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AMD XC7VX330T-2FFG1761I
- Part No.:
- XC7VX330T-2FFG1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-2FFG1761I.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,235
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Product details
Overview
XC7VX330T-2FFG1761I from AMD is a high-performance 28 nm Virtex-7 FPGA with 331,200 logic cells, 1,920 DSP slices, and 24.8 Mb of block RAM; supports PCIe Gen3 x8, DDR3-1866 memory interface, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C) in demanding radar signal processing systems.
For engineers reviewing the XC7VX330T-2FFG1761I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (700), transceiver line rate (13.1 Gb/s), thermal design power (35 W typical), and support for JTAG and SelectMAP configuration interfaces.
Technical Context
The XC7VX330T-2FFG1761I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), hardened IP including PCI Express Gen3 endpoints, and integrated 13.1 Gb/s GTY transceivers. It features dual-register LUTs, carry chains, and dedicated arithmetic circuitry enabling high-throughput digital signal processing.
Configuration is supported via Master SPI, Slave Serial, or SelectMAP modes using external flash or processor-controlled interfaces; bitstream encryption and HMAC authentication ensure secure boot integrity for mission-critical deployments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 331,200 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 1,920 - enables parallel multiply-accumulate operations for real-time FFT, filtering, and beamforming |
| Block RAM | 24.8 Mb - provides on-chip memory for buffering radar pulse data and coefficient storage |
| Transceiver Rate | 13.1 Gb/s - supports high-speed serial links to ADC/DACs and backplane interconnects |
| I/O Pins | 700 - allows dense peripheral interfacing including DDR3, PCIe, and custom parallel buses |
| Speed Grade | -2 - guarantees timing closure at 13.1 Gb/s transceiver operation under industrial temperature conditions |
| TDP | 35 W typical - defines thermal management requirements for conduction-cooled enclosure designs |
Pinout & Package
XC7VX330T-2FFG1761I is housed in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI, BPI, or SelectMAP) during power-up initialization |
| CCLK | Configuration Clock | Drives synchronous loading of configuration bitstream from external PROM or processor |
| DONE | Configuration Status | Signals successful completion of configuration and releases I/O pins from high-impedance state |
| INIT_B | Configuration Reset | Indicates configuration controller readiness and resets internal state machines |
| GTYP/N | High-Speed Transceiver | Carries differential 13.1 Gb/s serial data for JESD204B or CPRI links |
| VRP/VRN | Reference Voltage | Provides precision analog reference for I/O bank voltage calibration and termination matching |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and ensures compliance with PCIe 3.0 protocol stack without soft-core overhead |
| DDR3-1866 Memory Controller | Enables direct connection to off-chip memory with 14.9 GB/s peak bandwidth for frame buffering |
| GTY Transceivers (24 lanes) | Supports deterministic low-latency JESD204B subclass 1 links for multi-channel ADC/DAC synchronization |
| Secure Boot with AES-256 | Prevents unauthorized firmware execution by validating encrypted bitstream authenticity before configuration |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during runtime to adapt processing pipelines without full system reset |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and beamforming algorithms with deterministic latency. Use Value: 1,920 DSP slices and 24.8 Mb block RAM enable concurrent multi-target tracking at 100+ frame/sec throughput. | Use Scenario: Offloading matrix multiplication and sparse linear algebra kernels from host CPU in edge inference servers. IC Role / Device Role / Timing Role: Heterogeneous accelerator tightly coupled to DDR3 memory and PCIe Gen3 host interface. Use Value: PCIe Gen3 x8 root port delivers 7.88 GB/s bidirectional bandwidth for rapid model parameter exchange. |
| 5G Massive MIMO Baseband | Test & Measurement Instrumentation |
Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 64T64R active antenna systems. IC Role / Device Role / Timing Role: Real-time baseband processor handling 100+ parallel OFDM subcarriers with sub-100 ns loop latency. Use Value: GTY transceivers synchronized to common 10 MHz reference enable phase-coherent multi-RF-chain operation. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and pattern generator with jitter < 150 fs RMS. Use Value: -2 speed grade guarantees setup/hold timing margins for 13.1 Gb/s serial acquisition link to FPGA fabric. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | UltraScale architecture, 1.5× more logic cells (643,200), higher transceiver rate (16.3 Gb/s), but larger package (1924-pin) | Better suited for next-generation 5G NR and AI inference where logic density and bandwidth exceed XC7VX330T limits | Select XCKU115 when migrating beyond 331K LC capacity or requiring >13.1 Gb/s serial rates |
| XC7VX485T-2FFG1761I | Same Virtex-7 family and package, but 485K logic cells, 2,880 DSP slices, and 34.8 Mb block RAM | Targets higher-complexity radar ECCM and electronic warfare jamming algorithms requiring additional parallel resources | Choose XC7VX485T if existing PCB layout supports same FFG1761 footprint but demands greater computational headroom |
Compared with XC7VX330T-2FFG1761I, the XC7VX485T offers scalable logic density within identical thermal and mechanical constraints, while the XCKU115 delivers architectural advancement at the cost of board redesign-making XC7VX330T optimal for stable, high-volume radar production programs.
