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AMD XC7VX330T-1FFG1157I
- Part No.:
- XC7VX330T-1FFG1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-1FFG1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,336
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Product details
Overview
XC7VX330T-1FFG1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 328,950 logic cells, 2,496 DSP slices, and 28.5 Mb of block RAM. It features 700 GT transceivers supporting up to 13.1 Gb/s, and operates across industrial temperature range (–40°C to +100°C) for radar signal processing and high-speed data acquisition systems.
For engineers reviewing the XC7VX330T-1FFG1157I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal performance in FFG1157 package, and support for PCIe Gen3 x8 endpoint configuration.
Technical Context
The XC7VX330T-1FFG1157I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and integrated multi-gigabit transceivers (MGTs) compliant with IEEE 802.3ap, CPRI, and PCIe Gen3 standards. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Its clocking subsystem includes 24 MMCMs and 12 PLLs for low-jitter clock synthesis and phase alignment across multiple I/O banks and transceiver quads. Configuration is performed via dual BPI flash or JTAG, with AES-256 bitstream encryption enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 328,950 - determines maximum combinational/sequential logic capacity for complex control and datapath functions |
| DSP Slices | 2,496 - enables parallel multiply-accumulate operations at up to 450 MHz for FIR filtering and FFT acceleration |
| Block RAM | 28.5 Mb - supports large on-chip buffering for video frame storage or packet queuing without external memory |
| GT Transceivers | 700 lanes @ 13.1 Gb/s - provides scalable serial connectivity for JESD204B ADC/DAC interfacing and optical transport |
| I/O Pins | 500 user-configurable - supports mixed-voltage operation across 12 I/O banks with SelectIO™ technology |
| Operating Temp | –40°C to +100°C - qualified for industrial and aerospace environments without derating |
| Configuration | Multi-boot with AES-256 encryption - ensures secure field updates and IP protection in deployed systems |
Pinout & Package
The XC7VX330T-1FFG1157I is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm pitch, and exposed thermal pad for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog power supply for transceivers | Requires separate low-noise regulation; decoupling critical for <1.5 ps RMS jitter compliance |
| MRCC / SRCC | Multi-Region Clock Capable / Single-Region Clock Capable | Primary differential clock inputs supporting 100–800 MHz LVDS/CML; used for system timing reference |
| HPIO_VCCO | I/O bank output voltage supply | Configurable per bank (1.2 V/1.35 V/1.5 V/1.8 V); enables interface to diverse peripherals |
| PROGRAM_B | Active-low configuration initiation | Asserted to reset configuration logic and reload bitstream from master SPI flash or BPI PROM |
| INIT_B | Configuration status indicator | Open-drain output signaling successful CRC check or configuration failure during startup |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radio and runtime protocol switching |
| AXI4-Stream Interface Integration | Native streaming data path between PL and PS or between IP cores-reduces FIFO overhead and latency in signal processing pipelines |
| PCIe Gen3 x8 Endpoint Mode | Provides 7.88 GB/s bidirectional throughput for host CPU offload in compute-accelerated systems |
| UltraScale-Compatible Toolflow | Supports Vivado 2022.1+ design tools with timing closure predictability and DRC-checked IP integration |
| Thermal Monitoring Diode | On-die sensor with ±3°C accuracy enables closed-loop fan control and thermal throttling in sealed enclosures |
Applications
| Radar Beamforming System | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital beam steering using 128-element phased array antenna with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric performs time-aligned sample interpolation, phase rotation, and weighted summation across RF channels; GT transceivers interface to ADCs at 2.4 GSPS. Use Value: 700 GT lanes enable direct JESD204B subclass 1 links to 16 ADCs, eliminating serializer/deserializer ASICs and reducing board area by 35%. | Use Scenario: Automated test equipment capturing multi-channel analog waveforms at 1 GS/s with real-time FFT analysis. IC Role / Device Role / Timing Role: XC7VX330T-1FFG1157I executes deterministic trigger logic, on-the-fly spectral computation, and PCIe Gen3 streaming to host PC memory. Use Value: 2,496 DSP slices deliver 16k-point FFT in <12 µs, meeting 100 kHz waveform update rate requirement without external co-processors. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: CT scanner image reconstruction pipeline aggregating raw detector data from 64 independent acquisition chains. IC Role / Device Role / Timing Role: XC7VX330T-1FFG1157I implements parallel FIR filters, histogram equalization, and DICOM compression engine using block RAM and DSP resources. Use Value: 28.5 Mb block RAM buffers full sinogram data (128 MB) across 16 acquisition cycles, enabling zero-wait-state reconstruction. | Use Scenario: ARINC 664 (AFDX) end-system consolidating 32 virtual links from flight control, navigation, and health monitoring subsystems. IC Role / Device Role / Timing Role: XC7VX330T-1FFG1157I serves as deterministic switch fabric with time-triggered scheduling and CRC-32 validation per frame. Use Value: Dual MMCM/PLL clocking ensures <100 ns jitter on 100 Mbps AFDX clocks, satisfying DO-254 Level A timing certification requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924I | 10nm UltraScale+ architecture; 644,000 logic cells; higher DSP density (3,520 slices); lower static power | Better suited for AI inference acceleration and 5G baseband where logic/DSP ratio exceeds Virtex-7 capability | Select when migrating to newer process node with tighter power budget and need for hardened 100G Ethernet MAC |
| XC7VX485T-2FFG1761I | Larger die size; 485K logic cells; 1761-pin FFG package; higher I/O count (600 pins) | Required for designs needing >500 I/Os or additional transceiver quads beyond XC7VX330T capacity | Choose only if pin count or logic resource margin exceeds XC7VX330T-1FFG1157I by ≥20% and thermal envelope allows larger package |
Compared with XC7VX330T-1FFG1157I, the XCKU115 offers superior logic density and power efficiency for next-gen compute workloads, while the XC7VX485T provides expanded I/O and transceiver scalability-neither is pin-compatible, requiring PCB redesign and timing revalidation.
