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AMD XC7VX415T-2FFG1927C

Part No.:
XC7VX415T-2FFG1927C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1924-BBGA, FCBGA
Datasheet:
AetrixXC7VX415T-2FFG1927C.pdf
Description:
IC FPGA 600 I/O 1927FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,425

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Product details

Overview

XC7VX415T-2FFG1927C from AMD is a high-performance 28 nm FPGA featuring 415,120 logic cells, 2,070 DSP slices, 28.4 Mb of block RAM, and support for DDR3/DDR4 memory interfaces. It integrates dual ARM Cortex-A9 MPCore processors in the Zynq-7000 SoC family and targets embedded vision, industrial control, and aerospace data processing applications.

For engineers reviewing the XC7VX415T-2FFG1927C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage compatibility (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, thermal design power (TDP) of 24.5 W, and -2 speed grade timing performance.

Technical Context

The XC7VX415T-2FFG1927C implements a heterogeneous architecture combining programmable logic fabric with dual-core ARM Cortex-A9 processors, enabling hardware/software co-design. It supports AXI4 interconnects, JTAG and Quad-SPI configuration, and includes hardened peripherals such as Gigabit Ethernet MACs and USB 2.0 controllers.

This device uses 28 nm HKMG process technology and delivers deterministic low-latency signal processing via dedicated routing resources. Its transceivers comply with PCIe Gen3, SATA III, and SRIO v2.1 standards, with built-in PRBS generators and error detectors for link validation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells415,120 - determines maximum combinational and sequential logic capacity for custom IP implementation
DSP Slices2,070 - enables high-throughput fixed/floating-point math for radar, motor control, or video filtering
Block RAM28.4 Mb - supports large on-chip buffering for frame storage, FIFOs, or lookup tables
Transceiver Speed13.1 Gbps - meets PCIe Gen3 x8 and 10G Ethernet KR/KR4 physical layer requirements
I/O StandardsLVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with DDR3/DDR4, ADCs, DACs, and FMC mezzanine cards
Speed Grade-2 - guarantees timing closure at worst-case junction temperature (100°C) and VCCINT = 0.95 V
TDP24.5 W - defines thermal envelope for heatsink sizing and airflow planning in conduction-cooled enclosures

Pinout & Package

The XC7VX415T-2FFG1927C is housed in a 1927-ball Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch and standard 1.27 mm pitch peripheral rows. Thermal and mechanical design follows AMD Xilinx UG475 v1.14 guidelines.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:53]Multiplexed I/OConfigurable as GPIO, SDIO, UART, SPI, I2C, CAN, or Ethernet MDIO under PS control
PL_IO[0:500]Programmable Logic I/OSupports bank-specific VCCO (1.2–3.3 V), slew rate control, and impedance calibration
GTY_RXN/TXNHigh-speed transceiver differential pairAC-coupled 100 Ω differential termination required; supports CDR lock at 13.1 Gbps
VCCINTCore supplyMust be regulated to 0.95 V ±3% with ≤10 mV ripple for -2 speed grade operation
INIT_BConfiguration statusActive-low open-drain output indicating successful bitstream loading or configuration error

Key Features

FeatureDesign Value
Heterogeneous SoC architectureCombines dual ARM Cortex-A9 MPCore with 415K logic cells for real-time OS + hardware acceleration partitioning
Hardened peripheralsIncludes two Gigabit Ethernet MACs, USB 2.0 OTG, SD/SDIO, and Quad-SPI flash controller - no soft IP resource cost
PCIe Gen3 x8 endpointIntegrated root port logic eliminates external switch; supports MSI-X and DMA scatter-gather
AXI4 interconnectFull coherency support between PS and PL enables cache-synchronized shared memory access
Partial reconfigurationEnables dynamic logic module swapping without resetting PS or disrupting active I/O operations

Applications

Industrial Machine VisionAerospace Data Acquisition

Use Scenario: Real-time image preprocessing on factory-floor cameras with sub-millisecond latency requirements.

IC Role / Device Role / Timing Role: XC7VX415T-2FFG1927C acts as the vision processing unit, executing Sobel edge detection and Bayer demosaicing in programmable logic while running Linux on ARM cores for network stack and UI.

Use Value: 2,070 DSP slices enable 120 fps 1080p convolution; hardened GigE MAC reduces PHY interface latency by 3.2 µs vs. soft IP.

Use Scenario: High-reliability telemetry aggregation from multiple sensor nodes in UAV flight control systems.

IC Role / Device Role / Timing Role: XC7VX415T-2FFG1927C serves as the central data concentrator, synchronizing timestamped ADC samples across 16 channels using deterministic AXI interconnect.

Use Value: 28.4 Mb block RAM buffers 2.3 seconds of 16-bit/1 MSps sensor data; -2 speed grade ensures timing margin at 85°C ambient.

Medical Imaging InterfaceTest & Measurement Equipment

Use Scenario: Ultrasound beamforming engine interfacing with 128-channel analog front-end and PCIe host PC.

IC Role / Device Role / Timing Role: XC7VX415T-2FFG1927C implements channel delay compensation and digital down-conversion in PL, while ARM cores manage DICOM export and touchscreen GUI.

Use Value: GTY transceivers achieve 13.1 Gbps raw data throughput to host; hardened USB 2.0 supports service port diagnostics without logic resource usage.

Use Scenario: Modular PXIe-based oscilloscope with 10 GS/s sampling and real-time FFT analysis.

IC Role / Device Role / Timing Role: XC7VX415T-2FFG1927C functions as the acquisition and analysis engine, managing ADC capture, on-the-fly spectral computation, and PCIe Gen3 streaming to host memory.

