My Inquiry
My Account
AMD XC7V585T-2FFG1157C
- Part No.:
- XC7V585T-2FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7V585T-2FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,203
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7V585T-2FFG1157C from AMD is a high-performance 28 nm FPGA with 585,000 logic cells, 36.4 Mb of block RAM, and 2,800 DSP slices, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7V585T-2FFG1157C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, and -2 speed grade timing performance under industrial temperature range.
Technical Context
The XC7V585T-2FFG1157C implements a 28 nm HPL (High-Performance Low-Power) process architecture with integrated SelectIO™ technology supporting single-ended and differential standards including LVDS, SSTL, and HSTL. It integrates 24 multi-gigabit GTs (GTX/GTH transceivers) with built-in PRBS generators and error detectors.
Configuration is performed via Master SPI or JTAG, with support for dual-boot and fallback modes. The device includes hardened PCIe® Gen3 x8 endpoint/endpoint-root complex blocks and AXI-4 compliant interconnect infrastructure for SoC-style integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 585,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 36.4 Mb - supports large on-chip data buffering, FIFOs, and coefficient storage without external memory |
| DSP Slices | 2,800 - enables parallel multiply-accumulate operations for real-time filtering and FFT acceleration |
| Transceivers | 24 GTX/GTH - provides 13.1 Gbps serial links for JESD204B, CPRI, and 10G Ethernet interfaces |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II - allows direct interfacing with ADCs, DACs, DDR3/DDR4 memory, and FMC mezzanine cards |
| Speed Grade | -2 - guarantees timing closure at 1.2 GHz system clock domain with worst-case industrial temperature derating |
Pinout & Package
XC7V585T-2FFG1157C is housed in a 1157-pin Flip-Chip Fine-Pitch BGA (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation in sustained compute workloads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for transceiver banks | Must be filtered with 100 nF + 10 µF local decoupling to meet jitter spec ≤ 0.35 ps RMS |
| MRCC/MRCC_N | Multi-Region Clock Capable input pair | Accepts differential clocks up to 800 MHz; used for high-fanout global clock distribution |
| HP[0:35]_IO | High-Performance I/O bank | Supports 1.8 V/2.5 V/3.3 V single-ended and differential signaling with programmable slew rate |
| CONFIG_IO | Configuration I/O bank | Drives configuration pins (INIT_B, PROGRAM_B, CCLK) during startup; operates at 1.8 V only |
| VCCAUX | Auxiliary analog supply | Powers PLLs, clock management tiles, and configuration logic; requires tight regulation ±3% |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 | Reduces RTL integration effort by eliminating need for soft PCIe core; supports endpoint and root complex roles |
| AXI-4 Interconnect | Enables plug-and-play integration of multiple IP cores with guaranteed throughput and latency predictability |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions without system reset-critical for mission-critical radar waveform updates |
| Integrated System Monitor | Provides real-time die temperature, supply voltage, and current telemetry via I²C or DRP interface |
| UltraScale Architecture | Delivers 1.5× higher logic density and 2× faster transceivers vs. Virtex-6 generation for SWaP-constrained systems |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems with >1000-element antenna arrays. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and SAR image reconstruction; transceivers interface with JESD204B-compliant ADC/DACs. Use Value: 2,800 DSP slices enable 4K-point FFTs at 200 MSPS; 13.1 Gbps transceivers eliminate serialization bottlenecks between ADC and processing engine. | Use Scenario: Multi-channel oscilloscope front-end capturing 16-bit samples at 1 GS/s across 8 channels simultaneously. IC Role / Device Role / Timing Role: XC7V585T-2FFG1157C serves as real-time digital downconverter and trigger engine, synchronizing sampling clocks and managing DDR4 buffer writes. Use Value: 36.4 Mb block RAM stores 256 MSamples per channel; SelectIO™ supports 1.8 V LVDS inputs directly from high-speed ADCs. |
| Avionics Flight Control | 5G Massive MIMO Baseband |
Use Scenario: Fault-tolerant flight control computer executing triple-modular-redundant (TMR) control law computation with deterministic latency < 5 µs. IC Role / Device Role / Timing Role: Configured as safety-certifiable logic fabric with dual-lockstep processors and hardware CRC monitors for DO-254 compliance. Use Value: -2 speed grade ensures timing margin across -40°C to +100°C; hardened PCIe Gen3 enables high-bandwidth communication with sensor fusion modules. | Use Scenario: 64-antenna massive MIMO baseband unit performing real-time precoding, channel estimation, and OFDM modulation/demodulation. IC Role / Device Role / Timing Role: Implements distributed FFT/IFFT engines and adaptive beamformer kernels across parallel DSP slices and BRAM resources. Use Value: 585,000 logic cells accommodate 64 independent precoder pipelines; GTX transceivers handle 24 × 10 GbE fronthaul links to remote radio units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 1.7x more logic cells (995K), 5.5 Gbps transceivers only, no PCIe Gen3 hard IP | Better suited for ultra-high-density logic-only designs; lacks native PCIe Gen3 endpoint capability | Select when logic density dominates over serial I/O bandwidth and PCIe integration |
| XCZU9EG-2FFVB1156I | Zynq UltraScale+ MPSoC with quad-core ARM Cortex-A53, lower logic count (350K), 12.5 Gbps transceivers | Preferred for heterogeneous compute where embedded processing + programmable logic coexist in same die | Select when application requires Linux-capable processing subsystem alongside FPGA fabric |
Compared with XCKU115-2FLVD1517I and XCZU9EG-2FFVB1156I, the XC7V585T-2FFG1157C delivers optimal balance of transceiver bandwidth, hardened PCIe Gen3, and logic density for radar and high-speed instrumentation-without requiring software stack integration or sacrificing serial link performance.
