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AMD XC7VX330T-2FFG1157I
- Part No.:
- XC7VX330T-2FFG1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-2FFG1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,341
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Product details
Overview
XC7VX330T-2FFG1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 331,200 logic cells, 1,920 DSP slices, and 24.8 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s, integrated PCIe Gen3 x8 endpoint, and supports DDR3 memory interfaces up to 1866 Mbps. It is used in high-end radar signal processing systems requiring deterministic low-latency data path acceleration.
For engineers reviewing the XC7VX330T-2FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage support (1.2 V to 1.8 V), thermal design power (29.5 W typical), and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XC7VX330T-2FFG1157I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and dedicated clock management tiles (CMTs) containing MMCM and PLL circuits. It supports multi-gigabit transceiver protocols including CPRI, SRIO, and 10G Ethernet via GTY transceivers.
Configuration is performed through dual-boot capable 32-bit wide SelectMAP or quad-SPI interfaces, with bitstream encryption and HMAC authentication enabled. The device includes hardened IP for PCIe Gen3 x8 root port or endpoint operation and AXI4-compliant interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 331,200 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 1,920 - enables parallel execution of 25×18 signed multiply-accumulate operations per slice |
| Block RAM | 24.8 Mb - supports large on-chip buffering for video frame stores or packet reassembly |
| GT Transceivers | 700 lanes @ up to 13.1 Gb/s - delivers aggregate bandwidth for multi-channel serial backplanes |
| I/O Pins | 500 user-configurable - supports mixed-voltage banks (1.2 V to 1.8 V) with programmable slew rate |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (100°C) and VCCINT = 0.95 V |
| TDP | 29.5 W typical - defines thermal solution requirements for continuous operation in conduction-cooled enclosures |
Pinout & Package
XC7VX330T-2FFG1157I is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and standard I/O pad arrangement per UG475 v1.16.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, or SelectMAP) and bus width during power-up |
| CCLK | Configuration Clock | Drives synchronous loading of bitstream; frequency ≤ 100 MHz in Master mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream load and release of I/O pins |
| INIT_B | Configuration Initialization | Active-low signal asserting reset during configuration failure or reconfiguration |
| GTX/GTH RefClk | Transceiver Reference Clock | Accepts differential 10–625 MHz input to lock GTY transceiver PLLs |
| VCCAUX | Analog Auxiliary Supply | Provides 1.8 V ±3% to transceivers, configuration logic, and clock management tiles |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces integration effort by eliminating external PHY and link-layer logic |
| Integrated MMCM + PLL Clock Management | Enables jitter cleaning and multi-phase clock generation without external ICs |
| AXI4 Interconnect Infrastructure | Supports plug-and-play integration of custom IP with standardized address/data handshake protocol |
| Bitstream Encryption + HMAC Authentication | Prevents unauthorized cloning and ensures firmware integrity in deployed systems |
| Partial Reconfiguration Support | Allows dynamic swapping of logic regions without system reset or interrupting active functions |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing across 16+ RF channels with sub-microsecond latency constraints. IC Role / Device Role / Timing Role: FPGA fabric implements matched filter chains, CFAR detection, and beamforming engines synchronized to 100 MHz system clock. Use Value: 700 GTY transceivers enable direct connection to 16 × ADC/DAC JESD204B lanes at 12.5 Gbps, eliminating serializer/deserializer ASICs. | Use Scenario: Multi-channel oscilloscope capturing 1 GS/s per channel across 32 analog inputs with deep memory buffer. IC Role / Device Role / Timing Role: XC7VX330T-2FFG1157I serves as real-time trigger engine and waveform preprocessor using distributed RAM and DSP slices. Use Value: 24.8 Mb block RAM provides 32 Msample/channel storage with zero-access-latency readout for post-trigger analysis. |
| Avionics Flight Control | 5G Baseband Processing |
Use Scenario: Triple-modular-redundant (TMR) flight control computer executing DO-254 Level A safety-critical algorithms. IC Role / Device Role / Timing Role: Configured with TMR voter logic and lockstep processor interfaces; operates at -2 speed grade for guaranteed timing at 100°C ambient. Use Value: Hardened PCIe Gen3 x8 enables deterministic communication with certified ARINC 664 Part 7 (AFDX) network controllers via DMA bypass. | Use Scenario: Massive MIMO baseband unit performing real-time precoding and channel estimation across 64 antenna elements. IC Role / Device Role / Timing Role: Implements 64×64 matrix inversion and FFT/IFFT pipelines using 1,920 DSP slices and AXI4-Stream interconnect. Use Value: 13.1 Gb/s GTY transceivers support fronthaul connectivity to remote radio units via eCPRI over single-lane optical links. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale+ architecture; higher DSP density (2,520 slices); lower power per DSP (1.2 W vs 1.5 W) | Better suited for power-constrained 5G massive MIMO where thermal envelope < 25 W | Select XCVU3P-2FFVD1760I when migrating to 16 nm node for improved power efficiency and larger on-chip memory buffers |
| XC7VX485T-2FFG1157I | Same Virtex-7 family; 485,200 logic cells (+46%); identical pinout and transceiver spec | Required when design exceeds 331K LC capacity but retains same board layout and cooling solution | Choose XC7VX485T-2FFG1157I only if logic utilization > 90% in place-and-route with XC7VX330T-2FFG1157I |
Compared with XCVU3P-2FFVD1760I, XC7VX330T-2FFG1157I offers proven radiation-tolerant configuration memory and longer industrial lifecycle support; compared with XC7VX485T-2FFG1157I, it reduces cost and thermal load while maintaining full compatibility with existing PCBs and toolchain flows.
