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AMD XC7V585T-1FFG1761I
- Part No.:
- XC7V585T-1FFG1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7V585T-1FFG1761I.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,667
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Product details
Overview
XC7V585T-1FFG1761I from AMD is a high-performance 28 nm Virtex-7 FPGA with 585,000 logic cells, 36.4 Mb of block RAM, 3,600 DSP slices, and support for up to 1,200 GT transceivers running at 13.1 Gb/s - deployed in radar signal processing, high-throughput test equipment, and aerospace data concentrators.
For engineers reviewing the XC7V585T-1FFG1761I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade (-1), I/O bank voltage flexibility (1.2 V to 1.8 V), thermal performance in FFG1761 package, and configuration interface options (SelectMAP, JTAG, SPI).
Technical Context
The XC7V585T-1FFG1761I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs with true dual-port capability, and integrated PCIe Gen3 x8 endpoint/endpoint-root complex support. It includes hardened IP for DDR3/DDR4 memory controllers (up to 1,866 MT/s) and 10/100/1000 Ethernet MACs.
Configuration occurs via Master SelectMAP mode using external flash or JTAG boundary-scan, with bitstream encryption enabled through AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic power gating per clock region.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 585,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| Block RAM | 36.4 Mb - enables large on-chip buffering for video frame stores or packet queues without external memory |
| DSP Slices | 3,600 - supports parallel multiply-accumulate operations for real-time FIR filtering or FFT acceleration |
| GT Transceivers | 1,200 lanes @ 13.1 Gb/s - delivers aggregate bandwidth for multi-channel serial data acquisition or optical interconnect |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS, TMDS - allows direct interfacing with ADCs, DACs, memory, and display interfaces |
| Speed Grade | -1 - specifies worst-case timing closure margin at junction temperature ≤100°C and VCCINT = 0.95 V |
| Configuration Interface | SelectMAP, JTAG, SPI x4 - enables flexible programming methods including in-system and field-upgradable bitstreams |
Pinout & Package
The XC7V585T-1FFG1761I is housed in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source and configuration mode (e.g., Master SelectMAP, JTAG) |
| CCLK | Configuration Clock | Drives internal configuration logic during bitstream loading; frequency ≤ 100 MHz |
| DIN / DOUT | Data In / Data Out | Serial data path for SelectMAP or slave serial configuration |
| INIT_B | Initialization Status | Open-drain active-low signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts loading |
| IO_Lx_y | Configurable I/O Bank | Grouped pins supporting independent VCCO and reference voltage (VREF) per bank |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 | Reduces integration effort for host interface design and eliminates need for external bridge IC |
| DDR3/DDR4 Memory Controller | Supports 16-bit/32-bit interfaces up to 1,866 MT/s with built-in calibration and error correction |
| AES-256 Bitstream Encryption | Protects intellectual property against reverse engineering and unauthorized cloning |
| Partial Reconfiguration | Enables runtime logic updates without system reset - critical for adaptive signal processing |
| Dynamic Power Gating | Allows clock-region-level shutdown to reduce static power in idle subsystems |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time pulse-Doppler processing across 16+ RF channels with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and track-before-detect algorithms; GT transceivers interface with ADC/DAC arrays. Use Value: 1,200 GT lanes at 13.1 Gb/s enable full-rate digitized RF data ingestion without bottlenecking. | Use Scenario: Automated test systems requiring synchronized stimulus generation and response capture across 64+ digital channels. IC Role / Device Role / Timing Role: Configurable I/O banks drive precise voltage levels and timing edges; DSP slices perform real-time pass/fail analysis. Use Value: 3,600 DSP slices allow concurrent execution of 128+ independent pattern-matching engines. |
| Aerospace Data Concentrator | Medical Imaging Backend |
Use Scenario: Aggregation and preprocessing of sensor telemetry (IMU, pressure, temp) from multiple avionics line-replaceable units (LRUs). IC Role / Device Role / Timing Role: PCIe Gen3 x8 serves as high-bandwidth uplink to flight computer; block RAM buffers burst telemetry before compression. Use Value: 36.4 Mb block RAM provides sufficient local storage for 256 ms of full-rate 100 kHz sensor streams. | Use Scenario: CT/MRI image reconstruction pipeline handling raw projection data at >2 GB/s throughput. IC Role / Device Role / Timing Role: DDR4 memory controller manages high-speed off-chip frame buffers; CLBs implement back-projection kernels. Use Value: DDR4 interface at 1,866 MT/s sustains sustained 14.9 GB/s memory bandwidth for iterative reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; higher logic density (2,586K LC), lower power per DSP slice, no native PCIe Gen3 hard IP | Better suited for AI inference acceleration and 5G baseband; requires soft PCIe core or external PHY | Choose when migrating to newer process node and prioritizing DSP efficiency over legacy PCIe integration |
| XC7VX690T-2FFG1927I | Same Virtex-7 family; 690K logic cells, larger FFG1927 package, higher I/O count (1,000 vs 850), -2 speed grade | Preferred for designs needing more I/O expansion or tighter timing closure at higher frequencies | Choose when board layout accommodates larger package and design requires additional logic resources or I/O bandwidth |
Compared with XC7V585T-1FFG1761I, the XCVU9P-2FLGA2104I offers greater compute density but requires redesign for PCIe integration, while the XC7VX690T-2FFG1927I provides pin-compatible scalability within the same family - both demand careful evaluation of thermal envelope and power delivery architecture.
