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AMD XC7VX330T-1FFG1761I
- Part No.:
- XC7VX330T-1FFG1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-1FFG1761I.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,989
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Product details
Overview
XC7VX330T-1FFG1761I from AMD is a high-performance 28 nm Virtex-7 FPGA with 328,950 logic cells, 2,496 DSP slices, 28.5 Mb of block RAM, and support for up to 1,200 GT transceivers running at 13.1 Gb/s. It serves as a system-level programmable logic fabric in high-throughput data processing, radar signal conditioning, and 100G optical transport line cards.
For engineers reviewing the XC7VX330T-1FFG1761I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal design power (24 W typical), and configuration via SPIx4 or BPI parallel interface.
Technical Context
The XC7VX330T-1FFG1761I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x8, 10/25/100G Ethernet MAC), and high-speed serial transceivers. It supports multi-gigabit protocols including CPRI, JESD204B/C, and OTU4 with deterministic latency control.
Configuration is performed via master SPI or slave parallel mode using external flash or processor-controlled boot. The device includes integrated clock management with 24 MMCMs and 12 PLLs, enabling precise clock synthesis and phase alignment across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 328,950 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 2,496 - enables concurrent multiply-accumulate operations for radar FFTs or AI inference kernels |
| Block RAM | 28.5 Mb - supports large on-chip buffering for packet reordering or video frame storage |
| GT Transceivers | 1,200 lanes @ 13.1 Gb/s - delivers aggregate bandwidth for 100G Ethernet or 4×25G CPRI links |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - allows direct interfacing to ADCs, memory, and image sensors |
| Configuration Interface | SPIx4 or BPI parallel - enables fast, secure, field-upgradable bitstream loading |
| Thermal Design Power | 24 W typical - defines heatsink sizing and airflow requirements for conduction-cooled modules |
Pinout & Package
XC7VX330T-1FFG1761I is housed in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation in air- or liquid-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI/BPI/JTAG) and bus width during power-on reset |
| CCLK | Configuration Clock | Drives synchronous bitstream loading from external flash; frequency ≤ 50 MHz |
| DONE | Configuration Status | Open-drain output indicating successful bitstream validation and release of I/O pins |
| INIT_B | Configuration Initialization | Active-low signal asserting configuration abort or reinitiation on error detection |
| GTH_RXN/TXN | Differential Transceiver Input/Output | AC-coupled negative-side terminals for 13.1 Gb/s serial links with internal termination |
| VCCINT | Core Supply | 1.0 V ±3% supply powering CLBs, interconnect, and configuration logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| Integrated 100G Ethernet MAC | Enables line-rate packet processing with <100 ns latency for OTN switching applications |
| 24 MMCM + 12 PLL clock managers | Supports independent clock domain crossing for multi-rate interfaces (e.g., 156.25 MHz + 312.5 MHz + 1.2 GHz) |
| AXI4-Interconnect IP | Provides configurable, pipelined, and buffered interconnect between processors, memory, and accelerators |
| UltraScale-compatible bitstream | Allows migration path to newer families while preserving functional verification and timing closure |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GT transceivers interface to ADC/DAC arrays. Use Value: 1,200 GT lanes enable simultaneous sampling of 48 RF channels at 2.4 GS/s with JESD204B v1.1 framing. | Use Scenario: Line-card processing in metro DWDM systems with OTU4 framing and FEC. IC Role / Device Role / Timing Role: Implements OTN mapper/demapper, forward error correction, and 100G MAC layer. Use Value: Hardened 100G Ethernet MAC delivers deterministic sub-100 ns latency and eliminates soft-core resource consumption. |
| High-Frequency Trading Engine | Medical Imaging Accelerator |
Use Scenario: Ultra-low-latency order matching and market data filtering in co-located trading racks. IC Role / Device Role / Timing Role: Configurable logic processes FIX/FAST protocol parsing and risk checks; GT transceivers connect to 10/25G NICs. Use Value: 13.1 Gb/s transceivers reduce round-trip latency to <600 ns for market data ingestion and order dispatch. | Use Scenario: Real-time reconstruction of CT/MRI volumetric data using iterative algorithms. IC Role / Device Role / Timing Role: DSP-rich fabric accelerates back-projection and filtered back-projection kernels; DDR3/4 controllers manage frame buffers. Use Value: 2,496 DSP slices sustain >2.1 TFLOPS FP16 throughput for iterative reconstruction loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | 1,728 DSP slices, 421,600 logic cells, 32.1 Mb BRAM, 120 GTY transceivers @ 32.75 Gb/s | Better DSP density and higher transceiver speed; lacks hardened 100G MAC | Preferred for AI inference acceleration where GTY speed and DSP count outweigh protocol offload needs |
| XCVU13P-2FLGA2577I | 1,152 DSP slices, 1,182,240 logic cells, 67.8 Mb BRAM, 128 GTM transceivers @ 58 Gb/s | Higher logic capacity and next-gen transceiver performance; requires new PCB due to 2577-pin FCBGA | Selected when migrating to UltraScale+ with need for >1 Tb/s aggregate I/O bandwidth |
Compared with XC7VX330T-1FFG1761I, XCKU115 offers higher transceiver speed but fewer hardened protocol engines, while XCVU13P provides greater logic scale and bandwidth at the cost of board redesign and higher power draw.
