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AMD XC7VX330T-2FFG1157C
- Part No.:
- XC7VX330T-2FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-2FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,030
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Product details
Overview
XC7VX330T-2FFG1157C from AMD (formerly Xilinx) is a high-performance 28 nm Virtex-7 FPGA with 331,200 logic cells, 1,920 DSP slices, and 24.8 Mb of block RAM. It features 700 GT transceivers supporting up to 13.1 Gb/s, and operates at -2 speed grade with industrial temperature range (0°C to 85°C). It is used in high-bandwidth radar signal processing systems requiring deterministic low-latency data path implementation.
For engineers reviewing the XC7VX330T-2FFG1157C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, available I/O banks with SelectIO™ voltage support, and thermal envelope for conduction-cooled module integration.
Technical Context
The XC7VX330T-2FFG1157C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and hardened PCIe Gen3 x8 endpoint/switch core. Its GTY transceivers support protocols including CPRI, JESD204B/C, and 10GBASE-R.
It integrates dual 32-bit AXI interconnects, clock management tiles (CMT) with MMCM and PLL, and supports partial reconfiguration. Configuration is performed via quad-SPI or BPI flash, or through JTAG boundary-scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 331,200 - determines maximum combinational and sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 1,920 - enables parallel execution of 25×18 signed multiply-accumulate operations per slice |
| Block RAM | 24.8 Mb - supports large on-chip buffering for streaming FFT or beamforming pipelines |
| Transceivers | 700 GTY lanes - delivers 13.1 Gb/s per lane with built-in 64b/66b encoding and FEC |
| I/O Banks | 32 - provides independent voltage domains (1.2–3.3 V) for mixed-signal interface bridging |
| Speed Grade | -2 - guarantees timing closure at 1.2 GHz internal clocking with worst-case voltage/temperature margin |
| Operating Temp | 0°C to +85°C - validated for industrial enclosure environments without forced airflow |
Pinout & Package
XC7VX330T-2FFG1157C is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm ball pitch, and standard I/O pad arrangement compliant with Xilinx UG475 v1.14.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% regulated input powering CLBs, RAM, and routing fabric |
| VCCAUX | Auxiliary supply | 1.8V supply for configuration logic, clock management, and transceiver analog bias |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3V output driver voltage for Bank 0 signals |
| MGTAVCC | Transceiver analog supply | 1.0V analog rail for GTY transceiver PLLs and serializers |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading |
| PROGRAM_B | Reconfiguration trigger | Pulse-low input to reset configuration logic and reload bitstream from flash |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic swapping of functional modules (e.g., filter banks) without system reset |
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and guarantees compliance with PCIe 3.0 electrical and protocol layers |
| JESD204B/C Subclass 1 Support | Provides deterministic latency and multi-device synchronization for high-speed ADC/DAC interfacing |
| SelectIO™ Technology | Supports LVDS, SSTL, HSTL, and MIPI D-PHY signaling across 32 I/O banks |
| UltraScale-Compatible Toolflow | Allows migration to newer families using same Vivado 2023.1 design environment and constraints syntax |
Applications
| Radar Beamforming Engine | High-Speed Data Acquisition System |
|---|---|
Use Scenario: Real-time adaptive beam steering in phased-array radar using 128-channel RF front-end. IC Role / Device Role / Timing Role: FPGA fabric executes time-aligned phase rotation and digital down-conversion; GTY transceivers stream IQ samples to host processor. Use Value: 700 GTY lanes enable full-rate 128×1.2 GSPS sample ingestion with sub-20 ns channel-to-channel skew. | Use Scenario: 16-bit, 500 MSPS digitizer capturing transient waveforms in power electronics fault analysis. IC Role / Device Role / Timing Role: XC7VX330T-2FFG1157C hosts JESD204B subclass 1 receiver cores synchronized to external 10 MHz reference. Use Value: Deterministic latency ensures precise timestamp alignment across 8 ADC channels for post-trigger reconstruction. |
| Avionics Sensor Fusion Hub | 5G Massive MIMO Baseband Processor |
