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AMD XC7V585T-2FFG1157I
- Part No.:
- XC7V585T-2FFG1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7V585T-2FFG1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,473
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Product details
Overview
XC7V585T-2FFG1157I from AMD is a high-performance 28 nm FPGA with 585,000 logic cells, 36.4 Mb of block RAM, and 2,800 DSP slices, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7V585T-2FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -2 speed grade timing performance under industrial temperature range (-40°C to +100°C).
Technical Context
The XC7V585T-2FFG1157I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers (MGTs), configurable logic blocks (CLBs), and hardened IP including PCIe Gen3 x8, 10 Gigabit Ethernet MAC, and AXI interconnect. It supports partial reconfiguration and dynamic power management.
This device belongs to the Virtex-7 family's T-class (Transceiver-optimized) lineup and delivers deterministic latency for real-time signal processing. Its dual-register flip-flops and 6-input LUTs enable high-fanout, low-skew routing critical for synchronous data acquisition systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 585,000 - provides scalable fabric for complex algorithm acceleration and protocol bridging |
| Block RAM | 36.4 Mb - supports large on-chip buffering for streaming FFT or video frame storage |
| DSP Slices | 2,800 - enables parallel multiply-accumulate operations at >1.5 TMAC/s for radar beamforming |
| Transceiver Speed | 13.1 Gb/s - meets CPRI v6.1 and JESD204B subclass 1 requirements for ADC/DAC interfacing |
| I/O Standards | LVDS, SSTL, HSTL, TMDS - allows direct connection to image sensors, memory, and high-speed SerDes PHYs |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with 1.0 ns setup/hold margin |
| Operating Temp | -40°C to +100°C - qualified for industrial and avionics environmental stress screening |
Pinout & Package
XC7V585T-2FFG1157I is housed in a 1157-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, thermal lid, and exposed thermal pad for conduction cooling in high-power density applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% input powering CLBs, DSPs, and interconnect; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for configuration logic, PCIe hard IP, and transceiver reference clocks |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated rail for MGT analog circuitry; isolated from digital supplies |
| HR_IO | High-range I/O bank | Supports 1.2–3.3 V signaling; configurable per bank for mixed-voltage board interfaces |
| CLK_IN | Dedicated clock input | Differential pair with programmable termination; feeds MMCM/PLL for jitter cleaning and frequency synthesis |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 | Reduces RTL integration effort and ensures compliance with ECN 2.0 electrical specs and LTSSM state machine |
| AXI4-Interconnect | Enables seamless integration of custom accelerators with ARM-based soft processors or external SoCs via standardized bus protocol |
| Partial Reconfiguration | Allows runtime swapping of logic partitions without resetting system operation-critical for adaptive waveform radios |
| UltraScale-compatible toolflow | Supports Vivado 2022.2+ with deterministic place-and-route and timing-aware synthesis for production signoff |
| Industrial temp grade | Validated across full -40°C to +100°C range with derated timing margins per Xilinx DS182 rev 4.0 |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and SAR image reconstruction pipelines with sub-microsecond latency. Use Value: 2,800 DSP slices and 13.1 Gb/s transceivers enable simultaneous 16-channel ADC sampling at 250 MSPS with JESD204B subclass 1 alignment. | Use Scenario: High-throughput CT scanner data aggregation and preprocessing before GPU-based reconstruction. IC Role / Device Role / Timing Role: Acts as a deterministic front-end interface between 64-channel analog front-end ASICs and PCIe Gen3 host interface. Use Value: Hardened PCIe Gen3 x8 and 36.4 Mb block RAM allow sustained 7.8 GB/s DMA throughput with zero-copy buffer management. |
| Avionics Data Concentrator | 5G Massive MIMO Radio Unit |
Use Scenario: ARINC 664 (AFDX) end-system node consolidating sensor telemetry, flight control, and health monitoring data. IC Role / Device Role / Timing Role: Implements time-triggered AFDX endpoint with hardware timestamping, traffic shaping, and redundancy switching logic. Use Value: -2 speed grade and industrial temperature qualification ensure deterministic 10 µs end-to-end latency under thermal cycling and EMI stress. | Use Scenario: Baseband processing unit in active antenna systems supporting 64T64R configurations. IC Role / Device Role / Timing Role: Performs real-time channel estimation, precoding matrix inversion, and OFDM symbol generation using fixed-point arithmetic pipelines. Use Value: 585,000 logic cells and dual-register flip-flops support >200 parallel FFT/IFFT engines operating at 400 MHz clock domain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 16 nm UltraScale+ architecture; higher DSP density (5,520 slices); lower static power; no native CPRI support | Better suited for AI inference acceleration and 400G Ethernet line cards; lacks CPRI v6.1 PHY hardening | Select when migrating to newer process node with emphasis on power efficiency and ML workload support |
| XC7VX690T-2FFG1927I | Same 28 nm Virtex-7 family; larger logic capacity (690K LC); 1927-ball FFG package; higher I/O count (850) | Required for designs needing >585K logic cells or >700 user I/Os; incompatible PCB footprint | Choose only if additional fabric resources or I/O bandwidth exceed XC7V585T-2FFG1157I capabilities |
Compared with XC7V585T-2FFG1157I, the XCKU115-2FLVD1517I offers superior power efficiency and compute density but requires redesign for CPRI-based radio units, while the XC7VX690T-2FFG1927I retains identical toolflow and IP compatibility but mandates mechanical rework due to larger package size and different ball map.
