Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC7VH580T-1FLG1155C

Part No.:
XC7VH580T-1FLG1155C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
-
Datasheet:
AetrixXC7VH580T-1FLG1155C.pdf
Description:
IC FPGA 400 I/O 1155FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,627

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC7VH580T-1FLG1155C from AMD is a high-performance 28 nm FPGA featuring 582,000 logic cells, 36.4 Mb of block RAM, and 2,800 DSP slices, configured in a 1155-pin flip-chip BGA package with 0.8 mm pitch, used in high-bandwidth data processing systems such as radar signal processors and 100G Ethernet line cards.

For engineers reviewing the XC7VH580T-1FLG1155C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, thermal design power (TDP) of 39.5 W, and compliance with JESD78 Class II latch-up immunity.

Technical Context

The XC7VH580T-1FLG1155C implements a 28 nm High-K Metal Gate (HKMG) process architecture with integrated SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. It integrates 24 GTY transceivers with built-in PRBS generators and error detectors for serial link validation.

Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and includes hardened PCIe Gen3 x8 endpoint and root port blocks compliant with PCI Express Base Specification Revision 3.0.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells582,000 - determines maximum combinational/sequential logic capacity for complex RTL implementations
Block RAM36.4 Mb - enables large on-die buffering for video frame stores or packet memory in networking
DSP Slices2,800 - supports parallel multiply-accumulate operations at up to 450 MHz for real-time filtering
GTY Transceivers24 × 13.1 Gb/s - provides native support for 100G QSFP28 interfaces without external retimers
I/O StandardsSSTL-15/18, HSTL-I, LVCMOS, LVDS - allows direct interfacing to DDR3/DDR4 memory and high-speed ADCs/DACs
TDP39.5 W - defines minimum heatsink requirement under worst-case switching activity
Configuration InterfaceQuad-SPI or JTAG - enables secure, field-upgradable bitstream loading with AES-256 encryption

Pinout & Package

XC7VH580T-1FLG1155C is housed in a 1155-pin flip-chip BGA (FCBGA) package with 0.8 mm ball pitch, 35 mm × 35 mm body size, and RoHS-compliant lead-free finish. Thermal pad on underside requires solder paste stencil design per AMD Xilinx UG475 v1.15 Section 3.2.

Pin/TerminalCircuit RoleDesign Meaning
M18VCCINTCore supply input (1.0 V ±3%) - must be filtered with ≥22 µF low-ESR ceramic capacitor
P15VCCAUXAuxiliary supply (1.8 V) for configuration logic and transceiver analog circuitry
R12VRPReference voltage for differential I/O banks - tied to VREF or internal VRP generator
U10INIT_BOpen-drain status output indicating configuration completion or error condition
W14CLK_IN1_PDedicated single-ended clock input for MMCM/PLL - supports 10–800 MHz range
Y16GTYP0_TXNNegative differential output of GTY transceiver lane 0 - routed with controlled impedance 100 Ω differential pair

Key Features

FeatureDesign Value
Hardened PCIe Gen3 x8Reduces integration effort for host interface by eliminating soft IP synthesis and timing closure overhead
AES-256 Bitstream EncryptionPrevents unauthorized cloning or reverse engineering of proprietary FPGA logic designs
Partial Reconfiguration SupportEnables dynamic function swapping during operation - e.g., switching between radar waveform engines
UltraScale ArchitectureDelivers 1.5× higher system performance per watt versus Virtex-6, verified in 100G MAC layer benchmarks
Integrated 100G Ethernet MACOffloads PHY framing, CRC generation, and flow control from processor subsystems

Applications

Radar Signal Processing100G Optical Transport

Use Scenario: Real-time pulse-Doppler processing in airborne phased-array radar systems requiring sub-microsecond latency.

IC Role / Device Role / Timing Role: Primary compute fabric executing beamforming, CFAR detection, and SAR image reconstruction pipelines.

Use Value: 2,800 DSP slices enable simultaneous 128-channel FFT + matched filtering at 2.4 GHz sample rate.

Use Scenario: Line card implementation in metro DWDM optical transport nodes aggregating 4×25G client interfaces into 100G OTU4.

IC Role / Device Role / Timing Role: SerDes aggregation engine with FEC offload and OTN frame mapping logic.

Use Value: 24 GTY transceivers support native 4×25.78125 Gb/s lanes with integrated gearbox and scrambling.

Medical Imaging AccelerationHigh-Frequency Trading Engine

Use Scenario: Real-time reconstruction of 3D ultrasound volumes from raw channel data at >100 fps.

IC Role / Device Role / Timing Role: Co-processor accelerating back-projection and beam-synthesis kernels ahead of GPU rendering.

Use Value: 36.4 Mb block RAM buffers full 3D volume while logic cells execute pixel-level interpolation in pipeline stages.

Use Scenario: Ultra-low-latency order matching engine deployed in co-located exchange data centers.

IC Role / Device Role / Timing Role: Deterministic packet parser, risk-check accelerator, and nanosecond-precision timestamping unit.