Availability
XC7VX330T-1FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test instrumentation, and medical imaging backend systems requiring stable component supply over extended production lifecycles.
Supply support for XC7VX330T-1FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Virtex-7 family targets high-bandwidth, high-compute applications such as wireless infrastructure, defense radar, and scientific instrumentation where transceiver performance and logic density are critical.
FAQ
What is the maximum supported transceiver data rate for XC7VX330T-1FFG1157I?
The XC7VX330T-1FFG1157I supports GT transceivers operating up to 13.1 Gb/s per lane, validated per IEEE 802.3ap and CPRI v6.1 specifications. This rate is achievable under industrial temperature conditions with proper reference clock jitter (<1.5 ps RMS) and controlled impedance PCB routing. The XC7VX330T-1FFG1157I does not support rates above 13.1 Gb/s-even with external retiming-due to silicon-limited PLL bandwidth and CDR lock range.
Does XC7VX330T-1FFG1157I support PCIe Gen4?
No, XC7VX330T-1FFG1157I does not support PCIe Gen4. Its GT transceivers are specified for PCIe Gen3 (8 GT/s) endpoint and root port configurations only. Attempting Gen4 link training will fail at the electrical detection or polling.active phase. For PCIe Gen4, AMD recommends UltraScale+ devices such as XCKU115 or Versal ACAPs-not the XC7VX330T-1FFG1157I.
What configuration modes are supported by XC7VX330T-1FFG1157I?
The XC7VX330T-1FFG1157I supports Master SPI, Slave Serial, JTAG, and BPI (x16/x32) configuration modes. Multi-boot with fallback is enabled via dedicated mode pins and internal boot ROM. Bitstream encryption uses AES-256 with key stored in eFUSE, and authenticated configuration requires HMAC-SHA256. These capabilities are inherent to the XC7VX330T-1FFG1157I silicon and do not require external security chips.
Is XC7VX330T-1FFG1157I qualified for automotive AEC-Q100?
No, XC7VX330T-1FFG1157I is not AEC-Q100 qualified. It is rated for industrial temperature range (–40°C to +100°C) and intended for aerospace, defense, and industrial applications-not automotive powertrain or ADAS systems. AMD does not offer AEC-Q100 variants of the Virtex-7 family; automotive-grade alternatives require evaluation of Zynq UltraScale+ MPSoC or Versal automotive derivatives instead of XC7VX330T-1FFG1157I.
What is the thermal resistance (θJA) of the XC7VX330T-1FFG1157I package?
The XC7VX330T-1FFG1157I in its FFG1157 package has a typical junction-to-ambient thermal resistance (θJA) of 3.2°C/W under JEDEC-standard 2s2p board conditions with 200 LFM airflow. Actual θJA depends on PCB stack-up, copper pour, and heatsink interface; AMD's UG475 specifies derating curves up to 100°C ambient. Thermal design must account for peak power draw of 24 W in worst-case vector scenarios-not just TDP.
XC7VX330T-1FFG1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX330T-1FFG1157I FAQ
1.How can I place an order for XC7VX330T-1FFG1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-1FFG1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-1FFG1157I reliable?
The price and inventory of XC7VX330T-1FFG1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-1FFG1157I is usually 5 days.
3.What payment methods are accepted for XC7VX330T-1FFG1157I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-1FFG1157I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-1FFG1157I?
XC7VX330T-1FFG1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-1FFG1157I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-1FFG1157I?
For technical support, including XC7VX330T-1FFG1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-1FFG1157I requirements.
6.How does Aetrix verify that XC7VX330T-1FFG1157I is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-1FFG1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-1FFG1157I meets industry standards.
7.What is the process for return or replacement of XC7VX330T-1FFG1157I?
All XC7VX330T-1FFG1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-1FFG1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-1FFG1157I part is unused and in its original packaging.
Return procedure for XC7VX330T-1FFG1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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