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AMD XC7VX415T-2FFG1927I

Part No.:
XC7VX415T-2FFG1927I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1924-BBGA, FCBGA
Datasheet:
AetrixXC7VX415T-2FFG1927I.pdf
Description:
IC FPGA 600 I/O 1927FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,805

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Product details

Overview

XC7VX415T-2FFG1927I from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,800 logic cells, 2,496 DSP slices, and 48.5 Mb of block RAM. It features 1927-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging and supports transceiver line rates up to 13.1 Gb/s for high-speed serial interface applications in radar signal processing and 100G optical transport.

For engineers reviewing the XC7VX415T-2FFG1927I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver performance, logic density, thermal design power (14.7 W typical), I/O voltage support (1.2 V to 1.8 V), and industrial temperature range (-40°C to +100°C).

Technical Context

The XC7VX415T-2FFG1927I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers (MGTs), configurable logic blocks (CLBs), and hardened IP including PCIe Gen3 x8, 10/25/100G Ethernet MAC, and DDR3/DDR4 memory controllers. It supports partial reconfiguration and AXI4 interconnect for heterogeneous system integration.

This device belongs to the Virtex-7 family's "T" grade (Transceiver-optimized), with 48 MGT lanes operating at 13.1 Gb/s, 1,000 user I/Os across 32 banks, and dual-register flip-flops per LUT for high-speed synchronous logic implementation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells415,800 - determines maximum combinational and sequential logic capacity for complex digital systems
DSP Slices2,496 - enables parallel execution of multiply-accumulate operations for real-time signal processing
Block RAM48.5 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory latency
Transceiver Speed13.1 Gb/s - supports 100G Ethernet KR4, CPRI, and JESD204B interfaces with forward error correction
I/O Banks32 - allows independent voltage domain configuration per bank for mixed-signal interface coexistence
Thermal Design Power14.7 W (typical) - defines heatsink and airflow requirements for sustained operation in sealed enclosures
Operating Temperature-40°C to +100°C - qualifies for industrial and outdoor base station deployment without derating

Pinout & Package

XC7VX415T-2FFG1927I uses a 1927-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, 42.5 mm × 42.5 mm body size, and thermal lid for enhanced heat dissipation in high-power FPGA applications.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply railSupplies 1.0 V to FPGA fabric; requires low-noise regulation and local decoupling
VCCAUXAuxiliary supply railProvides 1.8 V to configuration logic, SelectIO, and clock management tiles
VCCOI/O bank supplyConfigurable per-bank voltage (1.2–1.8 V) enabling mixed-voltage interface interoperability
MRCC / SRCCMulti-Region Clock CapableDedicated differential clock inputs supporting phase-aligned clock distribution across multiple clock regions
GTXE2_CHANNELTransceiver laneEach pair supports 13.1 Gb/s serial I/O with built-in CDR, 8B/10B encoding, and PRBS generation
MGTAVCCAnalog transceiver supply1.0 V analog rail for GTXE2 transceiver PLLs and serializers; sensitive to ripple and noise

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping during runtime-critical for adaptive radar waveform updates and protocol stack upgrades
Hardened PCIe Gen3 x8 ControllerReduces RTL overhead and timing closure risk for host interface integration in compute-accelerated systems
AXI4 Interconnect FabricProvides standardized, scalable, and pipelined data path between processors, memory, and custom accelerators
DDR4 Memory ControllerSupports 2,400 MT/s operation with ECC and address/command bus deskew-essential for high-reliability buffer memory
UltraScale-Compatible BitstreamAllows migration path to UltraScale+ devices using same toolflow and partial bitstream reuse

Applications

Radar Signal Processing100G Optical Transport

Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems.

IC Role / Device Role / Timing Role: Primary programmable logic fabric executing FFT, CFAR, and STAP algorithms with deterministic latency.

Use Value: 415K logic cells and 2,496 DSP slices enable concurrent multi-channel processing at 100+ MSPS sample rates.

Use Scenario: Line card implementation in metro/core optical networks supporting OTU4 and FlexO framing.

IC Role / Device Role / Timing Role: SerDes aggregation engine with 48x 13.1 Gb/s transceivers mapped to 4x 100G client interfaces.

Use Value: Native support for IEEE 802.3ba KR4 FEC and precise jitter tolerance (<0.3 UI) ensures BER <1e-12 over 80 km SMF.

High-Performance Computing AccelerationTest & Measurement Equipment

Use Scenario: FPGA-accelerated financial analytics and genomics alignment pipelines in rack-mounted servers.

IC Role / Device Role / Timing Role: Co-processor interfacing via PCIe Gen3 x8 to host CPU, managing DMA transfers and kernel offload.

Use Value: Hardened PCIe controller and 48.5 Mb block RAM reduce software driver complexity and eliminate external memory bottlenecks.

Use Scenario: Modular digitizer and arbitrary waveform generator platforms requiring sub-nanosecond timing resolution.

