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AMD XC7VX415T-2FFG1158I

Part No.:
XC7VX415T-2FFG1158I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC7VX415T-2FFG1158I.pdf
Description:
IC FPGA 350 I/O 1158FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,530

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Product details

Overview

XC7VX415T-2FFG1158I from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,192 logic cells, 2,040 DSP slices, and 32.1 Mb of block RAM. It features 600 I/O pins in a flip-chip BGA package and supports transceiver line rates up to 13.1 Gb/s - deployed in high-speed data acquisition systems for radar signal processing.

For engineers reviewing the XC7VX415T-2FFG1158I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade (-2), thermal performance (Industrial temperature range -40°C to +100°C), I/O bank voltage flexibility (1.2 V to 3.3 V), and configuration security via AES-256 bitstream encryption.

Technical Context

The XC7VX415T-2FFG1158I implements a 28 nm HKMG process-based architecture with SelectIO technology supporting SSTL, LVCMOS, HSTL, and differential standards including LVDS and TMDS. Its transceivers integrate CDR circuits and support protocols such as PCIe Gen3, SRIO Gen2, and 10G Ethernet.

This device includes dual-register 6-input LUTs, built-in clock management tiles (CMT) with MMCM and PLL, and integrated configuration memory with fallback support. Configuration occurs via Master SPI, Slave Parallel, or JTAG interfaces with multi-boot capability.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells415,192 - determines maximum combinational/sequential logic capacity for complex digital signal processing pipelines
DSP Slices2,040 - enables parallel multiply-accumulate operations at up to 350 MHz for real-time filtering and FFT acceleration
Block RAM32.1 Mb - supports large on-chip buffering for video frame storage or packet reassembly without external memory
Transceiver Speed13.1 Gb/s - meets line-rate requirements for 10GBASE-R and CPRI Option 3 physical layer interfaces
I/O Pins600 - provides scalable interface count for multi-sensor synchronization and high-pin-count ADC/DAC interfacing
Operating Temp-40°C to +100°C - qualified for industrial and aerospace environments requiring extended thermal stability
Configuration SecurityAES-256 bitstream encryption - prevents unauthorized cloning or reverse engineering of configured logic

Pinout & Package

XC7VX415T-2FFG1158I is housed in a 1158-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Configuration Mode SelectDetermines boot source (SPI, BPI, or JTAG) during power-up reset sequence
CCLKConfiguration ClockDrives internal configuration shift register; frequency ≤ 50 MHz for Master SPI mode
DONEConfiguration StatusOpen-drain output indicating successful bitstream loading and initialization completion
INIT_BConfiguration InitializationActive-low signal asserting reset during configuration error or incomplete load
GTX/GTH RefClkTransceiver Reference ClockAccepts differential input (100 MHz–750 MHz) for transceiver CDR lock and jitter tolerance compliance
VCCINT/VCCAUX/VCCOPower Supply RailsSeparate 1.0V core, 1.8V auxiliary, and programmable I/O (1.2–3.3V) supplies enable mixed-voltage system integration

Key Features

FeatureDesign Value
High-Speed Transceivers32 GTs with 13.1 Gb/s line rate and built-in PRBS generator/checker for link validation
Advanced Clock ManagementEight CMTs each containing MMCM + PLL for sub-100 fs jitter synthesis and dynamic phase shifting
System MonitorOn-die temperature and supply voltage sensors with I²C interface for real-time health monitoring
Partial Reconfiguration SupportEnables runtime logic module swapping without full device reboot - critical for adaptive radar waveform updates
PCIe Gen3 x8 EndpointHard IP block compliant with PCIe Base Spec 3.0 - reduces soft logic overhead and timing closure effort

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: Primary compute engine implementing adaptive filter banks and high-throughput FFT engines.

Use Value: 2,040 DSP slices and 13.1 Gb/s transceivers enable simultaneous multi-channel RF sampling and low-latency digital downconversion.

Use Scenario: High-resolution ultrasound image reconstruction with real-time scan conversion.

IC Role / Device Role / Timing Role: Data path controller aggregating echo data from 128+ channel ADCs and driving GPU-accelerated rendering pipeline.

Use Value: 600 I/O pins and 32.1 Mb block RAM support full-frame buffering and pixel-domain interpolation without DDR latency penalties.

5G Wireless BasebandTest & Measurement Equipment

Use Scenario: Massive MIMO precoding and OFDM modulation/demodulation in 5G NR macro base stations.

IC Role / Device Role / Timing Role: Baseband processor handling Layer 1 PHY functions with deterministic latency under variable traffic load.

Use Value: AES-256 encryption and partial reconfiguration allow secure, field-upgradable waveform implementations compliant with 3GPP Release 16.

Use Scenario: High-accuracy protocol analyzers capturing and decoding multi-lane PCIe Gen3 or SATA 6 Gb/s traffic.

IC Role / Device Role / Timing Role: Protocol-aware logic analyzer core with deep trace buffer and real-time trigger state machine.