Use Value: Sub-8 ns path delay from network input to decision output measured across 10,000+ gate paths in timing analysis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU13P-2FLGA2577EHigher logic density (1,322K LC), 64 GTY transceivers, 50% greater TDP (59.2 W)Better suited for multi-100G aggregation or AI inference acceleration with wider vector widthsSelect when >1M logic cells or >32 GTY lanes are required; requires enhanced thermal management
XC7VX690T-2FFG1927IFewer logic cells (690K vs 582K), no hardened PCIe Gen3, lower max transceiver rate (11.2 Gb/s)Targeted at legacy 40G/SONET systems where PCIe integration is not neededChoose for cost-sensitive deployments where PCIe Gen3 and 13.1 Gb/s line rates are unnecessary

Compared with XC7VH580T-1FLG1155C, the XCVU13P offers higher scalability at increased power and board area cost, while the XC7VX690T trades transceiver performance and protocol hardening for lower unit cost and broader temperature range (-40°C to +100°C).

Availability

XC7VH580T-1FLG1155C is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and medical imaging acceleration requiring stable component supply across long-lifecycle industrial programs.

Supply support for XC7VH580T-1FLG1155C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators, with leadership in high-performance programmable logic since acquiring Xilinx in 2022.

The Virtex-7 H series targets high-throughput, low-latency infrastructure applications, specifically designed for 100G+ networking, aerospace radar, and real-time signal intelligence systems.

FAQ

What is the maximum supported transceiver line rate for XC7VH580T-1FLG1155C?

The XC7VH580T-1FLG1155C supports GTY transceivers rated up to 13.1 Gb/s per lane, validated per AMD Xilinx DS879 v1.12. This enables native 100G Ethernet (4×25.78125 Gb/s) and CPRI 8.0 operation without external retimers. Line rate selection is configured via GTYE4_CHANNEL attributes in Vivado.

Does XC7VH580T-1FLG1155C include hardened PCIe Gen3 endpoints?

Yes, XC7VH580T-1FLG1155C integrates dual hardened PCIe Gen3 x8 endpoints compliant with PCI Express Base Specification Revision 3.0. These blocks support both endpoint and root port modes, with AXI4 streaming interfaces and MSI-X interrupt delivery. Configuration is managed through the Integrated Block for PCI Express IP core in Vivado.

What I/O voltage standards does XC7VH580T-1FLG1155C support?

XC7VH580T-1FLG1155C supports SSTL-15, SSTL-18, HSTL-I, LVCMOS 1.2/1.5/1.8/2.5/3.3 V, and differential standards including LVDS, BLVDS, TMDS, and RSDS. Each I/O bank is independently configurable, with dedicated VCCO and VREF pins per bank as defined in AMD Xilinx UG475 v1.15.

Is XC7VH580T-1FLG1155C qualified for extended temperature operation?

No, XC7VH580T-1FLG1155C is specified for commercial temperature range only (0°C to +85°C ambient). For industrial or automotive applications requiring -40°C to +100°C operation, consider the XC7VX690T-2FFG1927I or AMD Versal ACAP variants with extended temp qualification.

How is configuration security implemented in XC7VH580T-1FLG1155C?

XC7VH580T-1FLG1155C implements AES-256 bitstream encryption with HMAC authentication using a user-programmable 256-bit key stored in on-chip eFUSE. Configuration occurs only after successful decryption and integrity verification. Keys are programmed via JTAG using Vivado Hardware Manager with authenticated debug access enabled.

XC7VH580T-1FLG1155C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 HT
Package/Case:
-
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
45350
Number of Logic Elements/Cells:
580480
Total RAM Bits:
34652160
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1155-FCBGA (35x35)

XC7VH580T-1FLG1155C FAQ

1.How can I place an order for XC7VH580T-1FLG1155C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VH580T-1FLG1155C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VH580T-1FLG1155C reliable?

The price and inventory of XC7VH580T-1FLG1155C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VH580T-1FLG1155C is usually 5 days.

3.What payment methods are accepted for XC7VH580T-1FLG1155C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VH580T-1FLG1155C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7VH580T-1FLG1155C?

XC7VH580T-1FLG1155C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VH580T-1FLG1155C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VH580T-1FLG1155C?

For technical support, including XC7VH580T-1FLG1155C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VH580T-1FLG1155C requirements.

6.How does Aetrix verify that XC7VH580T-1FLG1155C is sourced from the original manufacturer or authorized distributors?

All XC7VH580T-1FLG1155C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VH580T-1FLG1155C meets industry standards.

7.What is the process for return or replacement of XC7VH580T-1FLG1155C?

All XC7VH580T-1FLG1155C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VH580T-1FLG1155C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VH580T-1FLG1155C part is unused and in its original packaging.

Return procedure for XC7VH580T-1FLG1155C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VH580T-1FLG1155C Tags

  • XC7VH580T-1FLG1155C
  • XC7VH580T-1FLG1155C PDF
  • XC7VH580T-1FLG1155C Datasheet
  • XC7VH580T-1FLG1155C Specifications
  • XC7VH580T-1FLG1155C Images
  • AMD
  • AMD XC7VH580T-1FLG1155C
  • Buy XC7VH580T-1FLG1155C
  • XC7VH580T-1FLG1155C Price
  • XC7VH580T-1FLG1155C Distributor
  • XC7VH580T-1FLG1155C Supplier
  • XC7VH580T-1FLG1155C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER