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AMD XC7VX415T-2FF1158I
- Part No.:
- XC7VX415T-2FF1158I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-2FF1158I.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,641
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Product details
Overview
XC7VX415T-2FF1158I from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,120 logic cells, 2,040 DSP slices, and 34.8 Mb of block RAM. It features 600 GT transceivers operating up to 13.1 Gb/s, supports PCIe Gen3 x8, and is used in high-speed data acquisition and radar signal processing systems.
For engineers reviewing the XC7VX415T-2FF1158I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, I/O bank voltage flexibility (1.2 V to 3.3 V), thermal performance under sustained 2.5 W/mm² power density, and support for JTAG and SelectMAP configuration interfaces.
Technical Context
The XC7VX415T-2FF1158I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10 Gigabit Ethernet MAC, memory controllers), and high-speed serial transceivers. It uses a 28 nm HKMG process and supports multi-voltage I/O banks with independent VCCO and VREF per bank.
Configuration is supported via Master SPI, Slave Parallel (SelectMAP), or JTAG; bitstream encryption and HMAC authentication are integrated for secure boot. The device includes on-chip temperature and voltage sensors with monitoring accessible through the XADC interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,120 - determines maximum combinational/sequential logic capacity for custom datapaths and control units |
| DSP Slices | 2,040 - enables parallel execution of 25×18-bit multiply-accumulate operations per slice, critical for FIR filtering and FFT engines |
| Block RAM | 34.8 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external SRAM |
| GT Transceivers | 600 lanes @ up to 13.1 Gb/s - supports multi-lane protocols including CPRI, JESD204B, and 10G-KR |
| I/O Pins | 500 user I/O - configurable across 32 I/O banks with selectable standards (LVDS, SSTL, HSTL, TMDS) |
| Configuration Interface | Master SPI / Slave SelectMAP / JTAG - enables flexible programming and debugging during development and field updates |
| Operating Temp | -40°C to +100°C (case) - qualified for industrial and extended-temperature embedded deployments |
Pinout & Package
The XC7VX415T-2FF1158I is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1158) package with 35 × 35 mm body size, 0.8 mm pitch, and integrated thermal lid for enhanced heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI, BPI, SelectMAP, JTAG) at power-up; must be pulled to defined logic levels |
| CCLK | Configuration Clock | Drives internal configuration logic during slave parallel or master SPI programming |
| DIN / DOUT | Serial Data I/O | Carries configuration bitstream in Master SPI mode; bidirectional in SelectMAP |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and initiates reconfiguration sequence |
| GTX/GTH RefClk | Transceiver Reference Clock | Dedicated differential inputs for transceiver PLL reference; supports 10 MHz–1.2 GHz range |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces integration effort and latency versus soft IP; supports ASR and ECRC for system-level reliability |
| Integrated 10GbE MAC | Enables line-rate packet processing without external PHY or glue logic in network interface cards |
| XADC Dual 12-bit ADC | Monitors on-chip temperature and supply voltages in real time; usable for closed-loop thermal management |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning; requires external eFUSE or BBRAM for key storage |
| Partial Reconfiguration Support | Allows dynamic module swapping in operational systems-e.g., updating radar waveform generators without full reboot |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion and CFAR detection; GT transceivers interface with ADC/DAC FMC modules. Use Value: 600 GT lanes enable simultaneous multi-channel JESD204B capture at 5 GSPS per lane, reducing front-end analog complexity. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers requiring >1 GS/s sampling and deep memory buffering. IC Role / Device Role / Timing Role: Configurable logic implements trigger arbitration, pattern matching, and DDR3/4 memory controller for 16 GB capture depth. Use Value: 34.8 Mb block RAM allows on-die storage of 256 M samples at 14-bit resolution before offloading via PCIe Gen3 x8. |
| Avionics Data Concentrators | 5G Wireless Baseband Units |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Hardened 10GbE MAC and deterministic logic implement time-triggered AFDX end-systems with sub-1 µs jitter. Use Value: On-chip clocking resources and I/O delay calibration ensure deterministic latency across 32 AFDX virtual links. | Use Scenario: Massive MIMO baseband processing in 5G NR macro cells with 64T64R antenna arrays. IC Role / Device Role / Timing Role: DSP slices execute real-time channel estimation, precoding, and OFDM modulation; GT transceivers connect to remote radio heads via CPRI/eCPRI. Use Value: 2,040 DSP slices deliver >2.4 TMAC/s peak throughput for LTE-A and 5G NR Layer 1 acceleration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; higher logic density (2,586K LC), lower static power, but reduced GT transceiver count (48 vs. 600) | Better suited for AI inference acceleration and high-throughput compute; less optimal for multi-lane serial I/O-heavy designs | Choose when migrating to 16 nm node for power efficiency and ML workload support |
| XC7VX690T-2FF1761I | Larger footprint (1761-ball FFG1761), 690K logic cells, same 28 nm process and GT transceiver spec (600 @ 13.1 Gb/s) | Provides additional logic and I/O for larger system-on-module integrations; requires PCB redesign due to package size change | Choose when scaling logic capacity while retaining identical transceiver performance and timing behavior |
Compared with XC7VX415T-2FF1158I, the XCVU9P offers superior compute density and energy efficiency but sacrifices serial I/O bandwidth, whereas the XC7VX690T delivers direct scalability in logic and I/O without altering transceiver architecture or signal integrity requirements.
