AMD XC7VX330T-3FFG1157E

Overview

XC7VX330T-3FFG1157E from AMD is a high-performance 28 nm FPGA with 330,000 logic cells, 1,440 DSP slices, and 24.2 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.

For engineers reviewing the XC7VX330T-3FFG1157E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, and -3 speed grade timing performance under industrial temperature range.

Technical Context

The XC7VX330T-3FFG1157E implements a 28 nm High-K Metal Gate (HKMG) process architecture with integrated SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. It integrates 24 multi-gigabit GTs (GTX/GTH) with built-in PRBS generators and error detectors.

This device belongs to the Virtex-7 family's "T" (Transceiver-optimized) subgroup and supports PCI Express Gen3 x8 endpoint configuration, 10G Ethernet MAC integration, and deterministic AXI-4 interconnect routing with sub-200 ps clock-to-out timing variation across banks.

Key Specifications

Pinout & Package

XC7VX330T-3FFG1157E is housed in a 1157-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, thermal lid, and exposed thermal pad. Pin assignment follows Xilinx/AMD Virtex-7 FFG1157 mechanical and electrical specification v1.3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC7VX330T-3FFG1157E, XCVU3P-2FFVD1760E offers 57% more logic and 14% faster transceivers but mandates new PCB design, while XC7VX485T-3FFG1157I delivers pin-compatible scalability within the same thermal and mechanical envelope.

Availability

XC7VX330T-3FFG1157E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.

Supply support for XC7VX330T-3FFG1157E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and aerospace markets with emphasis on performance-per-watt and heterogeneous integration.

The Virtex-7 family was engineered for high-bandwidth, low-latency compute acceleration in defense electronics, scientific instrumentation, and wired/wireless infrastructure where deterministic timing and transceiver density are critical.

FAQ

What is the maximum transceiver line rate supported by XC7VX330T-3FFG1157E?

The XC7VX330T-3FFG1157E supports a maximum transceiver line rate of 13.1 Gbps using its GTX/GTH multi-gigabit transceivers. This capability enables direct interface with 10G Ethernet PHYs, CPRI, and Aurora high-speed serial protocols. The -3 speed grade ensures reliable operation at this rate across the full industrial temperature range.

Does XC7VX330T-3FFG1157E support partial reconfiguration?

Yes, XC7VX330T-3FFG1157E fully supports partial reconfiguration through Vivado Design Suite. This allows runtime swapping of functional modules-such as beamforming kernels or protocol stacks-without resetting the entire device. The feature is widely used in radar and communications systems where dynamic adaptation is required.

What I/O standards are supported by XC7VX330T-3FFG1157E?

XC7VX330T-3FFG1157E supports SSTL-15/18, HSTL-I/II, LVCMOS (1.2 V to 3.3 V), LVDS, TMDS, and differential signaling standards. Each I/O bank has independent VCCO and VREF, enabling mixed-voltage operation. This flexibility simplifies interfacing with DDR3/DDR4 memory, ADCs, DACs, and legacy parallel buses.

Is XC7VX330T-3FFG1157E qualified for industrial temperature operation?

Yes, the XC7VX330T-3FFG1157E is rated for industrial temperature operation from -40°C to +100°C, as specified in AMD's Virtex-7 DC and AC characteristics documentation. This qualification includes full timing closure, configuration reliability, and transceiver jitter performance across the range.

What PCIe configuration does XC7VX330T-3FFG1157E support?

XC7VX330T-3FFG1157E supports PCIe Gen3 x8 endpoint configuration using its hardened PCIe block. It complies with the PCIe Base Specification v3.0 and supports advanced features including ASPM, MSI-X, and TLP digest generation. The -3 speed grade ensures deterministic latency and full link training at Gen3 speeds.