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AMD XC7VX415T-1FF1157I
- Part No.:
- XC7VX415T-1FF1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-1FF1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,005
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Product details
Overview
XC7VX415T-1FF1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,800 logic cells, 2,040 DSP slices, and 48.8 Mb of block RAM. It features 1157-pin flip-chip fine-pitch BGA (FF1157) packaging, operates at -1 speed grade, and supports transceivers up to 13.1 Gb/s - deployed in radar signal processing and high-throughput data acquisition systems.
For engineers reviewing the XC7VX415T-1FF1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (36 GTs), I/O voltage support (1.2 V to 3.3 V), thermal design power (19.2 W typical), and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XC7VX415T-1FF1157I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 multi-gigabit transceivers (GTs), and integrated PCIe Gen3 x8 endpoint capability. It supports AXI4 interconnect protocols and includes hardened IP for Ethernet MAC, memory controllers (DDR3/DDR4), and clock management (MMCM/PLL).
Configuration is performed via dual-boot capable SPI flash or JTAG, with bitstream encryption (AES-256) and HMAC authentication. The device supports partial reconfiguration and dynamic power gating per CLB column and GT bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,800 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,040 - enables parallel fixed/floating-point computation for real-time filtering and FFT acceleration |
| Block RAM | 48.8 Mb - supports large on-chip buffering for video frame stores or packet queuing without external memory |
| Transceivers | 36 GT lanes @ up to 13.1 Gb/s - delivers 469.2 Gb/s aggregate serial bandwidth for high-speed interconnect |
| I/O Standards | LVDS, SSTL, HSTL, TMDS, MIPI D-PHY - enables direct interfacing with image sensors, memory, and display interfaces |
| Speed Grade | -1 - specifies timing closure margin for designs targeting 600 MHz system clocks with moderate routing delay |
| TDP | 19.2 W typical - defines thermal envelope requiring active cooling in dense PCB layouts |
Pinout & Package
XC7VX415T-1FF1157I uses a 1157-pin flip-chip fine-pitch BGA (FF1157) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid. Pin functions are organized into I/O banks (34 total), GT banks (4), configuration banks (2), and dedicated power/ground balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M17 | CONFIG_DONE | Open-drain status output confirming successful bitstream loading and I/O initialization |
| R15 | INIT_B | Active-low bidirectional pin indicating configuration status and enabling reconfiguration handshake |
| P14 | CCLK | Configuration clock input for master SPI mode; also used as user clock during operation |
| G18 | MRCC_0 | Multi-Region Clock Capable input for primary clock network driving MMCM and GT reference clocks |
| H17 | SRCC_0 | Single-Region Clock Capable input for secondary clock domains including I/O banks and fabric logic |
| A12 | GTGREFCLK0 | Dedicated differential reference clock input for transceiver bank 0, supporting 100 MHz to 800 MHz frequencies |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root port logic eliminates need for soft IP, reducing latency and resource usage by ~25% |
| AXI4 Interconnect Support | Native integration with Xilinx Vivado IP integrator enables plug-and-play subsystem assembly with timing-aware routing |
| Partial Reconfiguration | Allows runtime swapping of logic partitions without resetting system state or halting I/O operations |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning and reverse engineering of firmware through hardware-enforced decryption at boot |
| Dynamic Power Gating | Per-column CLB and per-bank GT shutdown reduces static power by up to 38% during low-activity intervals |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, matched filtering, and CFAR detection; GTs stream ADC samples at 5 GSPS via JESD204B. Use Value: 36 GT lanes enable concurrent multi-channel JESD204B links, eliminating external serializer/deserializer chips. | Use Scenario: Multi-sensor fusion in test equipment capturing synchronized analog waveforms across 16 channels at 1 GS/s. IC Role / Device Role / Timing Role: XC7VX415T-1FF1157I serves as central timing and data aggregation hub, managing DDR4 memory buffers and PCIe Gen3 host upload. Use Value: 48.8 Mb block RAM provides 48 ms of full-rate waveform storage before host transfer, avoiding data loss during burst capture. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: CT scanner image reconstruction pipeline handling 200+ MB/s raw detector data from photon-counting sensors. IC Role / Device Role / Timing Role: XC7VX415T-1FF1157I performs real-time histogram equalization, back-projection, and DICOM compression using DSP slices and AXI-connected accelerators. Use Value: 2,040 DSP slices deliver >128 GOPS peak throughput for iterative reconstruction algorithms without GPU offload. | Use Scenario: ARINC 664 Part 7 (AFDX) end-system aggregating 64 virtual links across flight control, navigation, and health monitoring subsystems. IC Role / Device Role / Timing Role: XC7VX415T-1FF1157I implements deterministic AFDX switch fabric with time-triggered scheduling and CRC-32 integrity checking per frame. Use Value: Hardened PCIe Gen3 x8 endpoint enables direct connection to avionics host processor, reducing latency by 4.2 μs vs. legacy PCI-X bridges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924I | UltraScale architecture; higher logic density (1.1M LC), lower power per LC, but no native PCIe Gen3 endpoint - requires soft IP | Better suited for compute-intensive AI inference pipelines where PCIe host interface is secondary | Select when migrating to 20 nm node for improved power efficiency and larger memory-mapped address space |
