AMD XC7VX415T-2FFG1927I
- Part No.:
- XC7VX415T-2FFG1927I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-2FFG1927I.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX415T-2FFG1927I from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,800 logic cells, 2,496 DSP slices, and 48.5 Mb of block RAM. It features 1927-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging and supports transceiver line rates up to 13.1 Gb/s for high-speed serial interface applications in radar signal processing and 100G optical transport.
For engineers reviewing the XC7VX415T-2FFG1927I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver performance, logic density, thermal design power (14.7 W typical), I/O voltage support (1.2 V to 1.8 V), and industrial temperature range (-40°C to +100°C).
Technical Context
The XC7VX415T-2FFG1927I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers (MGTs), configurable logic blocks (CLBs), and hardened IP including PCIe Gen3 x8, 10/25/100G Ethernet MAC, and DDR3/DDR4 memory controllers. It supports partial reconfiguration and AXI4 interconnect for heterogeneous system integration.
This device belongs to the Virtex-7 family's "T" grade (Transceiver-optimized), with 48 MGT lanes operating at 13.1 Gb/s, 1,000 user I/Os across 32 banks, and dual-register flip-flops per LUT for high-speed synchronous logic implementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,800 - determines maximum combinational and sequential logic capacity for complex digital systems |
| DSP Slices | 2,496 - enables parallel execution of multiply-accumulate operations for real-time signal processing |
| Block RAM | 48.5 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory latency |
| Transceiver Speed | 13.1 Gb/s - supports 100G Ethernet KR4, CPRI, and JESD204B interfaces with forward error correction |
| I/O Banks | 32 - allows independent voltage domain configuration per bank for mixed-signal interface coexistence |
| Thermal Design Power | 14.7 W (typical) - defines heatsink and airflow requirements for sustained operation in sealed enclosures |
| Operating Temperature | -40°C to +100°C - qualifies for industrial and outdoor base station deployment without derating |
Pinout & Package
XC7VX415T-2FFG1927I uses a 1927-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, 42.5 mm × 42.5 mm body size, and thermal lid for enhanced heat dissipation in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 1.0 V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, SelectIO, and clock management tiles |
| VCCO | I/O bank supply | Configurable per-bank voltage (1.2–1.8 V) enabling mixed-voltage interface interoperability |
| MRCC / SRCC | Multi-Region Clock Capable | Dedicated differential clock inputs supporting phase-aligned clock distribution across multiple clock regions |
| GTXE2_CHANNEL | Transceiver lane | Each pair supports 13.1 Gb/s serial I/O with built-in CDR, 8B/10B encoding, and PRBS generation |
| MGTAVCC | Analog transceiver supply | 1.0 V analog rail for GTXE2 transceiver PLLs and serializers; sensitive to ripple and noise |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during runtime-critical for adaptive radar waveform updates and protocol stack upgrades |
| Hardened PCIe Gen3 x8 Controller | Reduces RTL overhead and timing closure risk for host interface integration in compute-accelerated systems |
| AXI4 Interconnect Fabric | Provides standardized, scalable, and pipelined data path between processors, memory, and custom accelerators |
| DDR4 Memory Controller | Supports 2,400 MT/s operation with ECC and address/command bus deskew-essential for high-reliability buffer memory |
| UltraScale-Compatible Bitstream | Allows migration path to UltraScale+ devices using same toolflow and partial bitstream reuse |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary programmable logic fabric executing FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 415K logic cells and 2,496 DSP slices enable concurrent multi-channel processing at 100+ MSPS sample rates. | Use Scenario: Line card implementation in metro/core optical networks supporting OTU4 and FlexO framing. IC Role / Device Role / Timing Role: SerDes aggregation engine with 48x 13.1 Gb/s transceivers mapped to 4x 100G client interfaces. Use Value: Native support for IEEE 802.3ba KR4 FEC and precise jitter tolerance (<0.3 UI) ensures BER <1e-12 over 80 km SMF. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: FPGA-accelerated financial analytics and genomics alignment pipelines in rack-mounted servers. IC Role / Device Role / Timing Role: Co-processor interfacing via PCIe Gen3 x8 to host CPU, managing DMA transfers and kernel offload. Use Value: Hardened PCIe controller and 48.5 Mb block RAM reduce software driver complexity and eliminate external memory bottlenecks. | Use Scenario: Modular digitizer and arbitrary waveform generator platforms requiring sub-nanosecond timing resolution. IC Role / Device Role / Timing Role: Timing and control hub synchronizing ADC/DAC sampling clocks, trigger routing, and pattern generation logic. Use Value: MRCC/SRCC clock inputs and deterministic I/O delay calibration ensure <±25 ps channel-to-channel skew across 1,000 pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | UltraScale+ architecture; higher logic density (1,024K LC), lower power per DSP slice, 16.3 Gb/s transceivers | Better suited for AI inference acceleration and 400G Ethernet where bandwidth and efficiency outweigh legacy IP compatibility | Select when migrating to newer process node and requiring >13.1 Gb/s serial I/O or advanced memory interfaces (HBM2) |
| XC7VX690T-2FFG1927I | Same Virtex-7 family, larger logic capacity (693K LC), identical 1927-pin FFG package and transceiver spec | Preferred for designs needing additional CLBs or DSP slices without changing PCB layout or thermal solution | Choose for direct scalability within same footprint and cooling design-no board revision required |
Compared with XC7VX415T-2FFG1927I, XCVU13P-2FLGA2577I offers architectural advancement and higher speed but requires new toolchain and IP validation, while XC7VX690T-2FFG1927I delivers immediate logic headroom within identical mechanical and thermal constraints.
