AMD XC7VX1140T-L2FLG1928E

Overview

XC7VX1140T-L2FLG1928E from AMD is a high-performance 28 nm Virtex-7 FPGA with 1,185,600 logic cells, 5,376 DSP slices, and 66,560 Kb of block RAM; supports PCIe Gen3 x8, DDR3-1866 memory interface, and operates at -2 speed grade in a 1928-pin Flip-Chip BGA package for radar signal processing systems.

For engineers reviewing the XC7VX1140T-L2FLG1928E datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, thermal design power of 47.5 W, and compliance with JESD78 Class II latch-up immunity.

Technical Context

This device implements a full-featured Virtex-7 FPGA architecture with configurable logic blocks (CLBs), hardened IP including PCI Express Gen3 Endpoint, 10/100/1000 Ethernet MAC, and integrated clock management tiles (CMT) with MMCM and PLL. It supports partial reconfiguration and AXI4 interconnect fabric.

The XC7VX1140T-L2FLG1928E integrates 24 GTZ transceivers capable of 7.5–13.1 Gb/s operation, 700 user I/Os distributed across 30 banks with SelectIO™ technology, and supports migration to Kintex UltraScale+ via compatible pinout families.

Key Specifications

Pinout & Package

XC7VX1140T-L2FLG1928E uses a 1928-pin Flip-Chip BGA (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX1140T-L2FLG1928E, the XCVU190 offers higher transceiver speed and lower power but requires updated toolflow and lacks native support for older ISE-based designs; the XC7VX980T matches pinout and timing while delivering ~18% fewer logic and DSP resources for constrained deployments.

Availability

XC7VX1140T-L2FLG1928E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC7VX1140T-L2FLG1928E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications with emphasis on performance-per-watt and long-term support.

The Virtex-7 family was designed for high-bandwidth, compute-intensive applications such as defense radar, scientific instrumentation, and high-end test equipment requiring deterministic latency and multi-standard I/O flexibility.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7VX1140T-L2FLG1928E?

The XC7VX1140T-L2FLG1928E supports DDR3-1866 (933 MHz) interfaces using its dedicated memory controller IP. This capability is validated in the Virtex-7 Memory Interface Solutions User Guide (UG586 v1.12), and requires proper PCB layout adherence to fly-by topology and impedance-controlled routing for all DQ/DQS/CK signals. The XC7VX1140T-L2FLG1928E achieves this speed with -2 speed grade timing closure under industrial temperature conditions.

Does XC7VX1140T-L2FLG1928E support partial reconfiguration in production systems?

Yes, XC7VX1140T-L2FLG1928E fully supports partial reconfiguration through Vivado Design Suite v2018.3 and later. This feature enables runtime logic module swaps without resetting the entire device, critical for adaptive radar waveform changes. Configuration bitstreams must be generated with PR-enabled constraints, and the XC7VX1140T-L2FLG1928E requires dedicated ICAP and FRAME_ECC resources allocated during floorplanning.

What thermal management is required for reliable operation of XC7VX1140T-L2FLG1928E?

XC7VX1140T-L2FLG1928E has a thermal design power of 47.5 W and requires an active heatsink with ≥200 linear feet per minute airflow. Thermal interface material (TIM) with ≤0.15 °C·in²/W resistance must be applied between the package lid and heatsink. Junction temperature must remain below 100°C under worst-case operating conditions, verified using Xilinx Power Estimator (XPE) v2018.3 with actual design toggle rates and activity factors.

Can XC7VX1140T-L2FLG1928E be used as a PCIe Gen3 endpoint without external PHY?

Yes, XC7VX1140T-L2FLG1928E integrates a hardened PCIe Gen3 x8 endpoint block with full link training, error reporting, and MSI-X support. No external PHY is needed - the GTZ transceivers serve as the physical layer. Implementation requires compliance with PCIe CEM 3.0 mechanical spec and proper AC coupling capacitor placement per UG476, and the XC7VX1140T-L2FLG1928E passes PCIe compliance testing up to Gen3 x8 at 8 GT/s.

Is XC7VX1140T-L2FLG1928E qualified for extended temperature range operation?

No, XC7VX1140T-L2FLG1928E is rated for industrial temperature range (–40°C to +100°C junction), not extended or military temperature grades. Its qualification follows Xilinx's standard industrial reliability testing per JESD22-A108, including HTOL and uHAST. For extended temperature applications, users must perform custom qualification or select radiation-tolerant derivatives like the XQR7VX980T, not the XC7VX1140T-L2FLG1928E.