IC Role / Device Role / Timing Role: Timing and control hub synchronizing ADC/DAC sampling clocks, trigger routing, and pattern generation logic.

Use Value: MRCC/SRCC clock inputs and deterministic I/O delay calibration ensure <±25 ps channel-to-channel skew across 1,000 pins.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU13P-2FLGA2577IUltraScale+ architecture; higher logic density (1,024K LC), lower power per DSP slice, 16.3 Gb/s transceiversBetter suited for AI inference acceleration and 400G Ethernet where bandwidth and efficiency outweigh legacy IP compatibilitySelect when migrating to newer process node and requiring >13.1 Gb/s serial I/O or advanced memory interfaces (HBM2)
XC7VX690T-2FFG1927ISame Virtex-7 family, larger logic capacity (693K LC), identical 1927-pin FFG package and transceiver specPreferred for designs needing additional CLBs or DSP slices without changing PCB layout or thermal solutionChoose for direct scalability within same footprint and cooling design-no board revision required

Compared with XC7VX415T-2FFG1927I, XCVU13P-2FLGA2577I offers architectural advancement and higher speed but requires new toolchain and IP validation, while XC7VX690T-2FFG1927I delivers immediate logic headroom within identical mechanical and thermal constraints.

Availability

XC7VX415T-2FFG1927I is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and high-performance computing acceleration requiring stable component supply across extended product lifecycles.

Supply support for XC7VX415T-2FFG1927I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace & defense markets.

The Virtex-7 family was engineered for high-bandwidth, low-latency signal and packet processing in mission-critical infrastructure where deterministic timing and long-term reliability are mandatory.

FAQ

What is the maximum transceiver line rate supported by XC7VX415T-2FFG1927I?

The XC7VX415T-2FFG1927I supports a maximum transceiver line rate of 13.1 Gb/s per GTXE2 channel. This enables compliance with 100G Ethernet KR4, CPRI Option 10, and JESD204B subclass 1 protocols. The device includes 48 such transceiver lanes, all capable of this rate under industrial temperature conditions with proper reference clock jitter below 0.3 ps RMS.

Does XC7VX415T-2FFG1927I support DDR4 memory interfaces?

Yes, XC7VX415T-2FFG1927I integrates a hardened DDR4 memory controller supporting data rates up to 2,400 MT/s with on-die termination, write-leveling, and ECC capability. It drives up to 32-bit wide interfaces with registered DIMMs and meets JEDEC DDR4-2400 timing specifications when used with appropriate board layout and termination.

What is the operating temperature range for XC7VX415T-2FFG1927I?

XC7VX415T-2FFG1927I is rated for industrial temperature operation from -40°C to +100°C. This rating applies to the junction temperature under specified thermal conditions and validates its use in outdoor base stations, avionics cabinets, and sealed industrial enclosures without active derating.

How many logic cells does XC7VX415T-2FFG1927I contain?

XC7VX415T-2FFG1927I contains 415,800 logic cells, each composed of six-input LUTs with dual registers. This logic capacity supports large-scale digital signal processing pipelines, multi-core soft processor subsystems, and high-throughput packet classification engines without external logic expansion.

Is XC7VX415T-2FFG1927I pin-compatible with other Virtex-7 FFG1927 devices?

Yes, XC7VX415T-2FFG1927I shares the identical 1927-ball FFG package footprint and pinout with other Virtex-7 T-grade devices in the same package variant, including XC7VX690T-2FFG1927I. Power, ground, configuration, and I/O bank assignments are consistent, enabling direct PCB reuse across logic-density variants.

XC7VX415T-2FFG1927I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 XT
Package/Case:
1924-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
32200
Number of Logic Elements/Cells:
412160
Total RAM Bits:
32440320
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1927-FCBGA (45x45)

XC7VX415T-2FFG1927I FAQ

1.How can I place an order for XC7VX415T-2FFG1927I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VX415T-2FFG1927I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VX415T-2FFG1927I reliable?

The price and inventory of XC7VX415T-2FFG1927I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FFG1927I is usually 5 days.

3.What payment methods are accepted for XC7VX415T-2FFG1927I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-2FFG1927I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7VX415T-2FFG1927I?

XC7VX415T-2FFG1927I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VX415T-2FFG1927I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VX415T-2FFG1927I?

For technical support, including XC7VX415T-2FFG1927I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FFG1927I requirements.

6.How does Aetrix verify that XC7VX415T-2FFG1927I is sourced from the original manufacturer or authorized distributors?

All XC7VX415T-2FFG1927I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FFG1927I meets industry standards.

7.What is the process for return or replacement of XC7VX415T-2FFG1927I?

All XC7VX415T-2FFG1927I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FFG1927I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VX415T-2FFG1927I part is unused and in its original packaging.

Return procedure for XC7VX415T-2FFG1927I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VX415T-2FFG1927I Tags

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