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AMD XC7VX415T-2FFG1157C
- Part No.:
- XC7VX415T-2FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-2FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,534
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Product details
Overview
XC7VX415T-2FFG1157C from AMD is a high-performance 28 nm FPGA with 415,136 logic cells, 2,040 DSP slices, and 32.1 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX415T-2FFG1157C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -2 speed grade timing performance under industrial temperature range.
Technical Context
This Virtex-7 device integrates SelectIO technology supporting single-ended and differential standards including LVCMOS, SSTL, HSTL, and LVDS, with programmable I/O delays and internal termination. It features 600 GTs (Gigabit Transceivers) organized as 300 dual-lane transceiver blocks, each capable of independent protocol configuration.
The XC7VX415T-2FFG1157C implements a hardened PCIe Gen3 x8 endpoint core, supports DDR3 memory interfaces up to 1866 Mbps, and includes integrated clock management with MMCM and PLL blocks for low-jitter clock synthesis and phase alignment across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,136 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 2,040 - dedicated arithmetic units supporting 25×18-bit multiply-accumulate per slice at full speed |
| Block RAM | 32.1 Mb - distributed on-chip memory for FIFOs, buffers, and lookup tables without external memory dependency |
| GT Transceivers | 600 - 300 dual-lane blocks supporting protocols including PCIe Gen3, SATA, and CPRI up to 13.1 Gb/s |
| I/O Pins | 500 - user-configurable pins with programmable drive strength, slew rate, and on-die termination |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature (0°C to 85°C) |
| Package | FFG1157 - 1157-ball FCBGA with 0.8 mm pitch, thermal lid, and standard JEDEC MO-271AC footprint |
Pinout & Package
XC7VX415T-2FFG1157C is housed in a 1157-ball Flip-Chip BGA (FFG) package with thermal lid, 0.8 mm ball pitch, and JEDEC MO-271AC mechanical outline. Pin functions are grouped into I/O banks, configuration banks, power/ground balls, and high-speed transceiver quads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0 V supply for FPGA fabric and CLBs; requires tight regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 1.8 V supply for configuration logic, clock management, and transceiver analog circuitry |
| VCCO | I/O Bank Power | Programmable 1.2–3.3 V supply per I/O bank enabling mixed-voltage interface support |
| MGTAVCC | Transceiver Analog Supply | 1.0 V analog supply for GT transceiver PLLs and serializers/deserializers |
| INIT_B | Configuration Status | Open-drain output indicating configuration status; pulled high during successful configuration |
| CCLK | Configuration Clock | Input clock for master SPI configuration mode; also used for JTAG boundary scan clock |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces integration effort and verification time for host-facing acceleration cards without soft IP overhead |
| DDR3 Memory Controller | Supports up to 1866 Mbps data rate with built-in calibration and error correction logic |
| Multi-Gigabit Transceivers | 600 GTs enable 300 independent high-speed serial links for radar, wireless, and test equipment backplanes |
| MMCM + PLL Clock Management | Enables sub-100 fs jitter synthesis and dynamic phase shifting across 12 clock domains |
| SelectIO Technology | Allows per-pin I/O standard assignment within same bank, simplifying board-level signal integrity planning |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR algorithms; GT transceivers interface with ADC/DAC FMC modules at 6.5 Gbps. Use Value: 415K logic cells and 2,040 DSP slices deliver deterministic latency and throughput exceeding ASIC alternatives for field-upgradable radar firmware. | Use Scenario: Offloading matrix multiplication and convolution kernels in edge AI inference servers. IC Role / Device Role / Timing Role: Configurable accelerator tightly coupled to host CPU via PCIe Gen3 x8; DDR3 controller manages 8 GB of local memory. Use Value: Hardened PCIe endpoint and 32.1 Mb block RAM reduce software stack complexity and eliminate external memory bottlenecks. |
| Wireless Baseband Processing | Test & Measurement Equipment |
Use Scenario: 5G NR massive MIMO baseband unit implementing channel coding, modulation, and precoding. IC Role / Device Role / Timing Role: Dual transceiver quads handle CPRI/eCPRI fronthaul; logic fabric runs LDPC decoder pipelines with pipeline depth > 20 stages. Use Value: -2 speed grade ensures timing closure at 300+ MHz system clocks required for real-time 5G symbol processing. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: FPGA synchronizes multi-channel ADCs, performs digital down-conversion, and streams processed data over PCIe to host PC. Use Value: 13.1 Gb/s GT transceivers enable direct connection to high-speed ADCs without serializer/deserializer chips. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, higher transceiver count (64 GTs), but no hardened PCIe Gen3 endpoint | Better suited for ultra-high-throughput packet processing where soft PCIe IP is acceptable | Choose XCVU9P if migrating to 20 nm node and requiring >2x logic density, accepting added PCIe IP validation effort |
| XC7VX690T-2FFG1927I | Larger die size, 693,120 logic cells, same -2 speed grade, but 1927-ball package increases PCB layer count and cost | Preferred for designs needing maximum on-chip memory bandwidth and I/O count beyond 500 pins | Choose XC7VX690T only when XC7VX415T-2FFG1157C logic or I/O resources are insufficient and board space allows larger package |
Compared with XCVU9P-2FLGA2104I and XC7VX690T-2FFG1927I, the XC7VX415T-2FFG1157C delivers optimal balance of hardened PCIe integration, transceiver performance, and compact 1157-ball packaging for radar and edge compute platforms requiring industrial-temperature reliability.
