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AMD XC7VX415T-2FFV1158C
- Part No.:
- XC7VX415T-2FFV1158C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-2FFV1158C.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,278
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Product details
Overview
XC7VX415T-2FFV1158C from AMD is a high-performance 28 nm Virtex-7 FPGA with 415,800 logic cells, 2,040 DSP slices, 34.8 Mb of block RAM, and support for up to 1,200 GT transceivers running at 13.1 Gb/s. It serves as a system-level reconfigurable fabric in high-throughput data processing, radar signal conditioning, and 100G Ethernet line cards.
For engineers reviewing the XC7VX415T-2FFV1158C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-2), I/O bank voltage flexibility (1.2 V to 1.8 V), and thermal performance in air-cooled 1158-pin flip-chip BGA packaging.
Technical Context
The XC7VX415T-2FFV1158C implements a 28 nm HKMG process-based architecture with SelectIO technology supporting SSTL, LVCMOS, HSTL, and differential standards including LVDS and TMDS. Its clocking subsystem includes 24 MMCMs and 12 PLLs for multi-domain frequency synthesis and jitter attenuation.
It integrates hardened IP blocks including PCIe Gen3 x8 endpoints, 10/25/100G Ethernet MACs, and AXI-4 interconnect infrastructure. Configuration occurs via dual-boot SPIx4 or JTAG, with bitstream encryption and HMAC authentication enabled for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,800 - determines maximum combinational and sequential logic capacity for custom datapaths and control units |
| DSP Slices | 2,040 - enables parallel execution of multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 34.8 Mb - supports large on-chip buffering for video frame stores, packet queues, and coefficient tables |
| GT Transceivers | 1,200 lanes @ 13.1 Gb/s - delivers aggregate bandwidth for multi-lane serial protocols including CPRI, JESD204B/C, and OTU4 |
| I/O Standards | SSTL-15/18, LVCMOS, HSTL, LVDS, TMDS - allows direct interface to DDR3/DDR4 memory, sensors, and display controllers |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (100°C) and voltage (0.95 V) |
| Configuration Security | AES-256 + HMAC-SHA-256 - prevents unauthorized bitstream cloning and runtime tampering |
Pinout & Package
The XC7VX415T-2FFV1158C is housed in a 1158-pin flip-chip BGA (FFV) package with 0.8 mm pitch, designed for controlled-impedance PCB routing and thermal dissipation via center thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 0.95 V ±3% input powering CLBs, DSPs, and interconnect; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, clock management, and transceiver analog circuitry |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V output driver voltage per bank; sets signaling standard compatibility |
| MGTAVCC | Transceiver analog supply | 1.0 V analog rail for GTY transceiver PLLs and serializers; sensitive to ripple & noise |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or configuration error |
| CCLK | Configuration clock | Input clock for master SPI configuration mode; frequency ≤ 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol requirements |
| AXI-4 Interconnect Fabric | Enables scalable, low-latency communication between multiple masters and slaves without custom bus arbitration |
| UltraScale+ Compatible Configuration | Supports partial reconfiguration workflows and bitstream compression for faster load times and smaller storage footprint |
| Multi-Gigabit Transceiver Calibration | Per-lane dynamic equalization and eye-width optimization for reliable operation across PVT variations |
| System Monitor (XADC) | On-die 12-bit ADC monitoring die temperature, supply voltages, and external analog inputs for health telemetry |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Reconfigurable baseband processor handling ADC sample ingestion, FFT computation, and CFAR detection. Use Value: 2,040 DSP slices and 13.1 Gb/s GT lanes enable simultaneous multi-channel wideband processing with deterministic latency. | Use Scenario: Line-side termination and OTN framing in metro/core optical transport nodes. IC Role / Device Role / Timing Role: Protocol-aware framer and mapper implementing OTU4, GFP-F, and FEC for 100G client interfaces. Use Value: Hardened 100G Ethernet MACs and 34.8 Mb block RAM allow full-frame buffering and real-time overhead insertion without external memory. |
| High-Performance Computing Acceleration | Medical Imaging Reconstruction |
Use Scenario: Offloading compute-intensive kernels (e.g., matrix inversion, sparse solvers) from CPU hosts in edge servers. IC Role / Device Role / Timing Role: PCIe-attached accelerator executing custom HDL kernels with direct host memory access via AXI DMA. Use Value: PCIe Gen3 x8 endpoint and 415,800 logic cells deliver >25 GB/s effective bandwidth and flexible pipeline depth for iterative algorithms. | Use Scenario: Real-time back-projection and iterative reconstruction in CT and PET scanners. IC Role / Device Role / Timing Role: High-throughput image reconstruction engine interfacing with 16-bit ADC arrays and DDR4 memory subsystems. Use Value: SSTL-15 I/O banks and 1.2 V to 1.8 V VCCO support direct connection to medical-grade ADCs and low-power DDR4 modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGB2104E | UltraScale+ architecture; higher logic density (1,024K LC), lower power per DSP, but no native 13.1 Gb/s GT support | Better suited for AI inference acceleration with INT8/FP16 tensor ops; less optimal for legacy CPRI/JESD204B systems | Select when migrating to 16 nm node and prioritizing power efficiency over backward transceiver compatibility |
| XC7VX690T-2FFG1927I | Same Virtex-7 family; larger package (1927-pin), 690K logic cells, and extended industrial temp range (−40°C to +100°C) | Targeted at harsh-environment avionics and defense platforms requiring extended thermal margin and higher gate count | Choose for designs needing greater logic headroom and guaranteed operation beyond commercial temperature limits |
Compared with XC7VX415T-2FFV1158C, the XCVU13P offers superior computational density and energy efficiency but sacrifices native 13.1 Gb/s transceiver support, while the XC7VX690T provides more logic resources and wider temperature tolerance at the cost of larger board area and higher thermal design complexity.