Use Value: Built-in PRBS checker and transceiver eye diagram monitoring enable pass/fail margin testing per IEEE 802.3bj Annex 92E.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, higher logic density (2,586K LC), 25.8 Gb/s transceivers, larger package (2104-ball)Targets next-generation 5G mmWave and AI inference acceleration where bandwidth exceeds Virtex-7 capabilitySelect when >13.1 Gb/s serial I/O or >500K logic cells are required; requires PCB redesign due to different footprint and power delivery
XC7VX690T-2FFG1927ISame Virtex-7 family, larger logic capacity (693,120 LC), more DSP slices (3,600), but slower max transceiver speed (11.2 Gb/s)Better suited for compute-bound applications like cryptographic acceleration where I/O bandwidth is secondary to arithmetic throughputChoose for cost-sensitive deployments needing higher logic density without 13.1 Gb/s line rates; shares same -2 speed grade and Industrial temp rating

Compared with XC7VX415T-2FFG1158I, the XCVU9P offers higher bandwidth and scalability at increased power and layout complexity, while the XC7VX690T trades transceiver speed for greater logic and DSP resources within the same process node and thermal envelope.

Availability

XC7VX415T-2FFG1158I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and medical imaging backend systems requiring stable component supply across long production lifecycles.

Supply support for XC7VX415T-2FFG1158I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, CPU, and GPU design.

The Virtex-7 family targets high-performance infrastructure applications demanding deterministic latency, high-bandwidth I/O, and reconfigurable compute - especially in defense, communications, and scientific instrumentation.

FAQ

What is the maximum transceiver line rate supported by XC7VX415T-2FFG1158I?

The XC7VX415T-2FFG1158I supports a maximum transceiver line rate of 13.1 Gb/s across its 32 GT transceiver channels. This specification is validated under the -2 speed grade and applies to protocols including 10GBASE-R, CPRI Option 3, and SRIO Gen2. The device uses adaptive equalization and CDR circuitry to maintain signal integrity at this rate over FR4 PCB traces up to 20 inches.

Does XC7VX415T-2FFG1158I support partial reconfiguration?

Yes, XC7VX415T-2FFG1158I fully supports partial reconfiguration through its ICAP interface and hierarchical design flow. This allows dynamic replacement of logic modules - such as waveform generators or filter coefficients - without resetting the entire device. The feature is used in adaptive radar and software-defined radio applications where functional updates must occur in real time.

What configuration modes are available for XC7VX415T-2FFG1158I?

XC7VX415T-2FFG1158I supports Master SPI, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by the M0–M2 pins at power-up. Master SPI is commonly used for compact flash-based boot; Slave Parallel enables fast loading from external memory; JTAG is reserved for debugging and programming during development and field service.

Is XC7VX415T-2FFG1158I qualified for industrial temperature operation?

Yes, XC7VX415T-2FFG1158I is rated for industrial temperature operation from -40°C to +100°C. This qualification includes thermal cycling, high-temperature operating life (HTOL), and package reliability testing per JEDEC JESD22 standards. The FFG1158 package incorporates a thermal lid to sustain junction temperatures within safe limits under continuous 25 W dynamic power conditions.

What clocking resources does XC7VX415T-2FFG1158I provide?

XC7VX415T-2FFG1158I integrates eight Clock Management Tiles (CMTs), each containing one MMCM and one PLL. These support input frequencies from 10 MHz to 800 MHz, generate up to six output clocks per CMT, and deliver sub-100 fs integrated jitter for high-speed SerDes and ADC sampling clocking. The CMTs also enable dynamic phase shifting and frequency synthesis for multi-rate system synchronization.

XC7VX415T-2FFG1158I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 XT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
32200
Number of Logic Elements/Cells:
412160
Total RAM Bits:
32440320
Number of I/O:
350
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1158-FCBGA (35x35)

XC7VX415T-2FFG1158I FAQ

1.How can I place an order for XC7VX415T-2FFG1158I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VX415T-2FFG1158I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VX415T-2FFG1158I reliable?

The price and inventory of XC7VX415T-2FFG1158I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FFG1158I is usually 5 days.

3.What payment methods are accepted for XC7VX415T-2FFG1158I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-2FFG1158I transactions.

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XC7VX415T-2FFG1158I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VX415T-2FFG1158I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VX415T-2FFG1158I?

For technical support, including XC7VX415T-2FFG1158I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FFG1158I requirements.

6.How does Aetrix verify that XC7VX415T-2FFG1158I is sourced from the original manufacturer or authorized distributors?

All XC7VX415T-2FFG1158I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FFG1158I meets industry standards.

7.What is the process for return or replacement of XC7VX415T-2FFG1158I?

All XC7VX415T-2FFG1158I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FFG1158I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VX415T-2FFG1158I part is unused and in its original packaging.

Return procedure for XC7VX415T-2FFG1158I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VX415T-2FFG1158I Tags

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