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AMD XC7V585T-2FFG1761I
- Part No.:
- XC7V585T-2FFG1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7V585T-2FFG1761I.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,216
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Product details
Overview
XC7V585T-2FFG1761I from AMD is a high-performance 28 nm FPGA with 585,000 logic cells, 2,850 DSP slices, and 36.4 Mb of block RAM, configured in a 1761-pin Flip-Chip Fine-Pitch BGA (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7V585T-2FFG1761I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -2 speed grade timing performance under industrial temperature range (-40°C to +100°C).
Technical Context
The XC7V585T-2FFG1761I implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint, 16 GTX transceivers, and hardened AXI interconnect fabric. It supports partial reconfiguration and dual-boot configuration via Quad-SPI or BPI flash interfaces.
Its clocking system includes 24 MMCMs and 12 PLLs with sub-150 fs jitter, enabling deterministic low-latency timing for multi-gigabit serial protocols including SRIO 2.1 and CPRI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 585,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 2,850 - fixed-point and floating-point arithmetic units supporting 25 × 18-bit multiply-accumulate per slice |
| Block RAM | 36.4 Mb - distributed as 1,820 × 20 Kb blocks for on-chip data buffering and FIFOs |
| Transceivers | 16 GTX - each supports 600 Mb/s to 13.1 Gb/s line rates with built-in 8B/10B and 64B/66B encoding |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, TMDS - supports mixed-voltage banks (1.2 V to 3.3 V) |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial and aerospace-adjacent environments |
Pinout & Package
XC7V585T-2FFG1761I is housed in a 1761-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, thermal lid, and controlled impedance routing support for high-speed differential signaling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA logic and CLB circuitry |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration, clock management, and transceiver analog circuitry |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-signal interfacing |
| MRCC / SRCC | Dedicated clock input | Multi-Region Clock Capable / Single-Region Clock Capable inputs for low-skew global clock distribution |
| GTXREFCLK | Transceiver reference clock | Differential input driving GTX transceiver PLLs with <150 fs RMS jitter requirement |
| PROGRAM_B | Configuration control | Active-Low asynchronous reset initiating full reconfiguration from external memory |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hard IP block delivering 7.88 GB/s bidirectional throughput without soft-core overhead |
| Partial Reconfiguration | Enables dynamic logic swapping during operation, reducing system downtime in mission-critical systems |
| AXI Interconnect Fabric | Hardened 64-bit AXI4/AXI4-Lite crossbar supporting concurrent master-slave transactions across multiple clock domains |
| UltraScale SelectIO | Programmable I/O with source-synchronous timing, adjustable drive strength, and on-die termination up to 120 Ω |
| Dual-Boot Configuration | Supports fail-safe firmware update via two independent bitstreams stored in external flash |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms while GTX transceivers interface with ADC/DAC JESD204B links. Use Value: 13.1 Gb/s transceiver line rate enables direct connection to 16-bit, 500 MSPS ADCs without serialization bottlenecks. | Use Scenario: Multi-channel oscilloscope front-end capturing synchronized analog waveforms at 1 GS/s per channel. IC Role / Device Role / Timing Role: Configurable logic manages sample buffering, trigger arbitration, and PCIe Gen3 streaming to host PC memory. Use Value: 36.4 Mb block RAM provides >10 ms of full-rate waveform storage at 1 GS/s before host transfer. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: CT scanner image reconstruction pipeline aggregating detector data from 256+ channels over LVDS links. IC Role / Device Role / Timing Role: AXI interconnect routes parallel detector streams to multiple DSP slices for real-time back-projection. Use Value: 2,850 DSP slices deliver >2 TFLOPS peak FP16 throughput for iterative reconstruction algorithms. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B gateway consolidating sensor telemetry in flight control computers. IC Role / Device Role / Timing Role: Hardened PCIe endpoint and dual Ethernet MACs manage deterministic packet scheduling and time-stamped logging. Use Value: -2 speed grade ensures sub-50 ns timing margin for AFDX end-to-end latency compliance at 100 Mbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | Higher logic density (1.3M LC), 20 GTY transceivers, 16.3 Gb/s line rate, but larger 1924-pin package | Better suited for next-gen 5G baseband or AI inference acceleration requiring >1 TFLOPS DSP throughput | Select when higher transceiver bandwidth or logic capacity justifies PCB redesign and thermal budget increase |
| XC7K410T-2FFG901I | Lower logic count (405K LC), 12 GTX transceivers, same -2 speed grade and industrial temp rating | Targeted at cost-sensitive radar subsystems where 585K LC overcapacity is unnecessary | Choose for legacy-compatible designs needing identical I/O voltage support and timing behavior with reduced BOM cost |
Compared with XC7V585T-2FFG1761I, XCKU115-2FLVD1924I offers greater scalability for bandwidth-intensive workloads, while XC7K410T-2FFG901I provides verified timing equivalence in smaller form factor-enabling tiered design reuse across product families.
