AMD XC7VX415T-1FFG1157I
- Part No.:
- XC7VX415T-1FFG1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-1FFG1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX415T-1FFG1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,800 logic cells, 2,040 DSP slices, and 48.8 Mb of block RAM. It integrates PCIe Gen3 x8, 13.1 Gb/s transceivers, and dual 36-bit AXI interfaces for high-bandwidth data processing in radar signal conditioning and high-speed test equipment.
For engineers reviewing the XC7VX415T-1FFG1157I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, DSP slice count, I/O voltage support (1.2 V to 1.8 V), thermal design power (29.2 W typical), and FFG1157 package compatibility with high-density PCB routing.
Technical Context
The XC7VX415T-1FFG1157I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), hardened memory controllers, and integrated 13.1 Gb/s GTY transceivers supporting protocols including PCIe Gen3, SATA, and SRIO. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.
This device includes dual 36-bit AXI interconnects, 24 clock management tiles (CMTs) with MMCM and PLL, and supports JTAG, SelectMAP, and ICAP configuration modes. Its I/O banks are independently configurable for LVDS, SSTL, HSTL, and TMDS signaling standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,800 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,040 - enables parallel multiply-accumulate operations for real-time FIR filtering and FFT acceleration |
| Block RAM | 48.8 Mb - supports large on-chip buffering for video frame storage or protocol packet queuing |
| Transceiver Speed | 13.1 Gb/s - meets minimum line rate for 10G Ethernet KR, PCIe Gen3 x8, and CPRI over optical links |
| I/O Standards | LVDS, SSTL-18, HSTL-I, TMDS - allows direct interface to ADCs, DDR3/DDR4 memory, and HDMI sources |
| TDP | 29.2 W typical - defines thermal solution requirements for conduction-cooled enclosures in avionics systems |
| Configuration Mode | Master SelectMAP, JTAG, ICAP - enables field-upgradable bitstream loading via microcontroller or host processor |
Pinout & Package
The XC7VX415T-1FFG1157I is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, 35 × 35 mm body size, and thermal lid for enhanced heat dissipation in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for GTY transceivers | Must be filtered with ≥10 µF low-ESR ceramic + 100 nF bypass per bank to meet jitter spec |
| MRCC_0 | Multi-Region Clock Capable input | Accepts differential clocks up to 800 MHz for global timing distribution across CLB columns |
| IO_L1P_T0_0 | Configurable I/O bank 0 pin | Supports SSTL-18 or LVDS with programmable drive strength (2–24 mA) and slew rate control |
| CCLK | Configuration clock input | Drives internal configuration logic during Master SelectMAP mode; max 50 MHz frequency |
| INIT_B | Configuration status output | Active-low open-drain signal indicating bitstream load completion or CRC error detection |
| PROGRAM_B | Configuration reset input | Pulse-low initiates full reconfiguration cycle; requires ≥300 ns pulse width |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol layers |
| Partial Reconfiguration Support | Enables dynamic function swapping without system reset-critical for multi-mode radar waveform adaptation |
| AXI4-Stream Interface | Provides zero-overhead streaming data path between IP cores, eliminating handshake latency in signal chain pipelines |
| Hardened Memory Controller | Supports DDR3-1866 and DDR4-2400 with ECC, reducing external controller complexity and board area |
| GTY Transceiver Calibration | Performs automatic analog calibration at power-up and temperature drift compensation during operation |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing adaptive filtering, CFAR detection, and SAR image reconstruction. Use Value: 2,040 DSP slices enable concurrent 128-channel FFTs at 100 MS/s, meeting STANAG 4676 latency targets. | Use Scenario: Bit-error-rate testing of 10G Ethernet PHYs using programmable pattern generation and analysis. IC Role / Device Role / Timing Role: High-fidelity serial data generator and receiver with deterministic jitter injection and eye-diagram capture. Use Value: 13.1 Gb/s GTY transceivers provide native 10GBASE-KR compliance without external retimers or gearbox ICs. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: Raw ultrasound echo data aggregation from 256-channel probe front-ends before GPU-accelerated rendering. IC Role / Device Role / Timing Role: High-throughput data concentrator with time-synchronized DMA engines and lossless compression offload. Use Value: Dual 36-bit AXI interconnects sustain 28.8 GB/s aggregate bandwidth across eight PCIe lanes and DDR4 memory channels. | Use Scenario: ARINC 664 (AFDX) endpoint bridging between flight control, navigation, and display subsystems. IC Role / Device Role / Timing Role: Deterministic traffic shaper and virtual link scheduler with sub-microsecond timestamp resolution. Use Value: Hardened PCIe Gen3 x8 interface enables direct connection to cockpit display processors while maintaining DO-254 DAL-A timing guarantees. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | 20 nm UltraScale architecture; 541,200 logic cells; 15.1 Gb/s transceivers; lower TDP (23.5 W) | Better suited for power-constrained SWaP-C avionics; lacks native PCIe Gen3 hard IP (requires soft IP) | Select when migrating to newer process node with tighter thermal budget and acceptable RTL integration overhead |
