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AMD XC7VX330T-2FFV1761C
- Part No.:
- XC7VX330T-2FFV1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-2FFV1761C.pdf
- Description:
- IC FPGA 700 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,715
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Product details
Overview
XC7VX330T-2FFV1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 328,950 logic cells, 2,496 DSP slices, and 28.4 Mb of block RAM. It features 700 I/O pins in a flip-chip BGA package and supports transceivers up to 13.1 Gb/s for high-speed serial communication in radar signal processing systems.
For engineers reviewing the XC7VX330T-2FFV1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.2 V to 3.3 V), thermal design power (24 W typical), and configuration interface compatibility (SPIx4, SelectMAP).
Technical Context
The XC7VX330T-2FFV1761C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and integrated PCI Express Gen3 x8 endpoint capability. It includes 24 transceiver quads supporting protocols including CPRI, SRIO, and 10GBASE-R.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation in software-defined radio platforms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 328,950 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 2,496 - enables parallel multiply-accumulate operations for FIR filtering and beamforming |
| Block RAM | 28.4 Mb - supports large on-chip buffering for video frame storage or packet queuing |
| Transceiver Speed | 13.1 Gb/s - meets line-rate requirements for 10G Ethernet and CPRI Option 3 links |
| I/O Pins | 700 - provides high-density interconnect for multi-FPGA backplanes or sensor array interfaces |
| TDP | 24 W typical - defines thermal solution sizing and airflow requirements in conduction-cooled enclosures |
Pinout & Package
XC7VX330T-2FFV1761C is housed in a 1761-pin flip-chip fine-pitch BGA (FFV) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB routing and thermal dissipation via solder-ball thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, or SelectMAP) at power-up |
| CCLK | Configuration Clock | Drives synchronous loading of configuration bitstream from external flash |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| INIT_B | Configuration Initialization | Active-low signal indicating readiness to accept new configuration data |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter timing reference for high-speed serial lanes (100–750 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Integrated hard IP enabling direct host CPU connectivity without external bridge logic |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation for multi-mode waveform execution |
| AXI4-Stream Support | Enables zero-overhead streaming between IP cores for real-time signal processing pipelines |
| HMAC Authentication | Verifies bitstream integrity before configuration, preventing unauthorized firmware injection |
| UltraScale-Compatible Toolflow | Supports Vivado 2019.2+ synthesis and implementation for consistent migration path |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and track-before-detect algorithms with deterministic latency. Use Value: 2,496 DSP slices enable simultaneous 128-channel FFT + matrix inversion within 50 µs frame time. | Use Scenario: Digitization and preprocessing of 16-bit, 250 MS/s analog inputs from scientific instrumentation. IC Role / Device Role / Timing Role: Interfaces directly with ADCs via LVDS and buffers raw samples in 28.4 Mb block RAM before compression. Use Value: 700 I/O pins support 32-channel parallel LVDS capture with sub-ns skew control. |
| Software-Defined Radio (SDR) | Medical Imaging Backend |
Use Scenario: Multi-band, multi-standard baseband processing in 5G NR and LTE-A macrocell radios. IC Role / Device Role / Timing Role: Hosts reconfigurable PHY layers and MAC offload engines synchronized to 13.1 Gb/s CPRI fronthaul links. Use Value: PCIe Gen3 x8 provides 7.88 GB/s host memory bandwidth for real-time RAN sharing. | Use Scenario: Real-time reconstruction pipeline for MRI and CT scanner raw k-space data. IC Role / Device Role / Timing Role: Executes iterative reconstruction kernels (e.g., SART, compressed sensing) using pipelined DSP slices. Use Value: Partial reconfiguration allows switching between reconstruction algorithms without system reset. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale+ architecture; higher DSP count (5,520); 16.3 Gb/s transceivers; lower TDP (19 W) | Better suited for AI-accelerated inference at edge; requires updated toolchain (Vivado 2020.1+) | Select when migrating to newer process node and requiring higher compute density per watt |
| XC7VX485T-2FFG1761I | Same Virtex-7 family; larger logic capacity (485,760 cells); industrial temperature grade (-40°C to +100°C) | Preferred for extended-temperature avionics or downhole oilfield equipment | Select when additional LUT resources are required and extended temperature operation is mandatory |
Compared with XC7VX330T-2FFV1761C, the XCVU3P-2FFVD1760E delivers higher transceiver speed and DSP density but mandates toolchain upgrade, while the XC7VX485T-2FFG1761I offers more logic resources and wider temperature tolerance at the cost of higher static power and larger footprint.