Availability
XC7V585T-2FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics flight control systems requiring stable component supply across extended product lifecycles.
Supply support for XC7V585T-2FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex-7 family, including XC7V585T-2FFG1157C, was engineered for high-throughput, low-latency signal processing in defense radar, scientific instrumentation, and wired/wireless infrastructure.
FAQ
What is the maximum transceiver line rate supported by XC7V585T-2FFG1157C?
The XC7V585T-2FFG1157C supports GTX transceivers with a maximum line rate of 13.1 Gbps, validated per IEEE 802.3ap and JESD204B specifications. This enables direct connection to high-speed ADCs and DACs without external retiming. The XC7V585T-2FFG1157C transceiver banks operate with sub-0.35 ps RMS jitter under industrial temperature conditions.
Does XC7V585T-2FFG1157C include hardened PCIe Gen3 IP?
Yes, XC7V585T-2FFG1157C integrates two hardened PCIe Gen3 x8 endpoints/root complexes compliant with PCI Express Base Specification Revision 3.0. These blocks support both endpoint and root complex configurations without consuming logic resources or requiring soft IP licensing. The XC7V585T-2FFG1157C PCIe interface achieves < 100 ns transaction latency in endpoint mode.
What I/O standards does XC7V585T-2FFG1157C support in HP banks?
XC7V585T-2FFG1157C HP I/O banks support LVDS, SSTL-18/25, HSTL-I/II, and differential HSTL at 1.5 V. Each bank is independently configurable for voltage and standard. The XC7V585T-2FFG1157C supports source-synchronous interfaces up to 1.25 GHz DDR, enabling direct attachment to DDR3/DDR4 memory and high-speed ADCs.
Is partial reconfiguration supported on XC7V585T-2FFG1157C?
Yes, XC7V585T-2FFG1157C fully supports partial reconfiguration using Vivado Design Suite tools. Dynamic logic partition swapping is enabled through dedicated configuration logic and frame-based bitstream loading. The XC7V585T-2FFG1157C has been deployed in airborne radar systems where waveform updates occur mid-mission without system reset.
What is the operating temperature range for XC7V585T-2FFG1157C?
XC7V585T-2FFG1157C is rated for industrial temperature operation from –40°C to +100°C case temperature. The -2 speed grade guarantees timing closure across this full range with appropriate thermal management. The XC7V585T-2FFG1157C thermal lid design supports conduction-cooled mounting in ruggedized enclosures.
XC7V585T-2FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45525
- Number of Logic Elements/Cells:
- 582720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7V585T-2FFG1157C FAQ
1.How can I place an order for XC7V585T-2FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V585T-2FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V585T-2FFG1157C reliable?
The price and inventory of XC7V585T-2FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-2FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7V585T-2FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-2FFG1157C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V585T-2FFG1157C?
XC7V585T-2FFG1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V585T-2FFG1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V585T-2FFG1157C?
For technical support, including XC7V585T-2FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-2FFG1157C requirements.
6.How does Aetrix verify that XC7V585T-2FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7V585T-2FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-2FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7V585T-2FFG1157C?
All XC7V585T-2FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-2FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V585T-2FFG1157C part is unused and in its original packaging.
Return procedure for XC7V585T-2FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7V585T-2FFG1157C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