Use Scenario: Integration of inertial, GNSS, and vision sensor streams in UAV flight control unit. IC Role / Device Role / Timing Role: Configurable logic implements Kalman filter fusion engine; PCIe Gen3 x8 connects to ARM-based safety controller. Use Value: Dual AXI interconnects isolate real-time sensor processing from telemetry upload traffic with guaranteed bandwidth allocation. | Use Scenario: Baseband processing for 64T64R massive MIMO radio units operating in 3.5 GHz band. IC Role / Device Role / Timing Role: XC7VX330T-2FFG1157C runs OFDM modulation/demodulation and precoding kernels across 331K logic cells. Use Value: 1,920 DSP slices sustain 2.4 GOPS real-time matrix inversion for channel estimation under 100 µs latency budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | 16 nm UltraScale+ architecture; 1,182K logic cells; higher DSP density but lower GTY lane count (528) | Better suited for compute-intensive AI inference; less optimal for ultra-high-lane-count serial I/O | Choose when migrating to newer node with tighter power budget and higher compute density required |
| XC7VX485T-2FFG1761I | Larger die (485K LC); same 28 nm node; 1761-pin FFG package; extended industrial temp (-40°C to +100°C) | Preferred for harsh-environment deployments where extended temperature operation is mandatory | Choose when thermal margin exceeds +85°C ambient or when additional logic resources justify larger footprint |
Compared with XC7VX330T-2FFG1157C, the XCVU3P-2FFVD1760E offers superior compute density and lower static power but reduces serial I/O scalability, while the XC7VX485T-2FFG1761I retains identical architecture and toolflow compatibility while expanding logic capacity and thermal operating range.
Availability
XC7VX330T-2FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and avionics sensor fusion requiring stable component supply over extended production lifecycles.
Supply support for XC7VX330T-2FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-7 family was designed for high-throughput, low-latency signal processing in defense, aerospace, and wired/wireless infrastructure applications.
FAQ
What is the maximum supported transceiver data rate for XC7VX330T-2FFG1157C?
The XC7VX330T-2FFG1157C supports GTY transceivers rated up to 13.1 Gb/s per lane. This rate is guaranteed across all 700 transceiver lanes under industrial temperature conditions and -2 speed grade timing constraints, with built-in support for 64b/66b encoding and forward error correction.
Does XC7VX330T-2FFG1157C support partial reconfiguration?
Yes, XC7VX330T-2FFG1157C fully supports partial reconfiguration through Vivado Design Suite. This capability allows runtime swapping of logical modules-such as filter coefficients or protocol stacks-without resetting the entire device or disrupting active I/O paths.
What configuration modes are supported by XC7VX330T-2FFG1157C?
XC7VX330T-2FFG1157C supports master SPI, slave serial, JTAG, and BPI configuration modes. Quad-SPI flash is the most common method for production deployment, enabling fast, secure, and field-upgradable bitstream loading with CRC validation.
Is XC7VX330T-2FFG1157C compatible with Vivado 2023.1?
Yes, XC7VX330T-2FFG1157C is fully supported in Vivado 2023.1, including synthesis, implementation, simulation, and hardware debugging. The device remains in the supported device list with no deprecation notice through at least Q2 2025.
What is the I/O voltage range supported per bank on XC7VX330T-2FFG1157C?
XC7VX330T-2FFG1157C supports per-bank I/O voltages from 1.2 V to 3.3 V across its 32 SelectIO™ banks. Each bank can be independently configured, enabling direct interfacing with legacy 3.3 V peripherals and modern 1.2 V memory interfaces simultaneously.
XC7VX330T-2FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX330T-2FFG1157C FAQ
1.How can I place an order for XC7VX330T-2FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-2FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX330T-2FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-2FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7VX330T-2FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-2FFG1157C transactions.
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5.How can I obtain technical support or documentation for XC7VX330T-2FFG1157C?
For technical support, including XC7VX330T-2FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-2FFG1157C requirements.
6.How does Aetrix verify that XC7VX330T-2FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-2FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-2FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7VX330T-2FFG1157C?
All XC7VX330T-2FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-2FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-2FFG1157C part is unused and in its original packaging.
Return procedure for XC7VX330T-2FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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