| XC7K410T-2FFG901I | Kintex-7 family; 405,000 logic cells; 6.6 Gb/s transceivers; no GTY transceivers; supports PCIe Gen2 only | Cost-optimized alternative for 1–5 Gb/s serial protocols and non-radar imaging applications | Select when 13.1 Gb/s line rates and PCIe Gen3 are not required, and BOM cost reduction is prioritized |
Compared with XC7VX415T-1FFG1157I, XCKU060-2FFVA1156I offers higher logic density and lower power but requires additional RTL effort for PCIe, while XC7K410T-2FFG901I provides proven reliability at lower speed tiers but cannot support 10G+ protocols natively.
Availability
XC7VX415T-1FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC7VX415T-1FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications with emphasis on performance-per-watt and long-term support.
The Virtex-7 family was engineered for mission-critical high-bandwidth signal processing in defense radar, scientific instrumentation, and next-generation communications infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7VX415T-1FFG1157I?
The XC7VX415T-1FFG1157I supports a maximum transceiver line rate of 13.1 Gb/s using its GTY transceivers. This enables native compliance with 10GBASE-KR, PCIe Gen3 x8, and CPRI protocols. The line rate is achievable across all 32 GTY transceiver quads in the device, subject to proper PCB layout, power integrity, and reference clock jitter below 500 fs RMS.
Does XC7VX415T-1FFG1157I include hard IP for PCIe Gen3?
Yes, XC7VX415T-1FFG1157I integrates hardened PCIe Gen3 x8 endpoint and root port logic. This eliminates the need for soft IP implementation and guarantees protocol compliance, reducing design verification time. The hard IP supports ASPM L0s/L1, MSI-X, and ECRC, and operates at 8 GT/s with <100 ns transaction latency under typical conditions.
What I/O standards are supported by XC7VX415T-1FFG1157I?
XC7VX415T-1FFG1157I supports LVDS, SSTL-18, SSTL-15, HSTL-I, HSTL-II, and TMDS across its 500+ user I/O pins. Each I/O bank is independently configurable for voltage (1.2 V to 1.8 V) and standard. Differential standards support internal termination, and single-ended standards allow programmable drive strength from 2 mA to 24 mA with controlled slew rate.
How many block RAM resources does XC7VX415T-1FFG1157I provide?
XC7VX415T-1FFG1157I provides 48.8 Mb of total block RAM, implemented as 1,824 BRAM primitives (each 36 Kb). These are organized into 12 columns and support true dual-port operation, registered outputs, and cascade chaining. This capacity supports large FIFOs, coefficient tables for adaptive filters, and frame buffers in medical ultrasound and radar applications.
Is partial reconfiguration supported on XC7VX415T-1FFG1157I?
Yes, XC7VX415T-1FFG1157I fully supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This allows dynamic swapping of functional modules-such as different radar waveform generators-without resetting the entire device. Implementation requires Vivado Design Suite 2018.3 or later and adherence to floorplanning constraints for reconfigurable partitions.
XC7VX415T-1FFG1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX415T-1FFG1157I FAQ
1.How can I place an order for XC7VX415T-1FFG1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-1FFG1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX415T-1FFG1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-1FFG1157I is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX415T-1FFG1157I?
For technical support, including XC7VX415T-1FFG1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-1FFG1157I requirements.
6.How does Aetrix verify that XC7VX415T-1FFG1157I is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-1FFG1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-1FFG1157I meets industry standards.
7.What is the process for return or replacement of XC7VX415T-1FFG1157I?
All XC7VX415T-1FFG1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-1FFG1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-1FFG1157I part is unused and in its original packaging.
Return procedure for XC7VX415T-1FFG1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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