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AMD XC7VX1140T-1FLG1930I
- Part No.:
- XC7VX1140T-1FLG1930I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX1140T-1FLG1930I.pdf
- Description:
- IC FPGA 1100 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,673
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Product details
Overview
XC7VX1140T-1FLG1930I from AMD is a high-performance 28 nm FPGA with 1,182,240 logic cells, 6,800 DSP slices, and 56.5 Mb of block RAM, configured in a 1930-pin flip-chip BGA package with 1.0 V core voltage and -1 speed grade for demanding compute-acceleration and high-throughput data processing applications.
For engineers reviewing the XC7VX1140T-1FLG1930I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (72 GTH), I/O standard support (LVDS, SSTL, HSTL), thermal design power (32 W typical), and configuration interface (SPIx4, JTAG).
Technical Context
This Virtex-7 device integrates 72 multi-gigabit GTH transceivers operating up to 13.1 Gb/s, supporting PCIe Gen3 x8, 10G Ethernet, and CPRI protocols. It features SelectIO technology with programmable I/O standards across 600 user I/O pins and supports partial reconfiguration for dynamic function swapping.
The device uses a 28 nm HKMG process, includes hardened IP blocks for PCI Express Gen3, 10 Gigabit Ethernet MAC, and AXI interconnect, and implements dual-boot configuration with fallback capability via dedicated configuration pins and internal flash controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,240 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 6,800 - fixed-point arithmetic units with 25×18-bit multipliers and 48-bit accumulators |
| Block RAM | 56.5 Mb - distributed and block memory resources for on-chip buffering and data storage |
| GTH Transceivers | 72 × 13.1 Gb/s - high-speed serial links supporting PCIe Gen3, 10GbE, and CPRI |
| User I/O Pins | 600 - configurable single-ended and differential I/O supporting LVDS, SSTL-18, HSTL-I |
| Core Voltage | 1.0 V ±3% - nominal supply for logic fabric; requires tight regulation and low-noise PDN |
| Speed Grade | -1 - timing specification guaranteeing operation at maximum rated frequencies per device family |
Pinout & Package
XC7VX1140T-1FLG1930I is housed in a 1930-pin flip-chip ball grid array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, or JTAG) and configuration width during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; externally generated clock for master SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Initialization | Active-low signal indicating device readiness to accept configuration data |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and initiates reconfiguration sequence |
| GTHTXN/P, GTHRXP/N | Transceiver Differential I/O | High-speed serial lanes supporting 13.1 Gb/s signaling with integrated termination and equalization |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces integration effort and verification time for host interface designs without soft-core overhead |
| AXI4-Interconnect Fabric | Enables scalable, high-bandwidth communication between multiple masters and slaves in SoC-style architectures |
| Partial Reconfiguration Support | Allows runtime swapping of logic partitions while maintaining system operation and I/O continuity |
| Dual-Boot Configuration | Provides fail-safe firmware update capability using primary and backup bitstreams stored in external flash |
| UltraScale-compatible Toolflow | Enables migration path to newer architecture families using same Vivado design environment and constraints |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems requiring deterministic latency and high throughput. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with synchronized multi-channel ADC/DAC interfacing. Use Value: 72 GTH transceivers enable direct connection to 12+ RF front-end ICs; 6,800 DSP slices deliver >2.1 TFLOPS peak compute for real-time processing. | Use Scenario: Offloading compute-intensive kernels (e.g., matrix multiplication, encryption) from CPU in data center accelerators. IC Role / Device Role / Timing Role: PCIe-attached co-processor implementing custom datapaths with AXI-connected memory controllers and DMA engines. Use Value: PCIe Gen3 x8 interface provides 7.8 GB/s bidirectional bandwidth; 56.5 Mb on-chip RAM reduces off-chip memory access latency. |
| 100G Optical Transport | Medical Imaging Reconstruction |
Use Scenario: Forward error correction (FEC), framing, and OTU4 mapping in 100G coherent optical line cards. IC Role / Device Role / Timing Role: Protocol-aware transport processor handling OTN stack layers with precise jitter tolerance and sync recovery. Use Value: GTH transceivers meet ITU-T G.709 jitter specs; hardened 10G Ethernet MAC supports client-side 10GE LAN/WAN interfaces. | Use Scenario: Real-time image reconstruction from raw CT/MRI sensor data using iterative algorithms and GPU-like pipelines. IC Role / Device Role / Timing Role: High-precision arithmetic accelerator interfacing with multi-channel ADCs and high-speed DDR4 memory subsystems. Use Value: 28 nm process enables stable operation at 1.0 V under sustained thermal load; 600 I/O pins support concurrent sensor readout and display output. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGB2104I | UltraScale architecture, 2.1M logic cells, 100 GTH transceivers (16.3 Gb/s), 1.2 V core | Higher transceiver speed and density; targets next-gen 400G/800G systems | Choose for higher bandwidth and future-proofing where board redesign is acceptable |
| XC7VX980T-2FLG1930I | Same Virtex-7 family, 972K logic cells, 52 GTH transceivers, -2 speed grade | Lower resource count and transceiver count; optimized for cost-sensitive high-performance roles | Choose when full XC7VX1140T capacity is unused and tighter timing closure is required |
Compared with XC7VX1140T-1FLG1930I, the XCVU190 offers greater bandwidth and scalability but requires new PCB layout and power delivery design, while the XC7VX980T delivers proven Virtex-7 compatibility with reduced footprint and lower power at the expense of logic and transceiver headroom.
