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AMD XC7VX415T-2FF1157I
- Part No.:
- XC7VX415T-2FF1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-2FF1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,280
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Product details
Overview
XC7VX415T-2FF1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,800 logic cells, 2,040 DSP slices, and 34.8 Mb of block RAM. It features 600 GT transceivers operating up to 13.1 Gb/s, integrated PCIe Gen3 x8 endpoint, and supports DDR3 memory interfaces up to 1866 Mbps. It is deployed in high-bandwidth data center acceleration and radar signal processing systems.
For engineers reviewing the XC7VX415T-2FF1157I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, logic cell density, I/O voltage support (1.2 V/1.35 V/1.5 V/1.8 V), thermal design power (29.5 W typical), and package-specific I/O banking constraints.
Technical Context
The XC7VX415T-2FF1157I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and hardened IP including PCIe Gen3, 10/25/100G Ethernet MACs, and AXI interconnect. It supports partial reconfiguration and bitstream encryption via AES-256.
Its FF1157 package provides 600 user I/Os across 24 banks, with selectable I/O standards per bank (LVCMOS, SSTL, HSTL, differential LVDS), and supports simultaneous multi-voltage operation. Configuration occurs via JTAG, SPIx4, or BPI parallel interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,800 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,040 - enables high-throughput fixed/floating-point arithmetic for FFT, filtering, and matrix operations |
| Block RAM | 34.8 Mb - supports large on-chip data buffering and FIFOs without external memory dependency |
| GT Transceivers | 600 lanes @ up to 13.1 Gb/s - delivers aggregate bandwidth for multi-lane serial protocols (PCIe, CPRI, Aurora) |
| I/O Banks | 24 - allows independent voltage and standard assignment per bank for mixed-signal interface integration |
| Configuration Interface | JTAG, SPIx4, BPI - provides flexibility in programming methodology and boot source selection |
| TDP | 29.5 W typical - defines thermal management requirements and heatsink sizing for sustained operation |
Pinout & Package
The XC7VX415T-2FF1157I is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFBGA) package with 600 user I/Os, 48 configuration pins, and dedicated power/ground balls distributed across the array for low-inductance supply delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M17 | MRCC_0 | Main reference clock input for clock management tile (CMT) in bank 0 - requires matched impedance and low-jitter source |
| P16 | SRCC_0 | Secondary reference clock input for CMT in bank 0 - used for redundancy or dual-clock domain synchronization |
| A12 | IO_L0N_0 | Differential I/O pair (N-side) in bank 0 - supports LVDS, TMDS, or RSDS signaling with internal termination |
| B12 | IO_L0P_0 | Differential I/O pair (P-side) in bank 0 - must be routed as controlled-impedance differential pair |
| E15 | VCCO_0 | Output bank voltage supply for bank 0 - sets I/O logic level (1.2 V/1.35 V/1.5 V/1.8 V) and drives output buffers |
| F14 | GND | Signal ground reference for adjacent I/Os and configuration pins - critical for noise suppression and signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint Hard IP | Reduces RTL integration effort and guarantees compliance with PCIe 3.0 electrical and protocol specifications |
| Partial Reconfiguration Support | Enables dynamic function swapping during runtime without full device reset or system interruption |
| AES-256 Bitstream Encryption | Protects intellectual property against reverse engineering and unauthorized configuration loading |
| Multi-Voltage I/O Banking | Allows direct interfacing to diverse peripherals (DDR3, flash, sensors) without level-shifter components |
| UltraScale-Compatible Architecture | Provides migration path to UltraScale+ devices while retaining toolchain and IP compatibility |
Applications
| High-Speed Data Acquisition | Radar Signal Processing |
|---|---|
Use Scenario: Real-time digitization and preprocessing of multi-channel RF signals in phased-array radar front-ends. IC Role / Device Role / Timing Role: FPGA fabric performs digital down-conversion (DDC), pulse compression, and CFAR detection; GT transceivers stream ADC data at 12.5 Gb/s. Use Value: 600 GT transceivers enable direct connection to high-speed ADC/DACs, eliminating intermediate serialization stages and reducing latency by >30 ns. | Use Scenario: Beamforming and synthetic aperture radar (SAR) image reconstruction in airborne platforms. IC Role / Device Role / Timing Role: Configurable logic executes real-time SAR algorithms; DSP slices handle 2D FFTs; block RAM stores range-Doppler maps. Use Value: 2,040 DSP slices deliver 128 GFLOPS peak throughput, enabling sub-100 ms SAR image generation at 100 MHz system clock. |
| Data Center Acceleration | Test & Measurement Equipment |
Use Scenario: Hardware-accelerated packet inspection and TLS offload in smart NICs. IC Role / Device Role / Timing Role: PCIe Gen3 x8 endpoint handles host communication; logic fabric runs deep packet inspection engines; block RAM caches flow state tables. Use Value: Integrated PCIe hard IP reduces CPU overhead by 45% compared to software-only TLS processing, sustaining 40 Gb/s line-rate throughput. | Use Scenario: Modular high-resolution oscilloscope with 10 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: FPGA manages time-interleaved ADC control, trigger logic, and FFT-based spectral analysis; GT transceivers feed processed data to host PC. Use Value: 34.8 Mb block RAM supports 128 Mpts acquisition depth at full 10 GS/s, enabling single-shot capture of transient events >12.8 ms long. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | UltraScale+ architecture; higher logic density (2,586K LC), lower power per DSP slice, but no native PCIe Gen3 endpoint - requires soft IP | Better suited for AI inference acceleration where PCIe is host-managed; less optimal for endpoint-centric designs like smart NICs | Select XCVU9P-2FLGB2104I when migrating to 16 nm node and requiring higher compute density with relaxed PCIe integration requirements |
| XC7VX690T-2FF1761I | Larger package (1761-ball), 690K logic cells, 2,800 DSP slices, same 28 nm process and PCIe Gen3 x8 endpoint | Used in ultra-high-channel-count medical imaging systems requiring >500K logic cells and >2,500 DSP slices | Select XC7VX690T-2FF1761I only when XC7VX415T-2FF1157I logic or DSP resources are insufficient for target algorithm complexity |
Compared with XC7VX690T-2FF1761I and XCVU9P-2FLGB2104I, the XC7VX415T-2FF1157I offers optimal balance of transceiver count, logic density, and PCIe integration for mid-scale acceleration tasks - avoiding overdesign while maintaining upgrade headroom within the Virtex-7 family.