Availability
XC7VX330T-2FFG1761I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and high-performance computing acceleration requiring stable component supply across extended product lifecycles.
Supply support for XC7VX330T-2FFG1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace & defense markets with emphasis on performance-per-watt efficiency.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in mission-critical infrastructure including phased-array radar, software-defined radio, and scientific instrumentation.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7VX330T-2FFG1761I?
The XC7VX330T-2FFG1761I supports DDR3-1866 memory interfaces with 1.5 V I/O standard, achieving 14.9 GB/s peak bandwidth using its integrated memory controller. This capability is validated across all I/O banks compatible with SSTL15 I/O standard and requires proper PCB layout adherence to Xilinx UG470 timing constraints.
Does XC7VX330T-2FFG1761I include built-in PCIe Gen3 hard IP?
Yes, XC7VX330T-2FFG1761I integrates hardened PCIe Gen3 x8 endpoint and root port logic compliant with PCI Express Base Specification 3.0. This eliminates the need for soft IP implementation and guarantees deterministic latency, power efficiency, and interoperability with standard host chipsets.
What configuration modes are supported by XC7VX330T-2FFG1761I?
XC7VX330T-2FFG1761I supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and bitstream encryption via AES-256 is available for all modes except JTAG-only debug access.
What is the operating temperature range for XC7VX330T-2FFG1761I?
XC7VX330T-2FFG1761I is rated for industrial temperature operation from -40°C to +100°C case temperature. This rating applies to the FFG1761 package variant and is verified per Xilinx DS841 specification under steady-state thermal conditions with appropriate heatsinking.
How many GTY transceivers does XC7VX330T-2FFG1761I provide?
XC7VX330T-2FFG1761I includes 24 GTY transceiver quads, each supporting data rates up to 13.1 Gb/s. These transceivers are fully compliant with JESD204B subclass 1 and CPRI v7.0 standards, enabling deterministic synchronization for multi-channel ADC/DAC systems.
XC7VX330T-2FFG1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX330T-2FFG1761I FAQ
1.How can I place an order for XC7VX330T-2FFG1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-2FFG1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-2FFG1761I reliable?
The price and inventory of XC7VX330T-2FFG1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-2FFG1761I is usually 5 days.
3.What payment methods are accepted for XC7VX330T-2FFG1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-2FFG1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-2FFG1761I?
XC7VX330T-2FFG1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-2FFG1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-2FFG1761I?
For technical support, including XC7VX330T-2FFG1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-2FFG1761I requirements.
6.How does Aetrix verify that XC7VX330T-2FFG1761I is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-2FFG1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-2FFG1761I meets industry standards.
7.What is the process for return or replacement of XC7VX330T-2FFG1761I?
All XC7VX330T-2FFG1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-2FFG1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-2FFG1761I part is unused and in its original packaging.
Return procedure for XC7VX330T-2FFG1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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