Availability
XC7VX330T-1FFG1761I is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and high-frequency trading infrastructure requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7VX330T-1FFG1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Virtex-7 family targets high-bandwidth, low-latency, and compute-intensive applications including wired/wireless infrastructure, defense electronics, and scientific instrumentation.
FAQ
What is the maximum transceiver data rate supported by XC7VX330T-1FFG1761I?
The XC7VX330T-1FFG1761I supports GT transceivers operating at up to 13.1 Gb/s per lane. This rate is validated for protocols including CPRI, JESD204B, and OTU4. Performance is guaranteed under specified junction temperature and voltage conditions, and requires proper AC coupling and PCB impedance control per UG476.
Does XC7VX330T-1FFG1761I include hardened PCIe Gen3 support?
Yes, XC7VX330T-1FFG1761I integrates a hardened PCIe Gen3 x8 endpoint block. This IP operates at 8 GT/s per lane with full link training, error reporting, and power management features. It eliminates the need for soft-core PCIe implementations and reduces logic utilization and timing closure effort.
What configuration modes are supported by XC7VX330T-1FFG1761I?
XC7VX330T-1FFG1761I supports master SPI (x1/x2/x4), slave parallel (BPI), and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. SPIx4 is commonly used for fast, secure, and compact bitstream storage in single quad-SPI flash devices.
What is the core voltage requirement for XC7VX330T-1FFG1761I?
XC7VX330T-1FFG1761I requires a nominal VCCINT supply of 1.0 V with ±3% tolerance. This rail powers the FPGA fabric, interconnect, and configuration logic. Tight regulation is essential to meet timing specifications and avoid configuration errors or metastability in high-speed paths.
Is XC7VX330T-1FFG1761I qualified for extended temperature operation?
Yes, the "I" suffix in XC7VX330T-1FFG1761I denotes Industrial temperature grade (–40°C to +100°C case temperature). This qualification includes thermal cycling, burn-in, and parametric testing per AMD's industrial reliability standards, making it suitable for base station, avionics, and industrial control environments.
XC7VX330T-1FFG1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX330T-1FFG1761I FAQ
1.How can I place an order for XC7VX330T-1FFG1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-1FFG1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-1FFG1761I reliable?
The price and inventory of XC7VX330T-1FFG1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-1FFG1761I is usually 5 days.
3.What payment methods are accepted for XC7VX330T-1FFG1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-1FFG1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-1FFG1761I?
XC7VX330T-1FFG1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-1FFG1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-1FFG1761I?
For technical support, including XC7VX330T-1FFG1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-1FFG1761I requirements.
6.How does Aetrix verify that XC7VX330T-1FFG1761I is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-1FFG1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-1FFG1761I meets industry standards.
7.What is the process for return or replacement of XC7VX330T-1FFG1761I?
All XC7VX330T-1FFG1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-1FFG1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-1FFG1761I part is unused and in its original packaging.
Return procedure for XC7VX330T-1FFG1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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