| XC7VX690T-2FFG1927I | Same Virtex-7 family; 690K LC, 56 GTs, larger FF1927 package - higher I/O count and transceiver density | Required for systems needing >36 GT lanes or >1,000 user I/Os, e.g., multi-FPGA interconnect fabrics | Choose only if XC7VX415T-1FF1157I resources are insufficient and board layout allows FF1927 footprint |
Compared with XC7VX415T-1FF1157I, the XCKU115 offers better compute density and lower static power but increases design complexity due to PCIe soft IP integration, while the XC7VX690T provides scalable I/O and transceiver headroom at the cost of larger footprint and higher TDP (28.5 W).
Availability
XC7VX415T-1FF1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7VX415T-1FF1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, and embedded markets with emphasis on performance-per-watt and heterogeneous integration.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense, aerospace, and scientific instrumentation applications demanding deterministic timing and radiation-tolerant configuration.
FAQ
What is the maximum supported transceiver data rate for XC7VX415T-1FF1157I?
The XC7VX415T-1FF1157I supports transceiver data rates up to 13.1 Gb/s per GT lane. This specification is validated under -1 speed grade conditions with proper reference clock stability and PCB channel loss ≤15 dB at Nyquist frequency. The XC7VX415T-1FF1157I achieves this using adaptive equalization and decision feedback equalization (DFE) within each GT transceiver block.
Does XC7VX415T-1FF1157I include hardened PCIe Gen3 support?
Yes, the XC7VX415T-1FF1157I integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. This eliminates the need for soft IP implementation and guarantees deterministic latency, link training compliance, and power management states (L0s/L1) without consuming programmable logic resources.
What configuration modes are supported by XC7VX415T-1FF1157I?
The XC7VX415T-1FF1157I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Dual-boot capability allows switching between two independent bitstreams stored in external SPI flash. Configuration security features include AES-256 encryption and HMAC authentication, both enforced in hardware during boot.
What is the I/O voltage range supported by XC7VX415T-1FF1157I?
The XC7VX415T-1FF1157I supports I/O standards operating from 1.2 V to 3.3 V across its 34 I/O banks. Each bank is independently powered, allowing mixed-voltage operation - for example, 1.8 V LVDS for sensor interfaces and 3.3 V LVTTL for legacy control signals simultaneously. Bank-specific VCCO and VRP/VRN settings are configured via configuration bitstream.
Is partial reconfiguration supported on XC7VX415T-1FF1157I?
Yes, the XC7VX415T-1FF1157I fully supports partial reconfiguration (PR) as defined in Xilinx UG909. PR enables dynamic replacement of logic modules while maintaining system operation - critical for adaptive radar waveform updates or protocol stack switching. The XC7VX415T-1FF1157I requires PR-enabled bitstreams generated in Vivado and compatible configuration controller firmware.
XC7VX415T-1FF1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX415T-1FF1157I FAQ
1.How can I place an order for XC7VX415T-1FF1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-1FF1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-1FF1157I reliable?
The price and inventory of XC7VX415T-1FF1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-1FF1157I is usually 5 days.
3.What payment methods are accepted for XC7VX415T-1FF1157I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-1FF1157I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX415T-1FF1157I?
XC7VX415T-1FF1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX415T-1FF1157I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-1FF1157I?
For technical support, including XC7VX415T-1FF1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-1FF1157I requirements.
6.How does Aetrix verify that XC7VX415T-1FF1157I is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-1FF1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-1FF1157I meets industry standards.
7.What is the process for return or replacement of XC7VX415T-1FF1157I?
All XC7VX415T-1FF1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-1FF1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-1FF1157I part is unused and in its original packaging.
Return procedure for XC7VX415T-1FF1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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