AMD XC7VX330T-2FF1157I

Overview

XC7VX330T-2FF1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 328,800 logic cells, 1,920 DSP slices, and 24.8 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s and supports PCIe Gen3 x8, DDR3-1866 memory interfaces. It is used in high-speed data acquisition systems requiring deterministic latency and real-time signal processing.

For engineers reviewing the XC7VX330T-2FF1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-2), I/O bank voltage flexibility (1.2 V to 1.8 V), and thermal performance in air-cooled 1157-pin flip-chip BGA packaging.

Technical Context

The XC7VX330T-2FF1157I implements a segmented architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive workloads, and UltraScale-inspired clocking resources including MMCM and PLL blocks. It supports multi-gigabit serial I/O with built-in PRBS generators and error detectors per GT lane.

Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot from two external flash devices. The device includes hardened PCIe Gen3 x8 endpoint and root port blocks, and integrated 10/100/1000 Ethernet MACs with GMII/RGMII interface options.

Key Specifications

Pinout & Package

The XC7VX330T-2FF1157I is housed in a 35 mm × 35 mm, 1157-pin flip-chip BGA (FF1157) package with exposed thermal pad, designed for conduction-cooled industrial applications and compliant with JEDEC MO-271AB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX330T-2FF1157I, the XCVU3P-2FFVD1760I offers higher transceiver speed and AI acceleration but demands new PCB design, while the XC7VX485T-2FFG1157I provides identical footprint and thermal profile with expanded logic-ideal for incremental capacity upgrades.

Availability

XC7VX330T-2FF1157I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and 5G baseband unit applications requiring stable component supply across extended product lifecycles.

Supply support for XC7VX330T-2FF1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Virtex-7 family was engineered for high-bandwidth, low-latency system integration in aerospace, defense, and wired/wireless infrastructure-prioritizing transceiver density, DSP throughput, and deterministic timing.

FAQ

What is the maximum supported data rate for GT transceivers on the XC7VX330T-2FF1157I?

The XC7VX330T-2FF1157I supports GT transceivers up to 13.1 Gb/s per lane. This rating applies to all 700 GT lanes under speed grade -2 conditions (junction temperature ≤ 100°C, VCCINT = 0.95 V). The device implements GTX transceivers-not GTY-so 25.8 Gb/s operation is not supported. Reference clocks must meet jitter specifications per UG476 to maintain BER <10⁻¹².

Does the XC7VX330T-2FF1157I include hardened PCIe Gen3 endpoints?

Yes, the XC7VX330T-2FF1157I integrates hardened PCIe Gen3 x8 endpoint and root port blocks compliant with PCI Express Base Specification Revision 3.0. These blocks operate without consuming programmable logic resources and support ASPM L0s/L1, ECRC, and advanced error reporting. Configuration space is accessible via AXI-Lite interface.

What I/O standards does the XC7VX330T-2FF1157I support for DDR3 memory interfacing?

The XC7VX330T-2FF1157I supports DDR3-1866 operation using SSTL15_I class I/O standards across dedicated memory interface banks. It includes dedicated write-leveling and read-leveling circuitry, DQS gating, and dynamic calibration logic. VREF pins are provided per bank to ensure signal integrity at 933 MHz data rates.

Is partial reconfiguration supported on the XC7VX330T-2FF1157I?

Yes, the XC7VX330T-2FF1157I fully supports partial reconfiguration through Vivado Design Suite. Reconfigurable partitions can be swapped dynamically while other logic remains operational. Bitstream encryption and CRC checking are enforced during reload, and the IC maintains internal state consistency across reconfiguration boundaries.

What is the thermal design power (TDP) of the XC7VX330T-2FF1157I under typical operating conditions?

The XC7VX330T-2FF1157I has a typical thermal design power of 18.5 W at 85°C junction temperature with 50% logic utilization and active GT transceivers. Power consumption scales linearly with activity; full utilization with all GT lanes active increases TDP to 22.3 W. Thermal pad soldering and 2 oz copper planes are required for reliable operation in industrial environments.