AMD XC7V585T-2FFG1761C

Overview

XC7V585T-2FFG1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 585,000 logic cells, 2,850 DSP slices, and 4,032 kbits of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s and supports PCI Express Gen3 x8 endpoint/root complex functionality. It is used in high-speed data acquisition systems requiring deterministic latency and multi-gigabit serial connectivity.

For engineers reviewing the XC7V585T-2FFG1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility (1.2 V to 3.3 V), and thermal performance under sustained 28 nm process power density.

Technical Context

The XC7V585T-2FFG1761C implements a segmented architecture with CLB-based logic, dedicated DSP48E1 slices for arithmetic-intensive tasks, and UltraScale-compatible configuration logic. It integrates SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.

Its configuration interface includes dual BPI and JTAG modes, and it supports partial reconfiguration via ICAP. The device uses a 1.0 V core supply with separate 1.8 V auxiliary and 1.2–3.3 V I/O supplies, enabling mixed-voltage system integration.

Key Specifications

Pinout & Package

XC7V585T-2FFG1761C is housed in a 1761-pin flip-chip BGA (FFG1761) package with integrated thermal lid, 1.0 mm ball pitch, and 35×35 mm footprint. Pin functions are organized into 24 I/O banks, each supporting independent VCCO and VREF settings.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7V585T-2FFG1761C, XCVU9P-2FLGA2104I offers architectural advancement and power efficiency but requires redesign for PCIe integration, while XC7VX690T-2FFG1927C delivers incremental logic scaling within the same family at the cost of increased board area and thermal load.

Availability

XC7V585T-2FFG1761C is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and medical imaging backend systems requiring stable component supply across extended production lifecycles.

Supply support for XC7V585T-2FFG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA solutions for datacenter, aerospace, and industrial markets.

The Virtex-7 family was designed for bandwidth-intensive, low-latency applications including wired/wireless infrastructure, defense electronics, and scientific instrumentation.

FAQ

What is the maximum supported transceiver data rate for XC7V585T-2FFG1761C?

The XC7V585T-2FFG1761C supports GT transceivers operating up to 13.1 Gb/s. This rate is validated under specified voltage (0.95 V core) and temperature (100°C junction) conditions per the -2 speed grade. Applications such as 10G Ethernet and CPRI use this full rate with appropriate reference clock jitter compliance.

Does XC7V585T-2FFG1761C include hard IP for PCI Express Gen3?

Yes, XC7V585T-2FFG1761C integrates a hardened PCI Express Gen3 x8 endpoint/root complex block. It supports both link training and configuration space access via AXI4-Lite, and includes MSI-X interrupt capability. This eliminates the need for soft-core PCIe implementations and reduces logic utilization.

What I/O standards are supported by XC7V585T-2FFG1761C?

XC7V585T-2FFG1761C supports SSTL, HSTL, LVCMOS, LVDS, TMDS, and differential signaling standards across its 24 I/O banks. Each bank operates independently with selectable VCCO (1.2–3.3 V) and programmable output drive strength, enabling mixed-standard interfaces on a single device.

Is partial reconfiguration supported on XC7V585T-2FFG1761C?

Yes, XC7V585T-2FFG1761C supports partial reconfiguration through the ICAP interface. Verified designs demonstrate dynamic swapping of logic modules-such as filter banks or protocol engines-without resetting the entire device or disrupting active I/O or memory interfaces.

What is the thermal design power (TDP) range for XC7V585T-2FFG1761C under typical operation?

XC7V585T-2FFG1761C exhibits a typical TDP range of 18–26 W depending on logic utilization, transceiver activity, and I/O switching frequency. Thermal modeling assumes 100°C junction temperature and use of the integrated thermal lid in the FFG1761 package with standard 4-layer PCB layout.