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AMD XC7VX330T-2FFG1761C
- Part No.:
- XC7VX330T-2FFG1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-2FFG1761C.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,750
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Product details
Overview
XC7VX330T-2FFG1761C from AMD is a high-performance 28 nm FPGA with 328,950 logic cells, 1,452 DSP slices, and 28.4 Mb of block RAM, configured in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX330T-2FFG1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (13.1 Gb/s), I/O voltage support (1.2 V to 3.3 V), and thermal design power (32 W) under typical operation.
Technical Context
The XC7VX330T-2FFG1761C implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint, 24 GTX transceivers supporting 6.6–13.1 Gb/s, and dual 36-bit AXI-HP interfaces for high-bandwidth memory coherency. It supports partial reconfiguration and built-in system monitoring via on-die temperature and supply sensors.
Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device includes hardened IP blocks for Gigabit Ethernet MAC, 10/100/1000 EMAC, and clock management tiles with MMCM and PLL support for jitter < 150 ps RMS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 328,950 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,452 - enables parallel fixed/floating-point computation for FFT, filtering, and matrix operations |
| Block RAM | 28.4 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM |
| Transceiver Line Rate | 13.1 Gb/s - supports 10G-KR, CPRI, and JESD204B interface compliance at full data throughput |
| I/O Standards | LVDS, SSTL, HSTL, TMDS, MIPI D-PHY - enables direct interfacing with ADCs, DACs, FPD-Link, and image sensors |
| Thermal Design Power | 32 W - defines heatsink and airflow requirements for sustained operation in sealed enclosures |
| Configuration Interface | Master SelectMAP (x32) or JTAG - determines boot mode flexibility and in-system programming capability |
Pinout & Package
XC7VX330T-2FFG1761C is housed in a 1761-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for controlled impedance routing and thermal dissipation in multi-layer PCBs with ≥6 signal layers and dedicated power/ground planes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source (SPI, BPI, NAND, or SelectMAP) and configuration width during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic timing; externally generated for Master SelectMAP mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Initialization | Active-low input signaling readiness to accept configuration data or indicating CRC error |
| GTXREFCLK0/1 | Transceiver Reference Clock | Provides low-jitter reference for GTX transceivers; requires external 100–300 MHz differential source |
| VRP/VRN | Reference Voltage Inputs | Set I/O bank reference voltage for SSTL/HSTL termination and calibration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root complex-compatible interface enabling direct CPU-FPGA DMA without bridge chips |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during operation-critical for multi-mode radar waveform adaptation |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of proprietary IP in deployed systems |
| On-Die Temperature Sensor | Delivers ±2°C accuracy for real-time thermal throttling and fan control in conduction-cooled modules |
| AXI-HP Dual 36-bit Interfaces | Enables concurrent high-throughput streaming to DDR3/DDR4 controllers with independent read/write channels |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems with >1000-element antenna arrays. IC Role / Device Role / Timing Role: Primary compute fabric executing beamforming, CFAR detection, and STAP algorithms with deterministic latency. Use Value: 1,452 DSP slices enable simultaneous 16-channel FFTs at 200 MS/s per channel while maintaining sub-10 µs pipeline latency. | Use Scenario: Multi-channel oscilloscope front-end capturing 12-bit samples at 5 GS/s across 8 analog inputs. IC Role / Device Role / Timing Role: High-speed serializer/deserializer hub synchronizing ADC outputs and buffering into DDR4 via AXI-HP interfaces. Use Value: 24 GTX transceivers support JESD204B subclass 1 links at 13.1 Gb/s, eliminating parallel bus skew and timing closure challenges. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: CT scanner image reconstruction pipeline processing raw projection data from 256 detector rows. IC Role / Device Role / Timing Role: Co-processor accelerating back-projection and iterative reconstruction kernels alongside ARM-based host controller. Use Value: 28.4 Mb block RAM stores full sinogram buffers for 512×512 reconstructions without off-chip memory access stalls. | Use Scenario: Modular PXIe-based protocol analyzer supporting PCIe Gen3, SATA 3.0, and USB 3.1 traffic injection and decoding. IC Role / Device Role / Timing Role: Protocol-aware logic fabric implementing state machines, pattern matching, and timestamp correlation. Use Value: PCIe Gen3 x8 endpoint provides direct host memory mapping for real-time trace capture at >4 GB/s sustained bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute-acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924E | 1924-pin FCBGA, 3.3 GHz transceivers, 5,520 DSP slices, 42.5 Mb BRAM, 16 nm process | Higher DSP density and transceiver speed; suited for 5G massive MIMO baseband but requires more complex power delivery | Select when >10 Gb/s serial link count exceeds 24 or when >3,000 DSP slices are required for real-time AI inference |
| XCVU9P-2FLGA2104I | 2104-pin FCBGA, 58 GTY transceivers (up to 32.75 Gb/s), 6,840 DSP slices, 72.7 Mb BRAM, 16 nm process | Supports PAM4 and coherent optical interfaces; significantly higher power (55 W TDP) and cost | Choose only for 400G ZR/ZR+ optical transport or advanced beamformer ASIC prototyping requiring >25 GTY lanes |
Compared with XCKU115-2FLVF1924E and XCVU9P-2FLGA2104I, the XC7VX330T-2FFG1761C delivers optimal balance of transceiver count, DSP resources, and thermal envelope for mid-tier radar and instrumentation systems where 13.1 Gb/s line rate and 32 W TDP are design constraints.