Availability
XC7VX1140T-1FLG1930I is available at Aetrix Electronics and suitable for radar signal processing, high-performance computing acceleration, and 100G optical transport applications requiring stable component supply and long-term industrial availability.
Supply support for XC7VX1140T-1FLG1930I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI processors for data center, communications, and embedded markets.
The Virtex-7 family was designed for ultra-high-bandwidth, low-latency system acceleration in infrastructure applications such as wired/wireless communications, defense radar, and scientific computing.
FAQ
What is the maximum supported transceiver data rate for XC7VX1140T-1FLG1930I?
The XC7VX1140T-1FLG1930I supports GTH transceivers operating up to 13.1 Gb/s, validated for protocols including PCIe Gen3, 10G Ethernet, and CPRI. This rate is guaranteed under specified thermal and voltage conditions per the official Virtex-7 DC and switching characteristics documentation.
Does XC7VX1140T-1FLG1930I support partial reconfiguration?
Yes, XC7VX1140T-1FLG1930I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module swaps without resetting the entire device. This capability is implemented in hardware and documented in UG908 and UG474 for the Virtex-7 family.
What configuration modes are supported by XC7VX1140T-1FLG1930I?
XC7VX1140T-1FLG1930I supports master SPI, slave SPI, BPI, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and dual-boot capability allows fallback to a secondary bitstream stored in external flash memory.
What is the thermal design power (TDP) of XC7VX1140T-1FLG1930I?
The typical thermal design power of XC7VX1140T-1FLG1930I is 32 W under representative high-activity conditions. Actual power consumption varies with design utilization, I/O activity, and transceiver usage, and must be verified using Xilinx Power Estimator (XPE) with the specific implementation.
Is XC7VX1140T-1FLG1930I pin-compatible with other Virtex-7 devices in the FLG1930 package?
No, XC7VX1140T-1FLG1930I is not pin-compatible with other Virtex-7 devices in the FLG1930 package. While the package footprint is identical, I/O bank assignments, transceiver locations, and power pin allocations differ across device densities and speed grades within the family.
XC7VX1140T-1FLG1930I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89000
- Number of Logic Elements/Cells:
- 1139200
- Total RAM Bits:
- 69304320
- Number of I/O:
- 1100
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX1140T-1FLG1930I FAQ
1.How can I place an order for XC7VX1140T-1FLG1930I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX1140T-1FLG1930I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX1140T-1FLG1930I reliable?
The price and inventory of XC7VX1140T-1FLG1930I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX1140T-1FLG1930I is usually 5 days.
3.What payment methods are accepted for XC7VX1140T-1FLG1930I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX1140T-1FLG1930I transactions.
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XC7VX1140T-1FLG1930I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX1140T-1FLG1930I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX1140T-1FLG1930I?
For technical support, including XC7VX1140T-1FLG1930I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX1140T-1FLG1930I requirements.
6.How does Aetrix verify that XC7VX1140T-1FLG1930I is sourced from the original manufacturer or authorized distributors?
All XC7VX1140T-1FLG1930I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX1140T-1FLG1930I meets industry standards.
7.What is the process for return or replacement of XC7VX1140T-1FLG1930I?
All XC7VX1140T-1FLG1930I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX1140T-1FLG1930I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX1140T-1FLG1930I part is unused and in its original packaging.
Return procedure for XC7VX1140T-1FLG1930I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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