Availability
XC7V585T-2FFG1761I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply across extended industrial temperature ranges.
Supply support for XC7V585T-2FFG1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications through its Adaptive SoC and FPGA portfolio.
The Virtex-7 family, including XC7V585T-2FFG1761I, was engineered for high-throughput, low-latency signal processing in defense electronics, scientific instrumentation, and real-time imaging systems.
FAQ
What is the maximum transceiver line rate supported by XC7V585T-2FFG1761I?
The XC7V585T-2FFG1761I supports GTX transceivers with a maximum line rate of 13.1 Gb/s. This specification is validated across all 16 transceiver quads under industrial temperature conditions (-40°C to +100°C) and is documented in the Virtex-7 DC and Switching Characteristics datasheet (DS182). The XC7V585T-2FFG1761I achieves this using 20-bit gearbox mode with 64B/66B encoding and internal clock correction.
Does XC7V585T-2FFG1761I support partial reconfiguration?
Yes, XC7V585T-2FFG1761I fully supports partial reconfiguration through Vivado Design Suite v2018.2 and later. The XC7V585T-2FFG1761I implements dedicated configuration logic and frame-based bitstream partitioning that allows dynamic replacement of designated logic regions without disrupting active functions such as PCIe link maintenance or transceiver lock.
What I/O standards are compatible with XC7V585T-2FFG1761I?
XC7V585T-2FFG1761I supports LVDS, LVCMOS (1.2 V to 3.3 V), SSTL-15/18, HSTL-I/II, and TMDS across independently powered I/O banks. Each bank's VCCO voltage is configurable, allowing mixed-standard interfaces on a single device. The XC7V585T-2FFG1761I also supports source-synchronous timing with programmable input delay and IDELAYE2/ODELAYE2 primitives.
Is XC7V585T-2FFG1761I qualified for industrial temperature operation?
Yes, XC7V585T-2FFG1761I is rated for industrial temperature operation from -40°C to +100°C. This qualification is confirmed in the Virtex-7 FPGA Packaging and Pinout Product Specification (UG475), where the "I" suffix explicitly denotes industrial-grade thermal and reliability testing, including extended burn-in and HTOL stress screening.
What configuration modes does XC7V585T-2FFG1761I support?
XC7V585T-2FFG1761I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Dual-boot capability is implemented via two independent bitstream images stored in external Quad-SPI flash, enabling fail-safe updates. The XC7V585T-2FFG1761I also supports fallback configuration upon CRC error detection during boot.
XC7V585T-2FFG1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 T
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45525
- Number of Logic Elements/Cells:
- 582720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7V585T-2FFG1761I FAQ
1.How can I place an order for XC7V585T-2FFG1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7V585T-2FFG1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7V585T-2FFG1761I reliable?
The price and inventory of XC7V585T-2FFG1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7V585T-2FFG1761I is usually 5 days.
3.What payment methods are accepted for XC7V585T-2FFG1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7V585T-2FFG1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7V585T-2FFG1761I?
XC7V585T-2FFG1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7V585T-2FFG1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7V585T-2FFG1761I?
For technical support, including XC7V585T-2FFG1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7V585T-2FFG1761I requirements.
6.How does Aetrix verify that XC7V585T-2FFG1761I is sourced from the original manufacturer or authorized distributors?
All XC7V585T-2FFG1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7V585T-2FFG1761I meets industry standards.
7.What is the process for return or replacement of XC7V585T-2FFG1761I?
All XC7V585T-2FFG1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7V585T-2FFG1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7V585T-2FFG1761I part is unused and in its original packaging.
Return procedure for XC7V585T-2FFG1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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