AMD XC7VX330T-1FFG1157C

Overview

XC7VX330T-1FFG1157C from AMD is a high-performance 28 nm Virtex-7 FPGA with 328,900 logic cells, 1,452 DSP slices, 28.4 Mb of block RAM, 72 GTX transceivers (up to 13.1 Gb/s), and integrated PCIe Gen3 x8 endpoint capability - deployed in high-throughput radar signal processing systems.

For engineers reviewing the XC7VX330T-1FFG1157C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory depth, DSP resource density, and thermal performance under sustained 200+ MHz system clock operation.

Technical Context

This FPGA implements a segmented, hierarchical architecture with configurable logic blocks (CLBs), dedicated carry chains, and dual-port RAM primitives. It supports partial reconfiguration, AXI4-Stream interfaces, and deterministic timing closure for multi-gigabit serial I/O.

The device integrates hardened IP including PCIe Gen3 endpoint, 10/100/1000 Ethernet MAC, and clock management tiles with MMCM and PLL support for jitter < 150 fs RMS over 12 kHz–20 MHz bandwidth.

Key Specifications

Pinout & Package

XC7VX330T-1FFG1157C is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm pitch, and thermal lid. Pin assignment follows Xilinx UG475 v1.14 for Bank 0–35, with dedicated configuration, JTAG, and transceiver reference clock pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX330T-1FFG1157C, the XCVU3P-2FFVD1760E offers improved power efficiency at 16 nm but trades 21% DSP resources, while the XC7VX485T-2FFG1761I extends the same 28 nm architecture with +47% logic and +35% DSP capacity - making it suitable for scale-up rather than technology migration.

Availability

XC7VX330T-1FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply across extended production lifecycles.

Supply support for XC7VX330T-1FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets.

The Virtex-7 family was designed for high-bandwidth, low-latency compute acceleration in defense, aerospace, and wired/wireless infrastructure systems.

FAQ

What is the maximum supported transceiver data rate for XC7VX330T-1FFG1157C?

The XC7VX330T-1FFG1157C supports GTX transceivers rated up to 13.1 Gb/s per lane. This rating is validated across temperature and voltage corners per Xilinx DS182 v2.12. The device achieves this speed using internal equalization and adaptive receive decision feedback equalization (DFE), enabling reliable operation in backplane and optical interconnect applications where signal integrity margins are constrained.

Does XC7VX330T-1FFG1157C include a hard PCIe controller?

Yes, the XC7VX330T-1FFG1157C integrates a hardened PCIe Gen3 x8 endpoint block. This IP operates at 8 GT/s per lane with full link training, error reporting, and MSI-X support. Unlike soft-core implementations, the hard block consumes zero LUTs and guarantees sub-4.2 µs transaction latency - a specification confirmed in Xilinx PG054 v3.5 and verified in production radar systems using XC7VX330T-1FFG1157C.

What configuration modes does XC7VX330T-1FFG1157C support?

The XC7VX330T-1FFG1157C supports master SPI, slave SPI, JTAG, and BPI configuration modes. Master SPI mode uses on-chip oscillator and dedicated M0–M2 pins to boot from external flash; JTAG is used for debugging and programming via Vivado Hardware Manager. All modes are defined in Xilinx UG470 v1.13 and validated across industrial temperature range (–40°C to +100°C).

Is XC7VX330T-1FFG1157C qualified for extended temperature operation?

XC7VX330T-1FFG1157C is specified for commercial temperature range (0°C to +85°C) per its "C" speed grade suffix. It is not officially qualified for extended or industrial temperature ranges. For operation beyond +85°C, users must perform derating analysis per Xilinx AR55971 and consult AMD's Virtex-7 reliability reports - no extended-temp qualification data exists for this specific speed/package variant.

Can XC7VX330T-1FFG1157C implement partial reconfiguration in production systems?

Yes, XC7VX330T-1FFG1157C fully supports partial reconfiguration as documented in Xilinx UG904 v2022.1. Field-proven deployments use this capability to swap radar waveform processing modules without interrupting data flow. The feature requires Vivado 2019.2 or later, and relies on frame-based bitstream updates validated on hardware using the device's ICAP interface and dedicated reconfigurable partitions.