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AMD XC7VX415T-1FFG1157C
- Part No.:
- XC7VX415T-1FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-1FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,523
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Product details
Overview
XC7VX415T-1FFG1157C from AMD is a high-performance 28 nm FPGA with 415,120 logic cells, 2,040 DSP slices, and 32.1 Mb of block RAM, configured in a 1157-pin flip-chip BGA package with 0.8 mm pitch; used in high-bandwidth data processing systems such as radar signal processors and 100G Ethernet line cards.
For engineers reviewing the XC7VX415T-1FFG1157C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver speed (13.1 Gb/s GTY), thermal design power (29.5 W typical), and support for PCIe Gen3 x8 endpoint configuration.
Technical Context
This device belongs to the Xilinx Virtex-7 family and implements a 28 nm HKMG process with stacked silicon interconnect (SSI) technology using two FPGA dies on a passive interposer. It supports partial reconfiguration, AXI4-Stream interfaces, and deterministic latency modes for real-time processing.
The XC7VX415T-1FFG1157C integrates 24 GTY transceivers, each capable of 10–13.1 Gb/s operation, and includes hardened IP blocks for PCI Express Gen3, 10/25/100G Ethernet MAC, and DDR3/DDR4 memory controllers with up to 1866 MT/s data rates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,120 LUTs + flip-flops; enables complex digital signal processing pipelines with multi-stage filtering and FFT acceleration. |
| DSP Slices | 2,040 dedicated arithmetic units; supports simultaneous 25×18-bit multiply-accumulate operations per slice at 500 MHz. |
| Block RAM | 32.1 Mb total; configurable as 36 Kb dual-port RAM or 18 Kb single-port RAM for buffering high-throughput data streams. |
| GTY Transceivers | 24 channels, 10–13.1 Gb/s; provides native support for CPRI, JESD204B, and 100G KR4 protocols without external retimers. |
| User I/O Pins | 500 LVDS-capable pins; supports differential standards including LVDS, TMDS, and sub-LVDS with programmable drive strength and slew rate. |
| Memory Interface | DDR3/DDR4 controller up to 1866 MT/s; enables direct connection to 64-bit wide memory subsystems with ECC support. |
| Thermal Design Power | 29.5 W typical; requires active cooling and thermal interface material compatible with 1157-pin FFG package footprint. |
Pinout & Package
The XC7VX415T-1FFG1157C is housed in a 1157-pin flip-chip BGA (FFG) package with 0.8 mm ball pitch, 35 mm × 35 mm body size, and RoHS-compliant lead-free finish. Thermal pad on underside requires solder paste stencil aperture matching IPC-7351B standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering logic fabric and CLBs; requires low-noise ceramic decoupling within 10 mm of each power ball group. |
| VCCAUX | Auxiliary supply | 1.8 V ±3% supply for configuration logic, SelectIO banks, and transceiver analog circuitry. |
| VCCO | I/O bank supply | Programmable 1.2–3.3 V per bank; sets voltage level and signaling standard compatibility for connected peripherals. |
| MGTAVCC | GTY analog supply | 1.0 V ±3% dedicated supply for GTY transceiver analog front-end; isolated routing and separate regulator required. |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error; pulled high externally during normal operation. |
| PROGRAM_B | Configuration reset | Active-low asynchronous input that clears configuration memory and initiates reconfiguration sequence. |
Key Features
| Feature | Design Value |
|---|---|
| Stacked Silicon Interconnect (SSI) | Enables monolithic-like capacity by integrating two FPGA dies on a silicon interposer, delivering 415K logic cells without yield penalty of single-die scaling. |
| Partial Reconfiguration | Allows dynamic swapping of logic modules at runtime-e.g., switching between radar waveform generators-without system reset or interrupting data flow. |
| Hardened PCIe Gen3 Endpoint | Integrated root port logic eliminates need for external bridge ICs; supports x1/x2/x4/x8 lane widths and ASPM power management states. |
| AXI4-Stream Support | Native interface for high-throughput streaming data paths; enables zero-cycle handshaking and backpressure propagation across IP blocks. |
| UltraScale Architecture Compatibility | RTL and constraints files can be migrated to UltraScale+ devices with minimal changes, easing long-term roadmap planning. |
Applications
| Radar Signal Processing | 100G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing of phased-array radar returns with adaptive beamforming and clutter suppression. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic latency under 2 µs per pipeline stage. Use Value: 2,040 DSP slices enable concurrent 1024-point FFTs at 200 MHz clock, reducing processing latency versus ASIC-based alternatives. | Use Scenario: Aggregation and packet classification in carrier-grade optical transport equipment handling 100Gbps line-rate traffic. IC Role / Device Role / Timing Role: Line card controller managing 4×25G SerDes lanes, MAC-layer framing, and TCAM-assisted lookup via embedded BRAM. Use Value: 24 GTY transceivers support KR4 FEC and IEEE 802.3bj compliance, eliminating need for external retimer chips. |
| Medical Imaging Accelerator | Test & Measurement Instrumentation |