Availability
XC7VX415T-2FFG1927I is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and high-performance computing acceleration requiring stable component supply across extended product lifecycles.
Supply support for XC7VX415T-2FFG1927I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace & defense markets.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal and packet processing in mission-critical infrastructure where deterministic timing and long-term reliability are mandatory.
FAQ
What is the maximum transceiver line rate supported by XC7VX415T-2FFG1927I?
The XC7VX415T-2FFG1927I supports a maximum transceiver line rate of 13.1 Gb/s per GTXE2 channel. This enables compliance with 100G Ethernet KR4, CPRI Option 10, and JESD204B subclass 1 protocols. The device includes 48 such transceiver lanes, all capable of this rate under industrial temperature conditions with proper reference clock jitter below 0.3 ps RMS.
Does XC7VX415T-2FFG1927I support DDR4 memory interfaces?
Yes, XC7VX415T-2FFG1927I integrates a hardened DDR4 memory controller supporting data rates up to 2,400 MT/s with on-die termination, write-leveling, and ECC capability. It drives up to 32-bit wide interfaces with registered DIMMs and meets JEDEC DDR4-2400 timing specifications when used with appropriate board layout and termination.
What is the operating temperature range for XC7VX415T-2FFG1927I?
XC7VX415T-2FFG1927I is rated for industrial temperature operation from -40°C to +100°C. This rating applies to the junction temperature under specified thermal conditions and validates its use in outdoor base stations, avionics cabinets, and sealed industrial enclosures without active derating.
How many logic cells does XC7VX415T-2FFG1927I contain?
XC7VX415T-2FFG1927I contains 415,800 logic cells, each composed of six-input LUTs with dual registers. This logic capacity supports large-scale digital signal processing pipelines, multi-core soft processor subsystems, and high-throughput packet classification engines without external logic expansion.
Is XC7VX415T-2FFG1927I pin-compatible with other Virtex-7 FFG1927 devices?
Yes, XC7VX415T-2FFG1927I shares the identical 1927-ball FFG package footprint and pinout with other Virtex-7 T-grade devices in the same package variant, including XC7VX690T-2FFG1927I. Power, ground, configuration, and I/O bank assignments are consistent, enabling direct PCB reuse across logic-density variants.
XC7VX415T-2FFG1927I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX415T-2FFG1927I FAQ
1.How can I place an order for XC7VX415T-2FFG1927I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-2FFG1927I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-2FFG1927I reliable?
The price and inventory of XC7VX415T-2FFG1927I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FFG1927I is usually 5 days.
3.What payment methods are accepted for XC7VX415T-2FFG1927I?
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4.How is shipping managed for XC7VX415T-2FFG1927I?
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-2FFG1927I?
For technical support, including XC7VX415T-2FFG1927I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FFG1927I requirements.
6.How does Aetrix verify that XC7VX415T-2FFG1927I is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-2FFG1927I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FFG1927I meets industry standards.
7.What is the process for return or replacement of XC7VX415T-2FFG1927I?
All XC7VX415T-2FFG1927I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FFG1927I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-2FFG1927I part is unused and in its original packaging.
Return procedure for XC7VX415T-2FFG1927I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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