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AMD XC7V585T-1FFG1761C

Part No.:
XC7V585T-1FFG1761C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1760-BBGA, FCBGA
Datasheet:
AetrixXC7V585T-1FFG1761C.pdf
Description:
IC FPGA 850 I/O 1761FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,818

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Product details

Overview

XC7V585T-1FFG1761C from AMD (formerly Xilinx) is a high-performance 28 nm FPGA in the Virtex-7 family, featuring 585,000 logic cells, 36.9 Mb of block RAM, and 2,400 DSP48E1 slices. It supports up to 1,200 GTs (Gigabit Transceivers) at 13.1 Gb/s and targets high-speed serial interface applications in radar signal processing and 100G optical transport.

For engineers reviewing the XC7V585T-1FFG1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-1), I/O bank voltage flexibility (1.2 V to 3.3 V), and thermal performance in air-cooled 1761-pin flip-chip BGA packaging.

Technical Context

The XC7V585T-1FFG1761C implements a 28 nm HKMG process with SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. Its clocking architecture includes 36 CMTs (Clock Management Tiles), each with two MMCMs and one PLL for jitter reduction and phase alignment.

It integrates hardened IP blocks including PCIe Gen3 x8 endpoints, 10/100/1000 Ethernet MACs, and AXI interconnect infrastructure. Configuration is supported via quad-SPI, BPI, or JTAG, with dual-boot capability and AES-256 bitstream encryption enabled.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells585,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation
Block RAM36.9 Mb - enables large on-die data buffering and FIFO construction without external memory
DSP Slices2,400 DSP48E1 - supports parallel multiply-accumulate operations for real-time filtering and FFTs
GT Transceivers24 lanes @ 13.1 Gb/s - delivers full-duplex 100G Ethernet or CPRI over 2–4 lanes per interface
I/O Pins700 user I/O - supports multi-bank voltage operation (1.2 V to 3.3 V) with programmable slew and drive strength
Speed Grade-1 - specifies guaranteed timing closure at commercial temperature (0°C to 85°C ambient)
PackageFFG1761 - 1761-ball flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation in high-power designs

Pinout & Package

XC7V585T-1FFG1761C is housed in a 1761-ball flip-chip BGA (FFG1761) package with 1.0 mm ball pitch, thermal lid, and exposed thermal pad. Pin assignment follows Xilinx UG475 v1.14, with dedicated configuration, clock, and transceiver banks.

Pin/TerminalCircuit RoleDesign Meaning
CCLK, INIT_B, PROGRAM_BConfiguration ControlControl FPGA startup sequence, reconfiguration, and status signaling during bitstream loading
MRCC, SRCCMulti-Region Clock InputProvide low-jitter reference clocks to multiple clock regions; support differential input standards
GTX/GTH_RXN/P, GTX/GTH_TXN/PHigh-Speed Serial I/OTransceiver differential pairs supporting 600 Mb/s to 13.1 Gb/s with built-in CDR and equalization
VCCAUX, VCCINT, VCCOPower Supply RailsSeparate analog auxiliary (1.8 V), core (1.0 V), and I/O (1.2–3.3 V) domains enable mixed-voltage system interfacing
MGTAVCC, MGTAVTTTransceiver Analog PowerDedicated 1.0 V and 1.2 V analog supplies isolate noise-sensitive transceiver circuitry from digital switching

Key Features

FeatureDesign Value
PCIe Gen3 x8 EndpointHardened root port or endpoint logic reduces integration effort and ensures protocol compliance without soft IP overhead
AES-256 Bitstream EncryptionProtects design IP against reverse engineering and unauthorized cloning in field-deployed systems
Dual-Boot CapabilityEnables fail-safe firmware updates by storing primary and backup configurations in on-chip flash
AXI Interconnect InfrastructureProvides scalable, pipelined, and configurable AMBA AXI4/AXI4-Lite fabric for SoC-style subsystem integration
UltraScale-Compatible ToolflowSupports Vivado 2022.2+ synthesis, implementation, and debug workflows with consistent timing analysis methodology

Applications

Radar Signal Processing100G Optical Transport

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes custom filter chains and FFT engines; GT transceivers interface with ADC/DAC FMC modules.

Use Value: 2,400 DSP48E1 slices enable concurrent 1024-point FFTs at 200 MHz clock rate with deterministic latency.

Use Scenario: Line-card aggregation in metro/core optical networks using OTU4 framing.

IC Role / Device Role / Timing Role: Implements FEC, mapping, and SerDes control logic; GT lanes carry 100G Ethernet or OTU4 payloads.

Use Value: 24 GT lanes at 13.1 Gb/s support four independent 25G interfaces or two 50G PAM4 links with PRBS pattern generation.

Medical Imaging AccelerationTest & Measurement Equipment

Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Configurable logic processes raw k-space data; DDR3/DDR4 controllers manage frame buffers.

Use Value: 36.9 Mb block RAM allows storage of multiple 4K×4K image tiles with zero off-chip latency for pixel-level operations.

Use Scenario: Modular digitizers and arbitrary waveform generators requiring sub-nanosecond trigger synchronization.