Availability
XC7VX415T-2FF1157I is available at Aetrix Electronics and suitable for high-speed data acquisition, radar signal processing, and data center acceleration requiring stable component supply across extended production lifecycles.
Supply support for XC7VX415T-2FF1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex-7 family was designed for demanding infrastructure applications requiring high logic density, multi-gigabit transceivers, and hardened protocol engines - targeting radar, test equipment, and network acceleration.
FAQ
What is the maximum supported data rate for GT transceivers on the XC7VX415T-2FF1157I?
The XC7VX415T-2FF1157I supports GT transceivers operating at up to 13.1 Gb/s. This rate is validated per the Virtex-7 DC and AC switching characteristics specification, and applies to all 600 GT lanes under recommended voltage and temperature conditions (–40°C to +100°C junction). The XC7VX415T-2FF1157I achieves this performance using adaptive equalization and built-in clock data recovery circuits.
Does the XC7VX415T-2FF1157I include a hard PCIe Gen3 endpoint?
Yes, the XC7VX415T-2FF1157I integrates a hardened PCIe Gen3 x8 endpoint block compliant with the PCI Express Base Specification Revision 3.0. This hard IP eliminates the need for soft-core implementations, reduces resource utilization, and ensures deterministic timing closure. The XC7VX415T-2FF1157I supports both root port and endpoint configurations via configuration space settings.
What I/O standards are supported by the XC7VX415T-2FF1157I?
The XC7VX415T-2FF1157I supports LVCMOS (1.2 V/1.35 V/1.5 V/1.8 V), SSTL (I and II), HSTL (I and III), and differential standards including LVDS, BLVDS, RSDS, and TMDS. Each of its 24 I/O banks can be independently configured for voltage and standard. The XC7VX415T-2FF1157I does not support MIPI D-PHY or LPDDR4 natively.
What is the total block RAM capacity of the XC7VX415T-2FF1157I?
The XC7VX415T-2FF1157I provides 34.8 Mb of total block RAM, implemented as 1,824 × 36 Kb BRAM primitives. This capacity is distributed across the FPGA fabric and accessible via dual-port synchronous read/write with programmable write width. The XC7VX415T-2FF1157I uses this memory for on-chip buffering, FIFOs, and lookup tables without external DRAM dependency.
Is partial reconfiguration supported on the XC7VX415T-2FF1157I?
Yes, the XC7VX415T-2FF1157I supports partial reconfiguration through Vivado Design Suite tools and hardware mechanisms including frame-based bitstream loading and isolation of reconfigurable partitions. This capability enables dynamic functional updates during operation. The XC7VX415T-2FF1157I requires specific floorplanning and checkpointing procedures to ensure safe context switching between configurations.
XC7VX415T-2FF1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX415T-2FF1157I FAQ
1.How can I place an order for XC7VX415T-2FF1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-2FF1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-2FF1157I reliable?
The price and inventory of XC7VX415T-2FF1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FF1157I is usually 5 days.
3.What payment methods are accepted for XC7VX415T-2FF1157I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-2FF1157I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX415T-2FF1157I?
XC7VX415T-2FF1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX415T-2FF1157I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-2FF1157I?
For technical support, including XC7VX415T-2FF1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FF1157I requirements.
6.How does Aetrix verify that XC7VX415T-2FF1157I is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-2FF1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FF1157I meets industry standards.
7.What is the process for return or replacement of XC7VX415T-2FF1157I?
All XC7VX415T-2FF1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FF1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-2FF1157I part is unused and in its original packaging.
Return procedure for XC7VX415T-2FF1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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