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AMD XC7VX330T-3FFG1761E
- Part No.:
- XC7VX330T-3FFG1761E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX330T-3FFG1761E.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,943
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Product details
Overview
XC7VX330T-3FFG1761E from AMD is a high-performance 28 nm Virtex-7 FPGA with 328,950 logic cells, 2,496 DSP slices, 28.4 Mb of block RAM, 960 I/O pins, and -3 speed grade for demanding compute-acceleration and high-bandwidth interface applications in radar processing and 100G optical transport.
For engineers reviewing the XC7VX330T-3FFG1761E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and configuration via Master SelectMAP or JTAG.
Technical Context
The XC7VX330T-3FFG1761E implements a heterogeneous architecture with programmable logic fabric, hardened multi-gigabit transceivers (MGTs), and integrated memory controllers. It supports PCIe Gen3 x8, 10/40/100G Ethernet MACs, and DDR3/DDR4 memory interfaces up to 1866 Mbps.
Configuration is performed through dual-mode SPIx4 or BPI parallel flash, with bitstream encryption and HMAC authentication enabled. The device includes dedicated clock management tiles with MMCM and PLL blocks supporting jitter filtering and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 328,950 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 2,496 - enables high-throughput fixed/floating-point arithmetic for signal processing pipelines |
| Block RAM | 28.4 Mb - supports large on-chip buffering and FIFOs without external memory |
| Transceiver Speed | 13.1 Gb/s - meets 100G KR4/CAUI-4 and OTU4 serial line rate requirements |
| I/O Pins | 960 - provides high-density parallel interface routing for memory, sensors, and FMC mezzanines |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies under worst-case conditions |
| Configuration Interface | Master SelectMAP/BPI/JTAG - enables flexible, secure, and field-upgradable bitstream loading |
Pinout & Package
XC7VX330T-3FFG1761E is housed in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for high-power operation. Pinout follows Xilinx (now AMD) Virtex-7 FFG1761 mechanical and electrical specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (e.g., Master SelectMAP, JTAG) at power-on reset |
| CCLK | Configuration Clock | Drives synchronous bitstream loading during Master SelectMAP mode |
| DIN | Data Input | Serial data input for configuration bitstream in Master SelectMAP mode |
| INIT_B | Initialization Status | Open-drain output indicating configuration memory readiness and error state |
| PROGRAM_B | Configuration Reset | Active-low signal to initiate reconfiguration and clear internal state |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter reference for multi-gigabit transceiver PLLs |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces integration effort and latency for host-attached acceleration cards |
| Integrated Memory Controller | Supports DDR3/DDR4 up to 1866 Mbps with ECC and AXI4 interface |
| UltraScale-compatible Transceivers | Delivers 13.1 Gb/s line rates with built-in PRBS generation and error detection |
| Bitstream Encryption | Prevents IP theft via AES-256 decryption and HMAC-based authentication |
| Partial Reconfiguration Support | Enables dynamic function swapping without full system reset or downtime |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine implementing FFT, CFAR, and digital down-conversion pipelines. Use Value: 2,496 DSP slices and 28.4 Mb block RAM enable single-chip implementation of multi-channel radar algorithms with deterministic latency. | Use Scenario: Line-card processing in metro/core DWDM systems with OTU4 framing and FEC. IC Role / Device Role / Timing Role: Protocol-aware transceiver controller with SerDes, gearbox, and OTN mapping logic. Use Value: 13.1 Gb/s transceivers and hardened 100G Ethernet MACs eliminate need for external retimers or framer ICs. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: FPGA-accelerated financial risk modeling and genomics sequence alignment in data centers. IC Role / Device Role / Timing Role: PCIe Gen3 x8 attached coprocessor executing custom kernels with direct host memory access. Use Value: 960 I/O pins and AXI4 memory controller support high-bandwidth data streaming between CPU, DRAM, and accelerator logic. | Use Scenario: High-resolution real-time spectrum analysis and arbitrary waveform generation in benchtop analyzers. IC Role / Device Role / Timing Role: Timing-critical signal generator core with synchronized ADC/DAC control and FFT engine. Use Value: -3 speed grade and MMCM-based clock networks ensure sub-nanosecond skew for multi-channel sampling and synthesis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture, higher logic density (1,024K LC), lower power per DSP, 16.3 Gb/s transceivers | Better suited for AI inference acceleration and 400G Ethernet where bandwidth exceeds Virtex-7 capability | Select when migrating to newer process node and requiring >13.1 Gb/s serial I/O |
| XC7VX485T-3FFG1761I | Same Virtex-7 family and FFG1761 package, but higher logic count (485,760 LC) and extended temperature range (-40°C to +100°C) | Preferred for aerospace and defense deployments requiring industrial temperature qualification | Choose for identical footprint compatibility with increased logic headroom and extended thermal rating |
Compared with XC7VX330T-3FFG1761E, the XCVU13P-2FLGA2577E offers higher transceiver speed and logic density on a newer node, while the XC7VX485T-3FFG1761I delivers identical packaging and enhanced thermal robustness at higher logic capacity-both require design validation but share no pin-to-pin compatibility.
