AMD XC7VX415T-2FFG1157I

Overview

XC7VX415T-2FFG1157I from AMD is a high-performance 28 nm FPGA with 415,152 logic cells, 2,040 DSP slices, and 32.1 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.

For engineers reviewing the XC7VX415T-2FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), speed grade (-2), and industrial temperature range (-40°C to +100°C).

Technical Context

The XC7VX415T-2FFG1157I implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint, 16 GTX transceivers supporting 6.6–13.1 Gb/s, and hardened memory controllers for DDR3/DDR3L up to 1866 Mbps. It supports partial reconfiguration and AXI4 interconnect for heterogeneous system integration.

Configuration is performed via quad-SPI flash or JTAG, with dual-boot capability and AES-256 bitstream encryption. The device includes dedicated clock management tiles (CMT) with MMCM and PLL blocks for low-jitter clock synthesis and phase alignment across multiple domains.

Key Specifications

Pinout & Package

XC7VX415T-2FFG1157I is housed in a 1157-pin Flip-Chip Fine-Pitch BGA (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU9P-2FLGA2104I, XC7VX415T-2FFG1157I offers proven 28 nm reliability and lower power at moderate compute scale; versus XC7VX330T-2FFG1157I, it delivers 25% more logic and 18% more DSP for demanding real-time signal paths without changing PCB layout.

Availability

XC7VX415T-2FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and software-defined radio applications requiring stable component supply across extended product lifecycles.

Supply support for XC7VX415T-2FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex-7 family, including XC7VX415T-2FFG1157I, was engineered for high-throughput, low-latency signal and packet processing in defense, aerospace, and instrumentation systems.

FAQ

What is the maximum supported data rate for GTX transceivers on XC7VX415T-2FFG1157I?

The XC7VX415T-2FFG1157I supports GTX transceiver line rates from 6.6 Gb/s up to 13.1 Gb/s. This range enables compliance with JESD204B subclass 1 and PCIe Gen3 protocols. The actual achievable rate depends on board layout quality, reference clock stability, and signal integrity margins. XC7VX415T-2FFG1157I transceivers are not rated for 16+ Gb/s operation-higher speeds require UltraScale+ GTY or Versal GTM transceivers.

Does XC7VX415T-2FFG1157I support partial reconfiguration, and what tools are required?

Yes, XC7VX415T-2FFG1157I fully supports partial reconfiguration through Vivado Design Suite v2018.2 or later. Implementation requires modular HDL design, PR-enabled IP cores, and specific constraints for reconfigurable partitions. XC7VX415T-2FFG1157I's configuration logic and frame-based bitstream architecture allow dynamic logic swapping without resetting the entire device or halting I/O operation.

What is the industrial temperature rating for XC7VX415T-2FFG1157I, and how is it validated?

XC7VX415T-2FFG1157I is rated for operation from -40°C to +100°C ambient temperature and is qualified per JEDEC JESD22-A104 (temperature cycling) and JESD22-A108 (high-temperature operating life). This industrial-grade rating applies to the full functional specification-including transceiver performance, memory controller timing, and configuration reliability-under sustained thermal stress, making XC7VX415T-2FFG1157I suitable for uncooled outdoor enclosures.

Can XC7VX415T-2FFG1157I interface directly with DDR3L memory, and what clocking support is provided?

Yes, XC7VX415T-2FFG1157I integrates a hardened DDR3/DDR3L memory controller supporting data rates up to 1866 Mbps across 64-bit buses. It includes dedicated clocking resources-MMCMs and IODELAYs-for precise DQS-to-clock alignment and write-leveling calibration. XC7VX415T-2FFG1157I's controller meets JEDEC DDR3L-1866 timing specifications without requiring external PHY or glue logic.

Is XC7VX415T-2FFG1157I pin-compatible with other Virtex-7 FFG1157 devices?

XC7VX415T-2FFG1157I shares the same 1157-pin FFG package footprint and I/O bank arrangement with other Virtex-7 devices in the FFG1157 variant, including XC7VX330T-2FFG1157I and XC7VX690T-2FFG1157I. However, pin functions differ across models due to varying transceiver counts, memory controller placements, and hard IP locations. XC7VX415T-2FFG1157I is not a drop-in replacement without verifying signal routing and power delivery against the target device's pinout documentation.