Availability
XC7VX415T-2FF1158I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply across long product lifecycles.
Supply support for XC7VX415T-2FF1158I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Virtex-7 family targets high-bandwidth, high-compute applications such as defense radar, scientific instrumentation, and wired/wireless infrastructure where transceiver count, logic density, and deterministic timing are critical.
FAQ
What is the maximum transceiver data rate supported by the XC7VX415T-2FF1158I?
The XC7VX415T-2FF1158I supports GT transceivers operating at up to 13.1 Gb/s per lane. This rate is validated across all 600 transceiver quads under industrial temperature conditions and with proper board-level equalization. The XC7VX415T-2FF1158I achieves this using adaptive RX equalization and TX pre-emphasis, enabling reliable JESD204B and CPRI link establishment without external retimers.
Does the XC7VX415T-2FF1158I support partial reconfiguration?
Yes, the XC7VX415T-2FF1158I fully supports partial reconfiguration through its ICAP interface and frame-based bitstream architecture. This capability allows runtime swapping of logical modules-such as filter banks or protocol engines-without resetting the entire device. The XC7VX415T-2FF1158I documentation specifies timing closure requirements and area constraints for PR regions.
What configuration modes are available for the XC7VX415T-2FF1158I?
The XC7VX415T-2FF1158I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7VX415T-2FF1158I also supports fallback configuration and dual-boot via external flash addressing, enabling field-upgradable firmware with redundancy.
Is bitstream encryption available on the XC7VX415T-2FF1158I?
Yes, the XC7VX415T-2FF1158I includes AES-256 bitstream encryption with HMAC authentication. Keys are stored in on-chip battery-backed RAM (BBRAM) or eFUSE, and decryption occurs transparently during configuration. The XC7VX415T-2FF1158I requires external secure key provisioning hardware or JTAG-based key loading during initial programming.
What is the I/O voltage range supported by the XC7VX415T-2FF1158I?
The XC7VX415T-2FF1158I supports I/O standards from 1.2 V to 3.3 V across 32 independently powered I/O banks. Each bank has dedicated VCCO and optional VREF pins, enabling mixed-voltage operation-for example, interfacing with DDR3 (1.5 V), LVDS (1.2 V), and legacy CMOS (3.3 V) peripherals simultaneously. This flexibility is documented in the XC7VX415T-2FF1158I SelectIO Resources User Guide.
XC7VX415T-2FF1158I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX415T-2FF1158I FAQ
1.How can I place an order for XC7VX415T-2FF1158I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-2FF1158I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-2FF1158I reliable?
The price and inventory of XC7VX415T-2FF1158I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FF1158I is usually 5 days.
3.What payment methods are accepted for XC7VX415T-2FF1158I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-2FF1158I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX415T-2FF1158I?
XC7VX415T-2FF1158I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX415T-2FF1158I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-2FF1158I?
For technical support, including XC7VX415T-2FF1158I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FF1158I requirements.
6.How does Aetrix verify that XC7VX415T-2FF1158I is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-2FF1158I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FF1158I meets industry standards.
7.What is the process for return or replacement of XC7VX415T-2FF1158I?
All XC7VX415T-2FF1158I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FF1158I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-2FF1158I part is unused and in its original packaging.
Return procedure for XC7VX415T-2FF1158I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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