AMD XC7V585T-3FFG1761E

Overview

XC7V585T-3FFG1761E from AMD is a high-performance 28 nm Virtex-7 FPGA with 585,000 logic cells, 36.4 Mb of block RAM, and support for 28.05 Gb/s GTY transceivers. It features 1,761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging and targets high-speed serial interface and signal processing applications in radar and test equipment.

For engineers reviewing the XC7V585T-3FFG1761E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade (-3), I/O voltage support (1.2 V to 1.8 V), thermal performance in FFG1761 package, and configuration via Master SPI or JTAG.

Technical Context

The XC7V585T-3FFG1761E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and DSP48E1 slices optimized for high-throughput arithmetic. It integrates 48 GTY transceivers capable of 28.05 Gb/s line rates with built-in PRBS generation and error detection.

Configuration is supported through dual-mode (Master SPI/JTAG) with bitstream encryption and SEU mitigation using internal ECC on configuration memory. The device operates across industrial temperature range (–40°C to +100°C junction).

Key Specifications

Pinout & Package

XC7V585T-3FFG1761E uses a 1,761-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal dissipation in high-power FPGA applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7V585T-3FFG1761E, XCVU9P-2FLGA2104E delivers higher serial bandwidth but increases system power and cost, while XC7VX690T-3FFG1927I offers more logic in the same architecture but mandates mechanical redesign.

Availability

XC7V585T-3FFG1761E is available at Aetrix Electronics and suitable for radar signal processing, high-speed test instrumentation, and avionics data concentrators requiring stable component supply and long-term industrial lifecycle support.

Supply support for XC7V585T-3FFG1761E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex-7 family was engineered for high-bandwidth, low-latency signal and packet processing in defense, aerospace, and scientific instrumentation applications.

FAQ

What is the maximum transceiver line rate supported by XC7V585T-3FFG1761E?

The XC7V585T-3FFG1761E supports a maximum GTY transceiver line rate of 28.05 Gb/s. This specification is guaranteed under the -3 speed grade and applies to all 48 GTY transceivers. The XC7V585T-3FFG1761E achieves this performance with built-in equalization and clock-data recovery circuitry, enabling compliance with protocols such as 100G Ethernet CAUI-4 and CPRI Option 10.

Does XC7V585T-3FFG1761E support configuration via JTAG?

Yes, XC7V585T-3FFG1761E supports JTAG configuration as one of its dual-mode configuration options, alongside Master SPI. JTAG is used for boundary-scan testing, debugging, and in-system programming. The XC7V585T-3FFG1761E implements IEEE 1149.1 compliance and supports TAP controller access to configuration registers and status monitoring.

What I/O standards are compatible with XC7V585T-3FFG1761E?

XC7V585T-3FFG1761E supports LVCMOS, SSTL, HSTL, and differential standards including LVDS and BLVDS across its I/O banks. Each bank is independently configurable for VCCO between 1.2 V and 1.8 V. The XC7V585T-3FFG1761E does not support 3.3 V I/O standards natively and requires level-shifting for legacy interfaces.

Is XC7V585T-3FFG1761E qualified for industrial temperature operation?

Yes, XC7V585T-3FFG1761E is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This rating is verified per AMD's qualification standards and applies to the FFG1761 package variant. The XC7V585T-3FFG1761E is commonly deployed in radar, test equipment, and avionics where extended thermal stability is required.

How many block RAM bits does XC7V585T-3FFG1761E provide?

XC7V585T-3FFG1761E provides 36.4 Mb of total block RAM capacity, implemented as 1,820 × 36-Kb BRAM primitives. These resources are distributed across the FPGA fabric and support true dual-port, registered read/write, and cascade chaining. The XC7V585T-3FFG1761E uses this RAM for deep buffering, coefficient storage, and on-chip FIFOs in high-throughput signal processing pipelines.