Use Scenario: Real-time reconstruction of MRI k-space data into image volumes using iterative SENSE algorithms. IC Role / Device Role / Timing Role: Co-processor offloading GPU-hosted reconstruction tasks; synchronized with DDR4 memory subsystem at 1866 MT/s. Use Value: 32.1 Mb block RAM buffers full k-space matrices while DSP slices execute parallel conjugate gradient solvers. | Use Scenario: High-resolution oscilloscope front-end capturing 10 GS/s waveforms with real-time FFT and jitter analysis. IC Role / Device Role / Timing Role: Acquisition controller managing ADC interface, deep memory buffering, and hardware-accelerated spectral analysis. Use Value: 500 user I/Os support LVDS-sampled ADC arrays; deterministic timing ensures sub-picosecond skew across 32-channel capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 1.3M logic cells, 5,520 DSP slices, 43.2 Mb BRAM; 16 nm process; higher density but larger package (2577-ball). | Used where >500K logic cells or >30 GT transceivers are required; not suitable for space-constrained 1157-ball layouts. | Select when migrating to next-generation architecture with higher throughput needs and board redesign is feasible. |
| XC7VX690T-2FFG1927I | 693,120 logic cells, 3,600 DSP slices, 48.9 Mb BRAM; same 28 nm process but larger 1927-ball FFG package. | Targets applications needing more on-chip memory bandwidth and wider I/O expansion; incompatible pinout and thermal profile. | Choose for maximum Virtex-7 capacity without moving to UltraScale; verify PCB redesign and cooling capability. |
Compared with XC7VX415T-1FFG1157C, the XCVU13P offers higher performance at greater power and area cost, while the XC7VX690T delivers more resources within the same process node but demands significantly larger board space and thermal management.
Availability
XC7VX415T-1FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, 100G Ethernet infrastructure, and medical imaging accelerator designs requiring stable component supply across extended production lifecycles.
Supply support for XC7VX415T-1FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and wired/wireless infrastructure.
The Virtex-7 family-including XC7VX415T-1FFG1157C-was designed for high-throughput, low-latency signal and packet processing in mission-critical communication and defense systems.
FAQ
What is the maximum supported transceiver data rate for XC7VX415T-1FFG1157C?
The XC7VX415T-1FFG1157C supports GTY transceivers operating at 10–13.1 Gb/s per channel. This enables compliance with JESD204B Subclass 1, CPRI Option 7, and 100GBASE-KR4 standards. The 13.1 Gb/s rate is achievable under specified voltage and temperature conditions with appropriate reference clock jitter below 0.3 ps RMS.
Does XC7VX415T-1FFG1157C support PCIe Gen3 x8 endpoint mode?
Yes, XC7VX415T-1FFG1157C includes a hardened PCIe Gen3 endpoint block supporting x1, x2, x4, and x8 configurations. It meets PCIe Base Spec 3.0 and supports advanced features including ASPM L0s/L1, ECRC, and MSI-X. Configuration is performed via integrated configuration space accessible through AXI4-Lite interface.
What memory standards does XC7VX415T-1FFG1157C support natively?
XC7VX415T-1FFG1157C supports DDR3 and DDR4 SDRAM interfaces up to 1866 MT/s with 64-bit data width and optional ECC. It includes dedicated PHY logic, write leveling, read leveling, and gate training. QDR SRAM and RLDRAM III are supported via soft IP or third-party cores-not hardened in silicon.
Is partial reconfiguration supported on XC7VX415T-1FFG1157C?
Yes, XC7VX415T-1FFG1157C fully supports partial reconfiguration using Vivado Design Suite. Dynamic module swapping is enabled across all CLB, Block RAM, and DSP resources. Bitstream partitioning requires frame-level boundary alignment and use of P-block constraints to isolate reconfigurable regions.
What is the thermal design power (TDP) of XC7VX415T-1FFG1157C under typical operation?
The XC7VX415T-1FFG1157C has a typical thermal design power of 29.5 W under worst-case utilization scenarios defined in Xilinx UG473. Actual power varies with logic utilization, I/O activity, and transceiver count in use. Power estimation must be performed using Xilinx XPE tool with accurate toggle rate inputs.
XC7VX415T-1FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX415T-1FFG1157C FAQ
1.How can I place an order for XC7VX415T-1FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-1FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-1FFG1157C reliable?
The price and inventory of XC7VX415T-1FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-1FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7VX415T-1FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-1FFG1157C transactions.
Note: Certain payment methods may incur a processing fee.
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XC7VX415T-1FFG1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX415T-1FFG1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-1FFG1157C?
For technical support, including XC7VX415T-1FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-1FFG1157C requirements.
6.How does Aetrix verify that XC7VX415T-1FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-1FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-1FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7VX415T-1FFG1157C?
All XC7VX415T-1FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-1FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-1FFG1157C part is unused and in its original packaging.
Return procedure for XC7VX415T-1FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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