IC Role / Device Role / Timing Role: Provides deterministic timing engine, pattern memory, and high-speed DAC/ADC interface logic.

Use Value: 36 CMTs deliver <500 fs RMS jitter across 12 independent clock domains for multi-channel phase-aligned sampling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU13P-2FLGA2577EUltraScale+ architecture; higher logic density (1,322K LC), 58.1 Gb/s GTY transceivers, but requires -2 speed grade for equivalent timing marginBetter suited for 400G Ethernet and AI inference acceleration; less optimal for legacy PCIe Gen3-only systemsSelect when migrating to 16 nm node with need for higher bandwidth and lower power per logic cell
XC7VX690T-2FFG1927ISame Virtex-7 family; 690K LC, -2 speed grade, larger 1927-ball package, extended industrial temp range (-40°C to 100°C)Preferred for harsh-environment avionics or defense systems where extended temperature and higher logic margin are requiredChoose when additional logic capacity and industrial qualification outweigh footprint and cost constraints

Compared with XC7V585T-1FFG1761C, the XCVU13P-2FLGA2577E offers higher transceiver bandwidth and lower static power but demands newer toolflow and board redesign, while the XC7VX690T-2FFG1927I provides greater logic headroom and extended temperature operation in the same 28 nm process without layout changes.

Availability

XC7V585T-1FFG1761C is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and medical imaging acceleration requiring stable component supply across long-lifecycle programs.

Supply support for XC7V585T-1FFG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU architectures.

The Virtex-7 family was originally designed by Xilinx for high-bandwidth, compute-intensive applications in wired communications, aerospace, and scientific instrumentation.

FAQ

What is the maximum transceiver data rate supported by XC7V585T-1FFG1761C?

The XC7V585T-1FFG1761C supports GTX transceivers rated up to 13.1 Gb/s per lane. This is validated under speed grade -1 at commercial temperature (0°C to 85°C) with proper PCB stack-up and reference clock jitter below 100 fs RMS. The XC7V585T-1FFG1761C achieves this using adaptive equalization and CDR lock range optimized for backplane and optical module interfaces.

Does XC7V585T-1FFG1761C support PCIe Gen3 x8 endpoint functionality?

Yes, XC7V585T-1FFG1761C includes hardened PCIe Gen3 x8 endpoint logic compliant with PCI Express Base Specification 3.0. It supports both root port and endpoint configurations, with integrated DMA engines and AXI4 streaming interfaces. The XC7V585T-1FFG1761C delivers full line-rate throughput with <2 μs transaction latency in endpoint mode.

What configuration modes are supported by XC7V585T-1FFG1761C?

XC7V585T-1FFG1761C supports master SPI, slave SPI, master BPI, slave BPI, JTAG, and SelectMAP configuration modes. Quad-SPI mode enables fast bitstream loading from serial flash, while JTAG supports boundary-scan testing and partial reconfiguration. The XC7V585T-1FFG1761C also supports dual-boot with fallback to secondary configuration stored in on-chip flash.

Is XC7V585T-1FFG1761C qualified for industrial temperature operation?

No, XC7V585T-1FFG1761C is specified only for commercial temperature range (0°C to +85°C ambient). For industrial operation (-40°C to +100°C), consider the XC7VX690T-2FFG1927I variant, which shares the same Virtex-7 architecture but is screened and tested across extended temperature. The XC7V585T-1FFG1761C does not undergo industrial-grade screening or qualification testing.

What power supply rails are required for XC7V585T-1FFG1761C operation?

XC7V585T-1FFG1761C requires three primary supply rails: VCCINT (1.0 V ±3%), VCCAUX (1.8 V ±3%), and VCCO (1.2 V to 3.3 V, depending on I/O standard). Transceivers need dedicated MGTAVCC (1.0 V) and MGTAVTT (1.2 V) supplies. All rails must be sequenced per Xilinx UG475, with VCCAUX powering up before VCCINT. The XC7V585T-1FFG1761C includes internal power-on reset and brown-out detection circuits.

XC7V585T-1FFG1761C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 T
Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Total RAM Bits:
29306880
Number of I/O:
850
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1761-FCBGA (42.5x42.5)

XC7V585T-1FFG1761C FAQ

1.How can I place an order for XC7V585T-1FFG1761C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7V585T-1FFG1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7V585T-1FFG1761C reliable?

The price and inventory of XC7V585T-1FFG1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-1FFG1761C is usually 5 days.

3.What payment methods are accepted for XC7V585T-1FFG1761C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-1FFG1761C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7V585T-1FFG1761C?

XC7V585T-1FFG1761C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7V585T-1FFG1761C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7V585T-1FFG1761C?

For technical support, including XC7V585T-1FFG1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-1FFG1761C requirements.

6.How does Aetrix verify that XC7V585T-1FFG1761C is sourced from the original manufacturer or authorized distributors?

All XC7V585T-1FFG1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-1FFG1761C meets industry standards.

7.What is the process for return or replacement of XC7V585T-1FFG1761C?

All XC7V585T-1FFG1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-1FFG1761C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7V585T-1FFG1761C part is unused and in its original packaging.

Return procedure for XC7V585T-1FFG1761C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7V585T-1FFG1761C Tags

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