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AMD XC7VH580T-2FLG1155C
- Part No.:
- XC7VH580T-2FLG1155C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- -
- Datasheet:
-
XC7VH580T-2FLG1155C.pdf
- Description:
- IC FPGA 400 I/O 1155FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC7VH580T-2FLG1155C from AMD is a high-performance 28 nm Virtex-7 FPGA with 582,000 logic cells, 2,850 DSP slices, and 4,880 kbit of block RAM. It features 600 GT transceivers operating up to 13.1 Gb/s and supports PCIe Gen3 x8, DDR3-1866, and 10G Ethernet in telecom infrastructure and radar signal processing.
For engineers reviewing the XC7VH580T-2FLG1155C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, logic density, I/O voltage support (1.2–1.8 V), and thermal performance in air-cooled 1155-pin flip-chip BGA packages.
Technical Context
The XC7VH580T-2FLG1155C implements a 28 nm HPL (High-Performance Low-Power) process architecture with configurable logic blocks (CLBs), hardened IP blocks for PCIe Gen3, 10GbE MAC, and memory controllers. It supports partial reconfiguration and AXI4 interconnects for heterogeneous system integration.
Its I/O bank structure includes 36 banks supporting LVDS, SSTL, HSTL, and TMDS signaling, with programmable slew rate and drive strength per pin. The device integrates dual 600 MHz ARM Cortex-A9 MPCore processors only in Zynq-7000 series-not applicable here.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 582,000 - determines maximum combinational/sequential logic capacity for complex digital functions |
| DSP Slices | 2,850 - enables parallel fixed/floating-point computation for radar FFTs or video encoding |
| Block RAM | 4,880 kbit - provides on-chip memory for buffering, FIFOs, or lookup tables without external SRAM |
| GT Transceivers | 600 units, up to 13.1 Gb/s - supports multi-lane serial protocols including CPRI, JESD204B, and 10GBase-R |
| I/O Pins | 500 user-configurable - compatible with 1.2 V, 1.35 V, 1.5 V, and 1.8 V interfaces across 36 banks |
| Package | FLG1155 - 1155-pin flip-chip BGA, 35 × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal pad exposed |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (100°C) and VCCINT = 0.95 V |
Pinout & Package
XC7VH580T-2FLG1155C uses the FLG1155 package: 1155-ball flip-chip BGA with 35 × 35 mm body, 0.8 mm pitch, and thermal pad. Pinout follows Xilinx/AMD Virtex-7 pin mapping standard for HPC/HSC I/O banks and dedicated configuration/GT power pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (0.95 V ±3%) - must be filtered within 1 cm of ball with ≥10 µF low-ESR ceramic |
| K14 | VCCAUX | Auxiliary supply (1.8 V) for configuration, clocking, and GT reference - requires separate regulation |
| M20 | INIT_B | Open-drain status output - asserts low during configuration error or CRC mismatch |
| P17 | CCLK | Configuration clock input - drives internal shift register during master SPI mode |
| Y15 | GTGREFCLK0 | Dedicated differential reference clock input for GT transceivers - supports 100–800 MHz range |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HPL process | Enables higher logic density and lower dynamic power vs. 40 nm Virtex-6, critical for SWaP-constrained radar systems |
| Hardened PCIe Gen3 x8 controller | Reduces RTL overhead and timing risk for host interface - no soft-core licensing or verification required |
| 600 GT transceivers | Supports 12× 10.3125 Gb/s lanes for JESD204B Class 2 ADC/DAC links in phased-array receivers |
| Partial reconfiguration | Allows runtime logic swap (e.g., waveform-specific filters) without full FPGA reset or system interruption |
| AXI4 interconnect fabric | Provides standardized, pipelined, burst-capable bus protocol for integrating custom IP with hard IP blocks |
Applications
| Radar Signal Processing | 5G Baseband Unit (BBU) |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar. IC Role / Device Role / Timing Role: High-throughput data path orchestrator-ingests ADC samples via JESD204B, executes FFTs in DSP slices, and outputs processed targets via PCIe Gen3 to host CPU. Use Value: 600 GT transceivers enable 24-lane JESD204B capture from 12× RF front-ends; 582K logic cells host parallel filter banks and CFAR detection logic. | Use Scenario: Layer 1 PHY acceleration and fronthaul interface aggregation in massive MIMO base stations. IC Role / Device Role / Timing Role: Baseband processor-implements OFDM modulation/demodulation, channel coding, and CPRI/eCPRI mapping using hardened IP and programmable logic. Use Value: 2,850 DSP slices accelerate 5G NR LDPC decoding; GT transceivers support 8× 10G CPRI links to remote radio units. |
| Test & Measurement Equipment | High-Speed Data Acquisition |
Use Scenario: Multi-channel oscilloscope with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: Real-time signal conditioner-synchronizes ADCs, applies digital down-conversion, and buffers waveform data in block RAM before PCIe upload. Use Value: 4,880 kbit block RAM serves as deep acquisition memory; -2 speed grade ensures deterministic timing at 500 MHz system clock. | Use Scenario: Aerospace telemetry recorder capturing sensor streams from inertial measurement units and avionics buses. IC Role / Device Role / Timing Role: Protocol bridge and aggregator-converts ARINC 429, MIL-STD-1553, and CAN FD into unified time-stamped packets over 10G Ethernet. Use Value: 36 I/O banks support mixed-voltage legacy bus interfaces; GT transceivers provide deterministic 10GBase-KR link to ground station. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture, 1,128K logic cells, 5,520 DSP slices, 42 GTY transceivers up to 32.75 Gb/s | Higher bandwidth and AI-accelerated compute; requires new PCB layout due to 2577-pin FCBGA and different power sequencing | Select for next-gen 400G Ethernet or AI inference workloads where 13.1 Gb/s GT limit is insufficient |
| XC7VX690T-2FFG1927I | Virtex-7 family, same 28 nm node, but 690K logic cells, 3,600 DSP slices, 600 GTs, larger 1927-pin FFG package | Higher logic/DSP density and more I/Os; incompatible pinout and thermal profile - not drop-in | Choose when additional logic resources or I/O count are required, accepting board redesign and higher power draw |
Compared with XC7VH580T-2FLG1155C, the XCVU13P offers higher transceiver speed and logic density but demands new PCB design and power delivery; the XC7VX690T delivers more resources in the same technology node but requires mechanical and thermal requalification due to its larger package and higher TDP.
