AMD XC7VX415T-2FFG1158C

Overview

XC7VX415T-2FFG1158C from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,800 logic cells, 2,040 DSP slices, and 48.5 Mb of block RAM, configured in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.

For engineers reviewing the XC7VX415T-2FFG1158C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -2 speed grade timing performance under commercial temperature conditions.

Technical Context

The XC7VX415T-2FFG1158C implements a heterogeneous FPGA architecture integrating programmable logic fabric, hardened multi-gigabit transceivers (MGTs), and configurable memory blocks. It supports PCIe Gen3 x8, SRIO Gen2 x4, and 10G Ethernet MAC interfaces via dedicated GTY transceivers.

Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot and encrypted bitstream loading. The device includes clock management tiles (CMT) with MMCM and PLL blocks for low-jitter clock synthesis and phase alignment across multiple domains.

Key Specifications

Pinout & Package

XC7VX415T-2FFG1158C is housed in a 1158-pin Flip-Chip Fine-Pitch BGA (FFG) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA compute-acceleration applications.

Compared with XC7VX415T-2FFG1158C, XCVU9P-2FLGA2104I delivers 6× more logic and native PCIe Gen4, while XC7VX690T-2FFG1927C offers 67% more logic cells and 120 additional I/Os in the same 28 nm node-both require PCB redesign due to different package footprints.

Availability

XC7VX415T-2FFG1158C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and defense avionics systems requiring stable component supply across extended production lifecycles.

Supply support for XC7VX415T-2FFG1158C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.

The Virtex-7 family was engineered for high-throughput, low-latency signal processing in mission-critical infrastructure where deterministic timing and radiation tolerance are essential.

FAQ

What is the maximum transceiver line rate supported by XC7VX415T-2FFG1158C?

The XC7VX415T-2FFG1158C supports a maximum transceiver line rate of 13.1 Gb/s per GTY channel. This enables compliance with JESD204B/C, 10GBASE-R, and CPRI protocols. All 24 GTY transceivers on the XC7VX415T-2FFG1158C operate at this rated speed under -2 speed grade conditions at commercial temperature range (0°C to 85°C).

Does XC7VX415T-2FFG1158C include a hardened PCIe Gen3 controller?

Yes, XC7VX415T-2FFG1158C integrates a hardened PCIe Gen3 x8 endpoint block. This includes physical layer (PHY), data link layer, and transaction layer logic, eliminating the need for external PCIe PHY chips. The block supports both root complex and endpoint configurations and is fully compliant with PCI Express Base Specification Revision 3.0.

What configuration modes are supported by XC7VX415T-2FFG1158C?

XC7VX415T-2FFG1158C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration modes. Configuration can be initiated from external flash memory or through boundary-scan debugging tools. Dual-boot capability allows fallback to a secondary bitstream if primary configuration fails.

Is XC7VX415T-2FFG1158C suitable for aerospace applications requiring radiation tolerance?

XC7VX415T-2FFG1158C includes SEU mitigation logic and ECC-protected configuration memory, making it suitable for terrestrial and low-earth-orbit applications where single-event upsets must be detected and corrected. While not radiation-hardened, its mitigation features align with DO-254 DAL-A and MIL-STD-883 Class B qualification paths when used with appropriate system-level hardening.

What is the I/O voltage range supported by XC7VX415T-2FFG1158C HP banks?

The High-Performance (HP) I/O banks of XC7VX415T-2FFG1158C support VCCO voltages from 1.2 V to 1.8 V, enabling direct interfacing with DDR3, DDR4, and LPDDR4 memory devices. Each HP bank has independent VCCO and VREF supplies, allowing mixed-standard operation across adjacent banks without level-shifting components.