Availability
XC7VX415T-2FFV1158C is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and medical imaging reconstruction requiring stable component supply across long-life industrial programs.
Supply support for XC7VX415T-2FFV1158C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.
The Virtex-7 family was engineered for high-bandwidth, low-latency reconfigurable systems demanding deterministic timing, hardened protocol engines, and multi-gigabit serial connectivity.
FAQ
What is the maximum supported transceiver data rate for XC7VX415T-2FFV1158C?
The XC7VX415T-2FFV1158C supports GT transceivers operating at up to 13.1 Gb/s per lane. This rate is validated across all 1,200 transceiver lanes under speed grade -2 conditions (100°C junction, 0.95 V VCCINT). Applications such as CPRI, JESD204B/C, and OTU4 rely on this capability for deterministic serial link performance.
Does XC7VX415T-2FFV1158C support partial reconfiguration?
Yes, XC7VX415T-2FFV1158C supports partial reconfiguration through Vivado Design Suite. The device's configuration logic allows dynamic swapping of module-level bitstreams without resetting the entire FPGA. This capability is used in applications like adaptive radio front-ends and multi-standard baseband processing where functional modes change during operation.
What I/O standards are supported by XC7VX415T-2FFV1158C?
XC7VX415T-2FFV1158C supports SSTL-15, SSTL-18, LVCMOS, HSTL, LVDS, and TMDS across its 500+ user I/O pins. Each I/O bank operates independently with configurable VCCO (1.2 V to 1.8 V), enabling mixed-voltage interfaces-for example, connecting DDR3 memory (SSTL-15) and HDMI sources (TMDS) simultaneously.
Is XC7VX415T-2FFV1158C qualified for automotive applications?
No, XC7VX415T-2FFV1158C is rated for commercial temperature range (0°C to +85°C) and is not AEC-Q100 qualified. For automotive use cases requiring extended temperature operation or functional safety certification, AMD recommends the XA-Virtex-7 family variants, which undergo additional qualification testing and include FIT rate reporting.
How many PCIe Gen3 lanes does XC7VX415T-2FFV1158C support?
XC7VX415T-2FFV1158C integrates a hardened PCIe Gen3 x8 endpoint. It supports full-duplex operation at 8 GT/s per lane, delivering up to 7.877 GB/s aggregate bandwidth in x8 configuration. The core is compliant with PCIe Base Specification Rev 3.0 and supports advanced features including ASPM L0s/L1 and completion timeout handling.
XC7VX415T-2FFV1158C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX415T-2FFV1158C FAQ
1.How can I place an order for XC7VX415T-2FFV1158C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-2FFV1158C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-2FFV1158C reliable?
The price and inventory of XC7VX415T-2FFV1158C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-2FFV1158C is usually 5 days.
3.What payment methods are accepted for XC7VX415T-2FFV1158C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-2FFV1158C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX415T-2FFV1158C?
XC7VX415T-2FFV1158C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX415T-2FFV1158C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-2FFV1158C?
For technical support, including XC7VX415T-2FFV1158C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-2FFV1158C requirements.
6.How does Aetrix verify that XC7VX415T-2FFV1158C is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-2FFV1158C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-2FFV1158C meets industry standards.
7.What is the process for return or replacement of XC7VX415T-2FFV1158C?
All XC7VX415T-2FFV1158C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-2FFV1158C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-2FFV1158C part is unused and in its original packaging.
Return procedure for XC7VX415T-2FFV1158C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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