Availability
XC7VX330T-2FFG1761C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7VX330T-2FFG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, graphics, and AI acceleration technologies for data centers, embedded systems, and high-performance computing.
The Virtex-7 family, including XC7VX330T-2FFG1761C, was engineered for high-bandwidth, low-latency signal and packet processing in defense electronics, scientific instrumentation, and wired communications infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7VX330T-2FFG1761C?
The XC7VX330T-2FFG1761C supports a maximum transceiver line rate of 13.1 Gb/s using its GTX transceivers. This rate is validated for protocols including 10G-KR, CPRI Option 3, and JESD204B subclass 1. Operation above 10.3125 Gb/s requires careful board-level equalization and reference clock jitter below 300 fs RMS.
Does XC7VX330T-2FFG1761C support partial reconfiguration?
Yes, XC7VX330T-2FFG1761C fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic swapping of logic modules-such as different filter banks or modulation schemes-without resetting the entire device, which is essential for adaptive radar and software-defined radio applications.
What I/O standards are supported by XC7VX330T-2FFG1761C?
XC7VX330T-2FFG1761C supports LVDS, SSTL-18/25, HSTL-I/II, TMDS, and MIPI D-PHY across its I/O banks. Each bank operates independently with configurable VCCO and VRP/VRN references, enabling mixed-voltage interfaces-for example, connecting 1.8 V ADCs and 3.3 V FPGAs on the same board.
What is the thermal design power (TDP) of XC7VX330T-2FFG1761C under typical operation?
The thermal design power of XC7VX330T-2FFG1761C is 32 W under typical operating conditions defined in Xilinx UG475. This value assumes 75% logic utilization, 50% DSP usage, and active GTX transceivers at 10.3125 Gb/s. Actual power varies with design-specific activity and voltage scaling settings.
Is XC7VX330T-2FFG1761C compatible with PCIe Gen3 x8 endpoint configurations?
Yes, XC7VX330T-2FFG1761C includes a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification 3.0. It supports both root port and endpoint modes and integrates AXI4 streaming interfaces for seamless integration with DMA engines and memory controllers in the XC7VX330T-2FFG1761C design.
XC7VX330T-2FFG1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX330T-2FFG1761C FAQ
1.How can I place an order for XC7VX330T-2FFG1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-2FFG1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-2FFG1761C reliable?
The price and inventory of XC7VX330T-2FFG1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-2FFG1761C is usually 5 days.
3.What payment methods are accepted for XC7VX330T-2FFG1761C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-2FFG1761C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-2FFG1761C?
XC7VX330T-2FFG1761C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-2FFG1761C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-2FFG1761C?
For technical support, including XC7VX330T-2FFG1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-2FFG1761C requirements.
6.How does Aetrix verify that XC7VX330T-2FFG1761C is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-2FFG1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-2FFG1761C meets industry standards.
7.What is the process for return or replacement of XC7VX330T-2FFG1761C?
All XC7VX330T-2FFG1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-2FFG1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-2FFG1761C part is unused and in its original packaging.
Return procedure for XC7VX330T-2FFG1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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