Availability
XC7VH580T-2FLG1155C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, high-speed test equipment, and aerospace data acquisition requiring stable component supply across long production lifecycles.
Supply support for XC7VH580T-2FLG1155C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications through acquired Xilinx FPGA technology.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense radar, wired communications, and scientific instrumentation where deterministic timing and hardened serial I/O are critical.
FAQ
What is the maximum supported transceiver data rate for XC7VH580T-2FLG1155C?
The XC7VH580T-2FLG1155C supports GT transceivers operating up to 13.1 Gb/s. This rate is validated for protocols including CPRI, JESD204B, and 10GBase-R. Performance depends on PCB stackup, reference clock jitter (<1.5 ps RMS), and termination compliance. The XC7VH580T-2FLG1155C datasheet specifies AC characteristics under -2 speed grade conditions at 100°C junction temperature.
Does XC7VH580T-2FLG1155C include integrated ARM processors?
No, the XC7VH580T-2FLG1155C is a pure FPGA without embedded processors. Unlike Zynq-7000 SoCs, it contains only programmable logic, DSP slices, block RAM, and GT transceivers. Any processor functionality must be implemented externally or as soft-core RTL. The XC7VH580T-2FLG1155C does not integrate ARM Cortex-A9 or MicroBlaze processors on-die.
What I/O standards are supported by XC7VH580T-2FLG1155C?
The XC7VH580T-2FLG1155C supports 36 I/O banks with LVDS, SSTL-15/18, HSTL-I/II, TMDS, and differential signaling. Each bank operates at 1.2 V, 1.35 V, 1.5 V, or 1.8 V. Single-ended standards include LVCMOS and LVTTL. The XC7VH580T-2FLG1155C does not support 2.5 V or 3.3 V I/O in this package variant per AMD's Virtex-7 DC and switching characteristics documentation.
Is XC7VH580T-2FLG1155C pin-compatible with other Virtex-7 devices?
No, XC7VH580T-2FLG1155C is not pin-compatible with other Virtex-7 devices due to unique FLG1155 ball map and I/O bank assignment. For example, XC7VX690T uses FFG1927 packaging with different power pin distribution and GT placement. Migration requires PCB redesign. The XC7VH580T-2FLG1155C pinout is fixed and documented in AMD UG475 v1.15.
What thermal management guidance applies to XC7VH580T-2FLG1155C?
XC7VH580T-2FLG1155C requires active airflow or heatsink mounting due to typical power dissipation of 18–25 W under full load. The FLG1155 package includes an exposed thermal pad that must be soldered to a solid copper thermal plane on PCB layer 2. Thermal resistance θJA is 12.5°C/W with 200 LFM airflow; derating is required above 85°C ambient. The XC7VH580T-2FLG1155C thermal solution must maintain junction temperature ≤100°C per speed grade -2 specification.
XC7VH580T-2FLG1155C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 HT
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 45350
- Number of Logic Elements/Cells:
- 580480
- Total RAM Bits:
- 34652160
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1155-FCBGA (35x35)
XC7VH580T-2FLG1155C FAQ
1.How can I place an order for XC7VH580T-2FLG1155C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VH580T-2FLG1155C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VH580T-2FLG1155C reliable?
The price and inventory of XC7VH580T-2FLG1155C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VH580T-2FLG1155C is usually 5 days.
3.What payment methods are accepted for XC7VH580T-2FLG1155C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VH580T-2FLG1155C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VH580T-2FLG1155C?
XC7VH580T-2FLG1155C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VH580T-2FLG1155C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VH580T-2FLG1155C?
For technical support, including XC7VH580T-2FLG1155C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VH580T-2FLG1155C requirements.
6.How does Aetrix verify that XC7VH580T-2FLG1155C is sourced from the original manufacturer or authorized distributors?
All XC7VH580T-2FLG1155C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VH580T-2FLG1155C meets industry standards.
7.What is the process for return or replacement of XC7VH580T-2FLG1155C?
All XC7VH580T-2FLG1155C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VH580T-2FLG1155C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VH580T-2FLG1155C part is unused and in its original packaging.
Return procedure for XC7VH580T-2FLG1155C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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