My Inquiry
My Account
AMD XC7VX330T-1FF1761I
- Part No.:
- XC7VX330T-1FF1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-1FF1761I.pdf
- Description:
- IC FPGA 650 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,579
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX330T-1FF1761I from AMD is a high-performance 28 nm Virtex-7 FPGA with 331,200 logic cells, 2,952 DSP slices, and 24.8 Mb of block RAM, configured in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1761) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX330T-1FF1761I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (13.1 Gb/s), I/O voltage support (1.2 V to 1.8 V), thermal design power (42 W typical), and configuration via Master SelectMAP or JTAG.
Technical Context
The XC7VX330T-1FF1761I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols. It includes dual-core ARM Cortex-A9 MPCore processors in the Zynq-7000 series - but this part is a Virtex-7, not Zynq - so no processor subsystem is present.
It supports high-speed memory interfaces including DDR3L up to 1,866 Mbps and uses SelectIO technology with programmable I/O standards (LVDS, SSTL, HSTL). Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption and HMAC authentication enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 331,200 - total configurable logic resources for complex digital logic implementation |
| DSP Slices | 2,952 - dedicated arithmetic units enabling high-throughput filtering and FFT operations |
| Block RAM | 24.8 Mb - on-chip memory for data buffering, FIFOs, and lookup tables without external memory |
| Transceiver Line Rate | 13.1 Gb/s - supports 10G Ethernet, CPRI, and Interlaken at full protocol compliance |
| I/O Standards | SSTL-15/18, LVDS, HSTL - enables direct interfacing with DDR3L, ADCs, DACs, and FPGAs |
| Configuration Interface | Master SelectMAP, JTAG, Quad-SPI - allows flexible, secure, and field-upgradable bitstream loading |
| Thermal Design Power | 42 W typical - defines heatsink and airflow requirements for stable operation at full utilization |
Pinout & Package
XC7VX330T-1FF1761I is housed in a 1761-ball Flip-Chip Fine-Pitch BGA (FFG1761) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in high-performance compute modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog supply for transceivers | Must be independently filtered and regulated to ±3% for jitter-sensitive 13.1 Gb/s operation |
| HR_IO / HP_IO | High-Range / High-Performance I/O banks | Support 1.2–1.8 V signaling; HP banks enable DDR3L interfaces up to 1,866 Mbps |
| CCLK / INIT_B / DONE | Configuration control signals | Control FPGA startup sequence, status indication, and configuration completion handshake |
| VRP / VRN | Reference voltage inputs | Provide internal termination reference for differential I/O standards like LVDS and SSTL |
| PS_CLK / PS_POR_B | Not applicable | This is a Virtex-7 device; no Processing System (PS) or ARM core - pins are NC or reserved |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG process | Enables higher logic density and lower dynamic power vs. 40 nm predecessors |
| Integrated 13.1 Gb/s transceivers | Reduces need for external SerDes ICs in 10G+ backplane and optical interface designs |
| PCIe Gen3 x8 endpoint support | Provides native host interface for acceleration cards without bridge chips |
| Bitstream encryption & HMAC | Protects intellectual property against cloning and unauthorized reprogramming |
| Partial reconfiguration support | Allows runtime logic updates in specific regions without system reset or downtime |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR algorithms; transceivers interface with ADC/DACs at 1.25 GSPS. Use Value: 2,952 DSP slices enable >100 GFLOPS sustained compute; 13.1 Gb/s transceivers handle JESD204B subclass 1 links directly. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers capturing >1 GS/s per channel. IC Role / Device Role / Timing Role: Synchronizes sampling clocks across 16+ ADCs and buffers raw data in 24.8 Mb block RAM before PCIe Gen3 upload. Use Value: DDR3L controller supports 1,866 Mbps memory bandwidth; deterministic latency ensures time-aligned capture across channels. |
| 5G Wireless Baseband | High-Performance Computing Acceleration |
Use Scenario: Massive MIMO precoding and LDPC decoding in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Implements real-time channel estimation and modulation/demodulation pipelines using hardened DSP blocks. Use Value: 331,200 logic cells accommodate multiple concurrent LTE/5G waveforms; transceivers connect to RFICs via CPRI/eCPRI over 10.3125 Gb/s lanes. | Use Scenario: FPGA co-processing card for financial analytics or genomics alignment in server racks. IC Role / Device Role / Timing Role: Offloads custom pattern matching and compression kernels from CPU; communicates via PCIe Gen3 x8 root complex. Use Value: Native PCIe Gen3 x8 endpoint eliminates protocol translation overhead; 42 W TDP fits standard 75 W PCIe slot thermal envelope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture, 1.3x more logic cells (443K), higher transceiver count (64 vs. 48), 16 nm process | Better suited for next-gen 5G mmWave and AI inference where higher throughput and lower power per operation are critical | Select XCVU3P-2FFVD1760I when migrating to newer process node and requiring >15% increase in DSP throughput |