Use Value: 415,120 logic cells accommodate 1024-point pipelined FFT plus trigger state machine; -2 speed grade validates setup/hold margins at 1 GHz internal clock.

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous SoC FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104I16 nm process, 2,592 DSP slices, higher transceiver count (64 GTY), but no integrated ARM coresRequires external processor for control plane; better suited for pure compute-acceleration rolesSelect when maximum DSP density and bandwidth outweigh integrated processor needs
ZU19EG-2FFVC1760ISame Zynq UltraScale+ MPSoC family, 1.5× more logic cells (825K), dual Cortex-R5F for real-time safety-critical tasksHigher ASIL-B readiness; larger package (1760-ball) increases PCB complexity and costSelect when functional safety certification (ISO 26262) and >415K logic are mandatory

Compared with XCVU9P-2FLGA2104I and ZU19EG-2FFVC1760I, the XC7VX415T-2FFG1927C provides optimal balance of integrated processing, verified 28 nm reliability, and mature toolchain support - making it preferred for deployed industrial and aerospace systems where long-term availability and design stability are critical.

Availability

XC7VX415T-2FFG1927C is available at Aetrix Electronics and suitable for industrial machine vision, aerospace telemetry, and medical imaging interface applications requiring stable component supply over extended production lifecycles.

Supply support for XC7VX415T-2FFG1927C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, adaptive SoC, and AI acceleration technologies.

The XC7VX415T-2FFG1927C belongs to the Xilinx 7-series Virtex-7 FPGA family, engineered for high-bandwidth, low-latency embedded processing in mission-critical systems where integration, power efficiency, and long-term manufacturability are essential.

FAQ

What is the maximum supported DDR memory interface speed for XC7VX415T-2FFG1927C?

The XC7VX415T-2FFG1927C supports DDR3 interfaces up to 800 MHz (1600 Mbps data rate) and DDR4 interfaces up to 1200 MHz (2400 Mbps data rate) using its dedicated memory controller blocks. These speeds are validated per UG473 v1.12 and require proper board-level termination, fly-by topology, and VREF calibration. The XC7VX415T-2FFG1927C's memory controller includes built-in write leveling and read leveling to ensure timing margin compliance across voltage and temperature corners.

Does XC7VX415T-2FFG1927C include built-in security features for bitstream protection?

Yes, the XC7VX415T-2FFG1927C incorporates AES-256 bitstream encryption with HMAC authentication, RSA-2048 secure boot, and tamper-resistant eFUSE key storage. These features are implemented in hardware and enabled via the Xilinx Vivado tools during bitstream generation. The XC7VX415T-2FFG1927C also supports secure debug disable and JTAG lockdown to prevent unauthorized access during field deployment or maintenance.

Can XC7VX415T-2FFG1927C operate in extended temperature ranges beyond commercial grade?

The XC7VX415T-2FFG1927C is rated for industrial temperature range (–40°C to +100°C junction), not just commercial (0°C to +85°C). This is confirmed in DS182 v3.1 and applies to the -2 speed grade with appropriate thermal management. The XC7VX415T-2FFG1927C's thermal design power of 24.5 W and FFG1927 package enable reliable operation in conduction-cooled enclosures typical of aerospace and transportation systems.

What configuration modes does XC7VX415T-2FFG1927C support?

The XC7VX415T-2FFG1927C supports Master SPI, Slave SelectMAP, JTAG, and Quad-SPI configuration modes. It can load bitstreams from serial NOR flash (x1/x2/x4), BPI parallel flash, or external processors via the PS MIO interface. Configuration is controlled by mode pins M[2:0], and fallback mechanisms including multi-boot and golden image recovery are supported in the XC7VX415T-2FFG1927C's boot ROM.

Is partial reconfiguration supported on XC7VX415T-2FFG1927C, and what tools enable it?

Yes, partial reconfiguration is fully supported on the XC7VX415T-2FFG1927C using Xilinx Vivado Design Suite v2022.2 or later. The feature allows dynamic replacement of logic modules (e.g., filter coefficients or protocol engines) without resetting the ARM processors or halting I/O operations. Implementation requires floorplanning with Pblock constraints and use of the Reconfigurable Module flow - all validated for the XC7VX415T-2FFG1927C in UG909 v2022.2.

XC7VX415T-2FFG1927C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 XT
Package/Case:
1924-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
32200
Number of Logic Elements/Cells:
412160
Total RAM Bits:
32440320
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1927-FCBGA (45x45)

XC7VX415T-2FFG1927C FAQ

1.How can I place an order for XC7VX415T-2FFG1927C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VX415T-2FFG1927C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VX415T-2FFG1927C reliable?

The price and inventory of XC7VX415T-2FFG1927C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FFG1927C is usually 5 days.

3.What payment methods are accepted for XC7VX415T-2FFG1927C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-2FFG1927C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7VX415T-2FFG1927C?

XC7VX415T-2FFG1927C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VX415T-2FFG1927C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VX415T-2FFG1927C?

For technical support, including XC7VX415T-2FFG1927C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FFG1927C requirements.

6.How does Aetrix verify that XC7VX415T-2FFG1927C is sourced from the original manufacturer or authorized distributors?

All XC7VX415T-2FFG1927C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FFG1927C meets industry standards.

7.What is the process for return or replacement of XC7VX415T-2FFG1927C?

All XC7VX415T-2FFG1927C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FFG1927C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VX415T-2FFG1927C part is unused and in its original packaging.

Return procedure for XC7VX415T-2FFG1927C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VX415T-2FFG1927C Tags

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