Availability
XC7V585T-2FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and 5G massive MIMO radio units requiring stable component supply across extended product lifecycles.
Supply support for XC7V585T-2FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications through its acquired Xilinx business.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense electronics, scientific instrumentation, and wired/wireless infrastructure where deterministic timing and transceiver performance are critical.
FAQ
What is the maximum transceiver line rate supported by XC7V585T-2FFG1157I?
The XC7V585T-2FFG1157I supports a maximum transceiver line rate of 13.1 Gb/s per lane, validated per Xilinx DS182 specification for multi-gigabit transceivers. This enables compliance with JESD204B subclass 1 and CPRI v6.1 standards. The XC7V585T-2FFG1157I achieves this using dedicated analog PLLs and adaptive equalization circuitry within each MGT quad.
Does XC7V585T-2FFG1157I support partial reconfiguration?
Yes, XC7V585T-2FFG1157I fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic logic module swaps without system reset. This capability is implemented in hardware via frame-based configuration access and verified in Xilinx UG909. The XC7V585T-2FFG1157I uses dedicated configuration port logic to isolate reconfigurable partitions from static regions during runtime.
What I/O standards are supported on XC7V585T-2FFG1157I HR banks?
XC7V585T-2FFG1157I HR (High-Range) I/O banks support LVDS, SSTL-18/25, HSTL-I/II, and TMDS signaling standards with programmable drive strength and on-die termination. Each HR bank operates independently at voltages from 1.2 V to 3.3 V. The XC7V585T-2FFG1157I datasheet specifies these capabilities in Table 14 of DS182 rev 4.0.
Is XC7V585T-2FFG1157I qualified for industrial temperature operation?
Yes, XC7V585T-2FFG1157I is rated for industrial temperature range (-40°C to +100°C) and undergoes extended burn-in and thermal cycling validation per Xilinx quality protocol Q0012. The XC7V585T-2FFG1157I maintains timing closure and functional integrity across this range, with derated speed grade -2 performance guaranteed per DS182.
What PCIe generation and width does XC7V585T-2FFG1157I support?
XC7V585T-2FFG1157I integrates hardened PCIe Gen3 endpoints supporting x1, x2, x4, and x8 widths with full LTSSM implementation and ECN 2.0 compliance. The XC7V585T-2FFG1157I achieves 7.877 GB/s aggregate bandwidth in x8 mode and supports advanced features including ASPM L0s/L1, AER, and MSI-X interrupt handling.
XC7V585T-2FFG1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45525
- Number of Logic Elements/Cells:
- 582720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7V585T-2FFG1157I FAQ
1.How can I place an order for XC7V585T-2FFG1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V585T-2FFG1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V585T-2FFG1157I reliable?
The price and inventory of XC7V585T-2FFG1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-2FFG1157I is usually 5 days.
3.What payment methods are accepted for XC7V585T-2FFG1157I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-2FFG1157I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V585T-2FFG1157I?
XC7V585T-2FFG1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V585T-2FFG1157I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V585T-2FFG1157I?
For technical support, including XC7V585T-2FFG1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-2FFG1157I requirements.
6.How does Aetrix verify that XC7V585T-2FFG1157I is sourced from the original manufacturer or authorized distributors?
All XC7V585T-2FFG1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-2FFG1157I meets industry standards.
7.What is the process for return or replacement of XC7V585T-2FFG1157I?
All XC7V585T-2FFG1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-2FFG1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V585T-2FFG1157I part is unused and in its original packaging.
Return procedure for XC7V585T-2FFG1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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