Availability
XC7VX330T-2FFV1761C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and software-defined radio applications requiring stable component supply across long production lifecycles.
Supply support for XC7VX330T-2FFV1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex-7 family targets high-throughput, low-latency signal processing in defense electronics, scientific computing, and wired/wireless infrastructure where deterministic performance and configurability are critical.
FAQ
What is the maximum supported transceiver line rate for XC7VX330T-2FFV1761C?
The XC7VX330T-2FFV1761C supports transceiver line rates up to 13.1 Gb/s per lane. This enables compliance with 10GBASE-R Ethernet, CPRI Option 3, and SRIO Gen2 protocols. Performance is validated under standard junction temperature conditions and requires proper reference clock jitter specification (≤ 1.0 ps RMS) for reliable lock.
Does XC7VX330T-2FFV1761C support partial reconfiguration?
Yes, XC7VX330T-2FFV1761C supports hardware-verified partial reconfiguration through Vivado Design Suite. This capability allows dynamic replacement of logic modules while the rest of the design remains operational, essential for multi-mode SDR waveforms and adaptive radar processing where runtime mode switching is required.
What configuration interfaces are available on XC7VX330T-2FFV1761C?
XC7VX330T-2FFV1761C supports Master SPI (x1/x2/x4), SelectMAP (x8/x16), and JTAG configuration modes. SPIx4 is commonly used for fast parallel bitstream loading from quad-SPI flash, while JTAG is reserved for debugging and programming during development and field updates.
Is XC7VX330T-2FFV1761C compatible with PCIe Gen3 x8?
Yes, XC7VX330T-2FFV1761C integrates a hardened PCIe Gen3 x8 endpoint block. It complies with PCI Express Base Specification Revision 3.0 and supports both root complex and endpoint roles. Link training, power management states (L0s/L1), and transaction layer packet handling are implemented in dedicated silicon.
What is the thermal design power (TDP) of XC7VX330T-2FFV1761C?
The typical thermal design power (TDP) of XC7VX330T-2FFV1761C is 24 W under representative operating conditions. This value assumes full utilization of DSP slices and transceivers at 85°C junction temperature. Actual power varies with design utilization, I/O activity, and voltage scaling settings configured in Vivado.
XC7VX330T-2FFV1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX330T-2FFV1761C FAQ
1.How can I place an order for XC7VX330T-2FFV1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-2FFV1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-2FFV1761C reliable?
The price and inventory of XC7VX330T-2FFV1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-2FFV1761C is usually 5 days.
3.What payment methods are accepted for XC7VX330T-2FFV1761C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-2FFV1761C transactions.
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4.How is shipping managed for XC7VX330T-2FFV1761C?
XC7VX330T-2FFV1761C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-2FFV1761C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-2FFV1761C?
For technical support, including XC7VX330T-2FFV1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-2FFV1761C requirements.
6.How does Aetrix verify that XC7VX330T-2FFV1761C is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-2FFV1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-2FFV1761C meets industry standards.
7.What is the process for return or replacement of XC7VX330T-2FFV1761C?
All XC7VX330T-2FFV1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-2FFV1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-2FFV1761C part is unused and in its original packaging.
Return procedure for XC7VX330T-2FFV1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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