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AMD XC7VX330T-2FF1761C
- Part No.:
- XC7VX330T-2FF1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-2FF1761C.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,655
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Product details
Overview
XC7VX330T-2FF1761C from AMD is a high-performance 28 nm FPGA with 331,200 logic cells, 1,440 DSP slices, and 24.8 Mb of block RAM, configured in a 1761-pin Flip-Chip Fine-Pitch BGA package with 0.8 mm pitch and -2 speed grade for low-latency industrial control and high-throughput data acquisition systems.
For engineers reviewing the XC7VX330T-2FF1761C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (700 user I/Os), transceiver line rate (13.1 Gb/s), thermal performance (junction temperature range –40°C to +100°C), and configuration interface support (SPIx4, SelectMAP).
Technical Context
The XC7VX330T-2FF1761C implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint, dual 10GbE MACs, and hardened AXI interconnect fabric. It supports partial reconfiguration and includes 24 transceivers compliant with IEEE 802.3ba and CPRI v6.1.
Configuration is performed via Master SPI or JTAG, with bitstream encryption enabled through AES-256 and HMAC-SHA-256. The device integrates dedicated clock management tiles (CMT) with MMCM and PLL blocks supporting jitter < 150 fs RMS over 12 kHz–20 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 331,200 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 1,440 - fixed-point arithmetic units with 25 × 18-bit multipliers and 48-bit accumulators |
| Block RAM | 24.8 Mb - distributed as 1,824 BRAM blocks (36 Kb each), usable as true dual-port memory |
| Transceivers | 24 - supporting 600 Mb/s to 13.1 Gb/s line rates, compliant with PCIe Gen3, SATA III, and 10GBase-R |
| User I/O Pins | 700 - LVDS, SSTL, HSTL, and TMDS-capable, with programmable drive strength and slew rate |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Junction Temp | –40°C to +100°C - validated thermal operating range for continuous industrial deployment |
Pinout & Package
XC7VX330T-2FF1761C is housed in a 1761-ball Flip-Chip Fine-Pitch BGA (FF) package with 0.8 mm ball pitch, 35 mm × 35 mm body size, and standard JEDEC MO-271AC footprint. Thermal pad on underside enables efficient heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8V ±3% supply for configuration logic, SelectIO, and transceiver reference circuitry |
| VCCO | I/O bank power | Programmable 1.2V–3.3V per bank; sets voltage standard for associated I/O pins |
| M0–M2 | Mode configuration pins | Determine boot source (SPI, BPI, or SelectMAP) and configuration mode at power-up |
| CCLK | Configuration clock | Input clock for master SPI configuration; also used as free-running clock during operation |
| INIT_B | Configuration status | Open-drain output indicating bitstream loading progress and CRC error detection |
| PROGRAM_B | Configuration reset | Active-low input to initiate configuration sequence and clear internal state |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hard IP block enabling direct host CPU communication without external bridge logic or firmware overhead |
| Partial Reconfiguration | Runtime logic replacement within defined regions while other design portions remain operational |
| AXI Interconnect Fabric | Hardened crossbar supporting up to 16 AXI4/AXI4-Lite masters and slaves with QoS arbitration |
| AES-256 Bitstream Encryption | On-chip decryption engine protecting intellectual property against physical bitstream extraction |
| MMCM + PLL Clock Management | Two independent clock synthesis blocks per CMT, supporting phase alignment, frequency synthesis, and jitter filtering |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR algorithms; transceivers interface with ADC/DACs at 1.2 GSPS. Use Value: 1,440 DSP slices enable simultaneous 1024-point FFTs across 16 channels with sub-microsecond latency. | Use Scenario: Multi-channel oscilloscopes and automated test equipment capturing synchronized analog waveforms. IC Role / Device Role / Timing Role: Timing controller and data aggregator; interfaces eight 16-bit 250 MSPS ADCs via source-synchronous LVDS. Use Value: 700 user I/Os and 24 transceivers allow full-width parallel capture and real-time streaming to DDR3 at 12.8 GB/s. |
| Industrial Machine Vision | 5G Wireless Baseband |
