–650 MHz frequencies |
| MGTAVCC | Analog transceiver supply | 1.0 V ±3% dedicated analog rail for GTX transmitter/receiver analog circuitry |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hard IP block delivering 7.88 GB/s bidirectional throughput without consuming logic resources |
| Partial Reconfiguration | Enables dynamic swapping of functional modules (e.g., filter banks or modulators) during runtime without system reset |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse engineering of proprietary IP deployed in fielded systems |
| AXI-4 Interconnect Fabric | Provides low-latency, high-throughput data movement between processors, DMA engines, and custom accelerators |
| 72 GTX Transceivers | Each supports JESD204B subclass 1, enabling deterministic latency synchronization for multi-channel ADC/DAC systems |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: High-throughput datapath accelerator executing FFT, CFAR, and beamforming kernels with deterministic latency. Use Value: 2,800 DSP slices and 72 GTX lanes enable simultaneous processing of 16 RF channels at 1.2 GSps with sub-microsecond pipeline latency. | Use Scenario: Ultrasound beamformer control and raw RF data preprocessing in portable diagnostic systems. IC Role / Device Role / Timing Role: JESD204B receiver interfacing to 32-channel ADCs, performing digital down-conversion and channel calibration. Use Value: Native GTX transceiver support for JESD204B subclass 1 ensures deterministic multi-device synchronization and <100 ns skew across all 32 channels. |
| 5G Massive MIMO Baseband | High-Speed Test Equipment |
Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 64T64R active antenna units. IC Role / Device Role / Timing Role: Real-time adaptive filter engine implementing LMS/NLMS algorithms across 64 parallel RF chains. Use Value: 585K logic cells and 36.4 Mb block RAM allow concurrent execution of 64 independent DPD coefficient updates at 122.88 MHz sample rate. | Use Scenario: Protocol-aware pattern generation and error detection in 10G/25G Ethernet compliance testers. IC Role / Device Role / Timing Role: Multi-protocol serializer/deserializer with embedded PRBS generation, BER monitoring, and eye diagram analysis. Use Value: Integrated GTX transceivers with built-in PRBS generators and eye scan controllers eliminate external test ASICs and reduce PCB layer count by 2–3 layers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 1.2 million logic cells, 42.5 Mb BRAM, 120 GTY transceivers @ 32.75 Gbps, 16 nm process | Higher bandwidth and lower power per function; requires updated PCB stackup and new power delivery network | Preferred for new 25G+ designs where transceiver speed and logic density outweigh migration cost |
| XC7VX690T-2FFG1927I | 690K logic cells, 41.5 Mb BRAM, 84 GTX transceivers, same 28 nm node and pin-compatible FFG1927 package | Higher resource count and transceiver count in larger footprint; not pin-compatible with FFG1157 | Consider when additional DSP slices or I/O count is required and board redesign is feasible |
Compared with XC7V585T-1FFG1157I, XCKU115 offers higher transceiver speed and logic density at 16 nm but demands full platform requalification, while XC7VX690T delivers more resources in a physically larger package without changing process node-making it suitable for incremental upgrades where space permits.
Availability
XC7V585T-1FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, 5G massive MIMO baseband, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7V585T-1FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex-7 family, including XC7V585T-1FFG1157I, was engineered for mission-critical high-bandwidth signal processing in defense radar, satellite communications, and next-generation wireless infrastructure.
FAQ
What is the maximum transceiver line rate supported by XC7V585T-1FFG1157I?
The XC7V585T-1FFG1157I supports GTX transceivers with a maximum line rate of 13.1 Gbps. This specification is validated across the full industrial temperature range (-40°C to +100°C) and enables compliance with JESD204B subclass 1 and 10GBASE-R protocols. Each of the 72 GTX transceivers meets this rate under standard VCCINT and VCCAUX supply conditions.
Does XC7V585T-1FFG1157I support partial reconfiguration?
Yes, XC7V585T-1FFG1157I fully supports partial reconfiguration through its configuration logic and ICAP interface. This capability allows dynamic loading of functional modules-such as different filter banks or modulation schemes-without resetting the entire device or disrupting active I/O operations, a key requirement in adaptive radar and software-defined radio systems.
What I/O standards are supported by XC7V585T-1FFG1157I?
XC7V585T-1FFG1157I supports LVDS, SSTL-18/25, HSTL-I/II, TMDS, and MIPI D-PHY across its 500+ user I/O pins. Each I/O bank is independently configurable for voltage levels from 1.2 V to 3.3 V, enabling direct connection to DDR3/DDR4 memory, image sensors, display interfaces, and high-speed serial links without level-shifting components.
Is XC7V585T-1FFG1157I qualified for industrial temperature operation?
Yes, XC7V585T-1FFG1157I is rated for industrial temperature operation from -40°C to +100°C. This qualification is confirmed in AMD's official Virtex-7 DC and AC characteristics documentation, and applies to all speed grades and package variants within the XC7V585T ordering family, including the -1FFG1157I variant.
What configuration modes does XC7V585T-1FFG1157I support?
XC7V585T-1FFG1157I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Configuration bitstreams can be loaded from external SPI flash, BPI flash, or through boundary-scan using IEEE 1149.1-compliant tools. The device also supports fallback configuration and multi-boot via external mode pins.
XC7V585T-1FFG1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45525
- Number of Logic Elements/Cells:
- 582720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7V585T-1FFG1157I FAQ
1.How can I place an order for XC7V585T-1FFG1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V585T-1FFG1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V585T-1FFG1157I reliable?
The price and inventory of XC7V585T-1FFG1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-1FFG1157I is usually 5 days.
3.What payment methods are accepted for XC7V585T-1FFG1157I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-1FFG1157I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V585T-1FFG1157I?
XC7V585T-1FFG1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V585T-1FFG1157I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V585T-1FFG1157I?
For technical support, including XC7V585T-1FFG1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-1FFG1157I requirements.
6.How does Aetrix verify that XC7V585T-1FFG1157I is sourced from the original manufacturer or authorized distributors?
All XC7V585T-1FFG1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-1FFG1157I meets industry standards.
7.What is the process for return or replacement of XC7V585T-1FFG1157I?
All XC7V585T-1FFG1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-1FFG1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V585T-1FFG1157I part is unused and in its original packaging.
Return procedure for XC7V585T-1FFG1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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