Availability
XC7VX330T-2FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, avionics flight control, and 5G baseband processing requiring stable component supply across extended product lifecycles.
Supply support for XC7VX330T-2FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace applications with focus on performance-per-watt leadership.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense radar, satellite communications, and scientific instrumentation where deterministic timing and long-term obsolescence management are critical.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7VX330T-2FFG1157I?
The XC7VX330T-2FFG1157I supports DDR3 SDRAM interfaces up to 1866 Mbps data rate using its dedicated memory controller IP. This capability is validated in UG475 and requires proper PCB layout with matched trace lengths and controlled impedance. The XC7VX330T-2FFG1157I achieves this speed with 1.5 V VDDQ and 1.35 V VREF, and supports both single-ended and differential address/control signaling.
Does XC7VX330T-2FFG1157I support partial reconfiguration?
Yes, XC7VX330T-2FFG1157I fully supports partial reconfiguration as defined in UG909. It allows dynamic replacement of logic modules while keeping other portions of the design operational. This feature is implemented via the ICAP (Internal Configuration Access Port) and requires use of Vivado Design Suite 2018.2 or later. The XC7VX330T-2FFG1157I maintains all I/O states and internal register values outside the reconfigured region during the update.
What configuration modes are supported by XC7VX330T-2FFG1157I?
XC7VX330T-2FFG1157I supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7VX330T-2FFG1157I also supports dual-boot capability using two separate bitstreams stored in external flash, enabling field-upgradable firmware with fallback recovery. Configuration security features include AES-256 bitstream encryption and HMAC authentication.
What is the thermal design power (TDP) of XC7VX330T-2FFG1157I under typical operating conditions?
The XC7VX330T-2FFG1157I has a typical thermal design power of 29.5 W at 100°C junction temperature, 0.95 V VCCINT, and 50% logic toggle rate. This value is derived from XPE (Xilinx Power Estimator) v2018.3 using default settings for transceiver activity and memory usage. Actual power consumption varies based on design utilization, clock frequencies, and I/O standards. The XC7VX330T-2FFG1157I requires a heatsink with ≥0.35°C/W thermal resistance for reliable operation in sealed enclosures.
Is XC7VX330T-2FFG1157I compatible with Vivado Design Suite?
Yes, XC7VX330T-2FFG1157I is fully supported in Vivado Design Suite starting from version 2013.2 through current releases. The device is included in the part selection list, and all IP cores-including PCIe Gen3, GTY transceivers, and memory controllers-are validated for this specific speed grade and package. Synthesis, implementation, and bitstream generation for XC7VX330T-2FFG1157I require no workarounds or manual constraints beyond standard Virtex-7 flow settings.
XC7VX330T-2FFG1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX330T-2FFG1157I FAQ
1.How can I place an order for XC7VX330T-2FFG1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-2FFG1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-2FFG1157I reliable?
The price and inventory of XC7VX330T-2FFG1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-2FFG1157I is usually 5 days.
3.What payment methods are accepted for XC7VX330T-2FFG1157I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-2FFG1157I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-2FFG1157I?
XC7VX330T-2FFG1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-2FFG1157I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-2FFG1157I?
For technical support, including XC7VX330T-2FFG1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-2FFG1157I requirements.
6.How does Aetrix verify that XC7VX330T-2FFG1157I is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-2FFG1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-2FFG1157I meets industry standards.
7.What is the process for return or replacement of XC7VX330T-2FFG1157I?
All XC7VX330T-2FFG1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-2FFG1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-2FFG1157I part is unused and in its original packaging.
Return procedure for XC7VX330T-2FFG1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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