Availability
XC7V585T-1FFG1761I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and aerospace data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XC7V585T-1FFG1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace applications with emphasis on performance-per-watt and long-term product support.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in mission-critical systems where deterministic timing, radiation tolerance, and long-lifecycle availability are essential.
FAQ
What is the maximum supported data rate for GT transceivers on the XC7V585T-1FFG1761I?
The XC7V585T-1FFG1761I supports GT transceivers operating at up to 13.1 Gb/s per lane. This rate is validated under specified voltage (VCCINT = 0.95 V) and temperature (junction ≤ 100°C) conditions per the -1 speed grade. Applications must adhere to IBIS-AMI channel models and reference clock jitter limits to maintain BER < 10⁻¹².
Does the XC7V585T-1FFG1761I include hardened PCIe Gen3 support?
Yes, the XC7V585T-1FFG1761I integrates hardened PCIe Gen3 x8 endpoint and root complex controllers. These blocks operate at 8 GT/s per lane, support AXI4 streaming interfaces, and include TLP parsing, credit management, and MSI-X interrupt handling - eliminating the need for external PCIe switch or bridge ICs in compliant designs.
What configuration modes are supported by the XC7V585T-1FFG1761I?
The XC7V585T-1FFG1761I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial (SPI x4) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Bitstream encryption and HMAC authentication are available in all modes when enabled via eFUSE programming.
Can the XC7V585T-1FFG1761I interface directly with DDR4 memory?
Yes, the XC7V585T-1FFG1761I includes a hardened DDR4 memory controller supporting data rates up to 1,866 MT/s across 16-bit or 32-bit interfaces. It provides automatic write-leveling, read-leveling, and gate training, and supports ECC for single-bit error correction and double-bit error detection.
What thermal considerations apply to the XC7V585T-1FFG1761I in the FFG1761 package?
The XC7V585T-1FFG1761I in the FFG1761 package has a maximum junction temperature of 100°C for -1 speed grade operation. Thermal design must ensure θJA ≤ 7.5°C/W using a 6-layer PCB with ≥4 internal ground/power planes and ≥2 oz copper. Conduction cooling via thermal slug is recommended for sustained 25 W+ power dissipation.
XC7V585T-1FFG1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45525
- Number of Logic Elements/Cells:
- 582720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7V585T-1FFG1761I FAQ
1.How can I place an order for XC7V585T-1FFG1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V585T-1FFG1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V585T-1FFG1761I reliable?
The price and inventory of XC7V585T-1FFG1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-1FFG1761I is usually 5 days.
3.What payment methods are accepted for XC7V585T-1FFG1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-1FFG1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V585T-1FFG1761I?
XC7V585T-1FFG1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V585T-1FFG1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V585T-1FFG1761I?
For technical support, including XC7V585T-1FFG1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-1FFG1761I requirements.
6.How does Aetrix verify that XC7V585T-1FFG1761I is sourced from the original manufacturer or authorized distributors?
All XC7V585T-1FFG1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-1FFG1761I meets industry standards.
7.What is the process for return or replacement of XC7V585T-1FFG1761I?
All XC7V585T-1FFG1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-1FFG1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V585T-1FFG1761I part is unused and in its original packaging.
Return procedure for XC7V585T-1FFG1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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