Availability
XC7VX415T-2FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, high-performance computing acceleration, and wireless baseband processing requiring stable component supply across extended product lifecycles.
Supply support for XC7VX415T-2FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and client markets through its FPGA, adaptive SoC, and GPU technologies.
The Virtex-7 family targets high-bandwidth, high-compute applications such as aerospace radar, scientific instrumentation, and wired/wireless infrastructure where deterministic latency and multi-protocol serial connectivity are critical.
FAQ
What is the operating temperature range for XC7VX415T-2FFG1157C?
The XC7VX415T-2FFG1157C is rated for industrial temperature operation from 0°C to +85°C ambient. This rating applies to all I/O, transceiver, and fabric functionality under specified voltage and loading conditions, and is validated per AMD's Virtex-7 qualification standards. The -2 speed grade guarantees timing closure across this full range without derating.
Does XC7VX415T-2FFG1157C include a hardened PCIe Gen3 controller?
Yes, the XC7VX415T-2FFG1157C integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. It supports link training, power management states (L0s/L1), and transaction layer packet handling without consuming logic resources or requiring soft IP licensing.
What memory interface standards does XC7VX415T-2FFG1157C support?
The XC7VX415T-2FFG1157C supports DDR3 SDRAM interfaces up to 1866 Mbps using its dedicated memory controller logic. It does not natively support DDR4 or LPDDR4; those require external PHY or UltraScale+ generation devices. The controller includes write leveling, read leveling, and ZQ calibration support.
How many GT transceivers are available in XC7VX415T-2FFG1157C?
The XC7VX415T-2FFG1157C provides 600 GT (Gigabit Transceiver) channels, implemented as 300 dual-lane transceiver blocks. Each block operates independently and supports protocols including PCIe Gen3, SATA, CPRI, and custom serial interfaces at line rates from 600 Mb/s to 13.1 Gb/s.
Is XC7VX415T-2FFG1157C pin-compatible with other Virtex-7 FPGAs in the FFG1157 package?
No, XC7VX415T-2FFG1157C is not pin-compatible with other Virtex-7 devices in the FFG1157 package, such as XC7VX330T or XC7VX550T. While sharing the same mechanical footprint and ball count, power, configuration, and I/O bank assignments differ significantly between models due to varying internal resource distribution and transceiver placement.
XC7VX415T-2FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX415T-2FFG1157C FAQ
1.How can I place an order for XC7VX415T-2FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-2FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-2FFG1157C reliable?
The price and inventory of XC7VX415T-2FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7VX415T-2FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-2FFG1157C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX415T-2FFG1157C?
XC7VX415T-2FFG1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX415T-2FFG1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-2FFG1157C?
For technical support, including XC7VX415T-2FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FFG1157C requirements.
6.How does Aetrix verify that XC7VX415T-2FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-2FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7VX415T-2FFG1157C?
All XC7VX415T-2FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-2FFG1157C part is unused and in its original packaging.
Return procedure for XC7VX415T-2FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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