Use Scenario: Sub-millisecond image preprocessing and defect classification on factory-floor vision inspection systems. IC Role / Device Role / Timing Role: Image pipeline accelerator with MIPI CSI-2 receiver, Bayer demosaic, and CNN inference engine. Use Value: Block RAM capacity (24.8 Mb) stores multiple frame buffers and convolution weight tables for real-time inference. | Use Scenario: Massive MIMO baseband processing in 5G NR macrocell and small-cell infrastructure. IC Role / Device Role / Timing Role: Digital front-end (DFE) processor handling CFR, DPD, and OFDM modulation/demodulation. Use Value: 13.1 Gb/s transceivers directly connect to RFICs via JESD204B subclass 1, eliminating external SerDes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | UltraScale architecture, 1.3M logic cells, higher transceiver count (48), but no native PCIe Gen3 endpoint | Better suited for ultra-high-bandwidth packet processing where PCIe host interface is offloaded externally | Select when >1 Tb/s interconnect bandwidth is required and PCIe root complex is implemented separately |
| XC7K410T-2FFG901I | Same 7-series family, lower density (407K LC), fewer transceivers (16), same -2 speed grade and FF package footprint | Targeted at cost-sensitive industrial control with reduced I/O and DSP requirements | Choose for legacy-compatible designs needing lower power and smaller form factor without sacrificing timing margin |
Compared with XC7VX330T-2FF1761C, XCKU115 offers greater raw throughput but requires external PCIe bridging, while XC7K410T delivers proven 7-series reliability at lower complexity-making the XC7VX330T-2FF1761C optimal for balanced high-performance embedded signal processing with integrated PCIe Gen3.
Availability
XC7VX330T-2FF1761C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and 5G wireless baseband applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7VX330T-2FF1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Virtex-7 family, including XC7VX330T-2FF1761C, was engineered for high-throughput, low-latency signal and packet processing in aerospace, defense, and wired/wireless infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7VX330T-2FF1761C?
The XC7VX330T-2FF1761C supports transceiver line rates from 600 Mb/s up to 13.1 Gb/s. This range covers protocols including PCIe Gen3 (8 GT/s), 10GBase-R Ethernet, and CPRI v6.1. Each of the 24 transceivers operates independently and can be configured per channel for optimal signal integrity in high-speed serial links.
Does XC7VX330T-2FF1761C include hard IP for PCIe Gen3?
Yes, XC7VX330T-2FF1761C integrates a hard PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification v3.0. It supports both root port and endpoint modes, includes integrated DMA engines, and requires no soft-core implementation or external PHY, reducing latency and resource usage in host-connected systems.
What configuration interfaces does XC7VX330T-2FF1761C support?
XC7VX330T-2FF1761C supports Master SPI (x1/x2/x4), Slave SelectMAP (x8/x16), and JTAG configuration modes. Mode pins M0–M2 determine the active interface at power-up. Configuration bitstreams can be encrypted using AES-256, and authentication is enforced via HMAC-SHA-256 to prevent unauthorized programming.
What is the I/O voltage range supported by XC7VX330T-2FF1761C?
XC7VX330T-2FF1761C supports I/O voltages from 1.2 V to 3.3 V per bank, with individual bank-level VCCO supplies. It is compatible with LVCMOS, LVDS, SSTL, HSTL, and TMDS signaling standards. Each bank's I/O standard and drive strength are fully programmable in configuration and runtime.
Is XC7VX330T-2FF1761C qualified for industrial temperature operation?
Yes, the XC7VX330T-2FF1761C is rated for industrial temperature operation from –40°C to +100°C junction temperature. Its -2 speed grade guarantees timing closure across this full range, and thermal design guidelines-including recommended PCB copper pour and thermal vias-are documented in UG475 and Xilinx Answer Record AR#61327.
XC7VX330T-2FF1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX330T-2FF1761C FAQ
1.How can I place an order for XC7VX330T-2FF1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-2FF1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-2FF1761C reliable?
The price and inventory of XC7VX330T-2FF1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-2FF1761C is usually 5 days.
3.What payment methods are accepted for XC7VX330T-2FF1761C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-2FF1761C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-2FF1761C?
XC7VX330T-2FF1761C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-2FF1761C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-2FF1761C?
For technical support, including XC7VX330T-2FF1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-2FF1761C requirements.
6.How does Aetrix verify that XC7VX330T-2FF1761C is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-2FF1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-2FF1761C meets industry standards.
7.What is the process for return or replacement of XC7VX330T-2FF1761C?
All XC7VX330T-2FF1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-2FF1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-2FF1761C part is unused and in its original packaging.
Return procedure for XC7VX330T-2FF1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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