Availability
XC7VX330T-3FFG1761E is available at Aetrix Electronics and suitable for radar processing, 100G optical transport, and high-performance computing acceleration requiring stable component supply and long-term program support.
Supply support for XC7VX330T-3FFG1761E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-7 family, including XC7VX330T-3FFG1761E, was designed for high-bandwidth, high-compute applications such as wireless infrastructure, defense radar, and optical networking equipment.
FAQ
What is the maximum supported transceiver line rate for XC7VX330T-3FFG1761E?
The XC7VX330T-3FFG1761E supports a maximum transceiver line rate of 13.1 Gb/s per channel. This performance level enables compliance with 100G Ethernet KR4/CAUI-4 and OTU4 standards. The transceivers are based on the Virtex-7 GTH architecture and include built-in PRBS generators and error detectors for link validation.
Does XC7VX330T-3FFG1761E support PCIe Gen3 x8 endpoint functionality?
Yes, XC7VX330T-3FFG1761E includes hardened PCIe Gen3 x8 endpoint blocks compliant with PCI Express Base Specification v3.0. These blocks provide low-latency, high-throughput connectivity to host processors and support features including completion timeout, advanced error reporting, and MSI-X interrupt delivery.
What configuration modes are supported by XC7VX330T-3FFG1761E?
XC7VX330T-3FFG1761E supports Master SelectMAP, Slave SelectMAP, JTAG, and BPI parallel flash configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Bitstream encryption and HMAC authentication are available in all modes to protect intellectual property during field updates.
What memory interfaces does XC7VX330T-3FFG1761E support?
XC7VX330T-3FFG1761E integrates a hardened memory controller supporting DDR3, DDR3L, and DDR4 SDRAM up to 1866 Mbps. It provides AXI4 interface to user logic and includes ECC support for single-bit error correction and double-bit error detection on data paths.
Is XC7VX330T-3FFG1761E compatible with the FFG1761 package footprint used by other Virtex-7 devices?
Yes, XC7VX330T-3FFG1761E uses the standard 1761-ball FFG package defined for the Virtex-7 family. Its mechanical footprint and thermal lid design match other FFG1761 variants like XC7VX485T-3FFG1761I, enabling PCB reuse where logic and I/O constraints permit-but pin functions and voltage assignments must be verified per device-specific documentation.
XC7VX330T-3FFG1761E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25500
- Number of Logic Elements/Cells:
- 326400
- Total RAM Bits:
- 27648000
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX330T-3FFG1761E FAQ
1.How can I place an order for XC7VX330T-3FFG1761E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX330T-3FFG1761E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX330T-3FFG1761E reliable?
The price and inventory of XC7VX330T-3FFG1761E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX330T-3FFG1761E is usually 5 days.
3.What payment methods are accepted for XC7VX330T-3FFG1761E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX330T-3FFG1761E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX330T-3FFG1761E?
XC7VX330T-3FFG1761E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX330T-3FFG1761E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX330T-3FFG1761E?
For technical support, including XC7VX330T-3FFG1761E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX330T-3FFG1761E requirements.
6.How does Aetrix verify that XC7VX330T-3FFG1761E is sourced from the original manufacturer or authorized distributors?
All XC7VX330T-3FFG1761E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX330T-3FFG1761E meets industry standards.
7.What is the process for return or replacement of XC7VX330T-3FFG1761E?
All XC7VX330T-3FFG1761E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX330T-3FFG1761E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX330T-3FFG1761E part is unused and in its original packaging.
Return procedure for XC7VX330T-3FFG1761E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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