| XC7VX485T-1FFG1761I | Same Virtex-7 family, 485K logic cells (+46%), same package, higher TDP (48 W), identical transceiver spec | Preferred for designs needing larger logic footprint without changing board layout or cooling solution | Choose XC7VX485T-1FFG1761I if additional logic capacity is required while retaining pin-compatible footprint and thermal profile |
Compared with XC7VX330T-1FF1761I, the XCVU3P-2FFVD1760I delivers higher performance per watt and supports newer protocols like PCIe Gen4, while the XC7VX485T-1FFG1761I offers direct layout reuse with increased logic headroom - both require validation of timing closure and power delivery under target workloads.
Availability
XC7VX330T-1FF1761I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7VX330T-1FF1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and aerospace markets.
The Virtex-7 family targets high-bandwidth, low-latency applications such as defense radar, wired/wireless infrastructure, and scientific instrumentation where deterministic timing and transceiver performance are critical.
FAQ
What is the maximum supported DDR3L data rate for XC7VX330T-1FF1761I?
The XC7VX330T-1FF1761I supports DDR3L memory interfaces up to 1,866 Mbps (933 MHz clock) using its hardened memory controller. This rate is validated across temperature and voltage corners per UG473 v1.15, and requires proper PCB layout adherence to Xilinx's DDR3 layout guidelines to maintain signal integrity.
Does XC7VX330T-1FF1761I include an integrated ARM processor?
No, XC7VX330T-1FF1761I is a Virtex-7 FPGA and does not contain any embedded ARM processor cores. Unlike Zynq-7000 devices, it provides only programmable logic, DSP slices, transceivers, and memory controllers - all configured via external bitstream loading.
What configuration modes are supported by XC7VX330T-1FF1761I?
XC7VX330T-1FF1761I supports Master SelectMAP, Slave SelectMAP, JTAG, and Quad-SPI configuration modes. Bitstream encryption and HMAC authentication are available in all modes except JTAG boundary-scan, enabling secure field updates and IP protection in deployed systems.
Can XC7VX330T-1FF1761I operate in industrial temperature range?
Yes, the "I" suffix in XC7VX330T-1FF1761I denotes industrial temperature grade (–40°C to +100°C junction). Thermal design must account for 42 W typical power dissipation, and operation above 85°C ambient requires active cooling per Xilinx DS875 guidelines.
Is XC7VX330T-1FF1761I pin-compatible with other Virtex-7 FPGAs in FFG1761 package?
XC7VX330T-1FF1761I shares the FFG1761 package with several Virtex-7 devices, but pin compatibility is not guaranteed across variants. I/O bank assignments, power pin locations, and transceiver placement differ between XC7VX330T and XC7VX485T or XC7VX690T, requiring board-level verification for any substitution.
XC7VX330T-1FF1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 650
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX330T-1FF1761I FAQ
1.How can I place an order for XC7VX330T-1FF1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-1FF1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-1FF1761I reliable?
The price and inventory of XC7VX330T-1FF1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-1FF1761I is usually 5 days.
3.What payment methods are accepted for XC7VX330T-1FF1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-1FF1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-1FF1761I?
XC7VX330T-1FF1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-1FF1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-1FF1761I?
For technical support, including XC7VX330T-1FF1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-1FF1761I requirements.
6.How does Aetrix verify that XC7VX330T-1FF1761I is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-1FF1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-1FF1761I meets industry standards.
7.What is the process for return or replacement of XC7VX330T-1FF1761I?
All XC7VX330T-1FF1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-1FF1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-1FF1761I part is unused and in its original packaging.
Return procedure for XC7VX330T-1FF1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX330T-1FF1761I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
