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AMD XC7VX415T-3FFG1157E
- Part No.:
- XC7VX415T-3FFG1157E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX415T-3FFG1157E.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,433
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Product details
Overview
XC7VX415T-3FFG1157E from AMD is a high-performance 28 nm FPGA with 415,120 logic cells, 2,050 DSP slices, and 32.4 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-accelerated embedded systems.
For engineers reviewing the XC7VX415T-3FFG1157E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (13.1 Gb/s), I/O voltage support (1.2 V to 3.3 V), thermal design power (49 W), and PCIe Gen3 x8 endpoint capability.
Technical Context
The XC7VX415T-3FFG1157E implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen3, SATA, and SRIO. It features dual-core ARM Cortex-A9 MPCore processor subsystems in Zynq-7000 All Programmable SoC variants-but this part is a Virtex-7 FPGA only, without integrated processors.
It supports SelectIO standards up to LVDS DCI, includes clock management tiles with MMCM and PLL, and delivers deterministic timing closure for designs operating at up to 600 MHz system clock frequency with static timing analysis verified.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 415,120 LUTs + flip-flops; enables complex digital signal processing pipelines or multi-channel protocol stacks. |
| DSP Slices | 2,050; supports 25×18-bit multiply-accumulate operations per slice at ≥400 MHz for radar or video filtering. |
| Block RAM | 32.4 Mb (2,800 × 36 Kb BRAM); sufficient for dual-port frame buffers or large lookup tables in real-time control. |
| Transceiver Line Rate | 13.1 Gb/s; meets PCIe Gen3 x8 and 10G Ethernet KR requirements without gearbox logic. |
| I/O Standards | Supports LVCMOS, SSTL, HSTL, LVDS, TMDS; allows direct interfacing to DDR3-1866 memory and HDMI 1.4 PHYs. |
| Thermal Design Power | 49 W (typical at full utilization); requires active cooling and 6-layer PCB with thermal vias under FFG1157 package. |
| Speed Grade | -3 grade; guarantees timing closure at highest performance bin for critical paths in high-frequency designs. |
Pinout & Package
XC7VX415T-3FFG1157E is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-TDP applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering logic fabric and CLBs; requires low-noise, high-PSRR regulation. |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, clock management, and transceiver reference circuits. |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V output bank supply; sets voltage level for associated I/O pins in Bank 0. |
| MGTAVCC | Transceiver analog supply | 1.0 V analog supply for GTY transceiver quads; sensitive to ripple & must be filtered with ≥10 µF ceramic + ferrite bead. |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration failure or incomplete bitstream loading. |
| PROGRAM_B | Configuration reset | Active-low input that clears configuration memory and initiates reconfiguration from external source. |
Key Features
| Feature | Design Value |
|---|---|
| High-speed transceivers | 32 GTY transceivers supporting 13.1 Gb/s line rates with built-in PRBS generators and error detectors for link validation. |
| Advanced clocking | Dual MMCM + PLL per clock region enable sub-100 fs jitter synthesis and phase alignment across multiple clock domains. |
| PCIe Gen3 x8 endpoint | Fully compliant endpoint with integrated DMA engine and AXI4 streaming interface-no external bridge IC required. |
| UltraScale-compatible I/O | SelectIO supports backplane-optimized standards including differential SSTL-12 and HSUL-12 for robust 10+ inch trace routing. |
| Partial reconfiguration support | Enables dynamic module swapping in runtime without resetting entire device-validated for aerospace telemetry payload updates. |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems with >100 MSPS ADC inputs. IC Role / Device Role / Timing Role: FPGA fabric performs parallel FFT, CFAR, and STAP algorithms; GTY transceivers stream processed data to host via PCIe Gen3. Use Value: 415K logic cells and 2,050 DSP slices deliver 128-channel coherent processing at ≤5 µs latency. | Use Scenario: Multi-channel oscilloscope capturing 16-bit waveforms at 1 GS/s across 8 channels with on-board storage. IC Role / Device Role / Timing Role: XC7VX415T-3FFG1157E manages time-interleaved ADC control, deep buffer management, and 10G Ethernet export. Use Value: 32.4 Mb block RAM enables 256 MSamples/channel capture; GTY transceivers export at 10.3125 Gb/s without compression. |
| Avionics Data Concentrator | 5G Baseband Prototyping |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Implements deterministic time-triggered switching fabric with hardware timestamping and redundancy arbitration. Use Value: -3 speed grade ensures worst-case path timing closure at −55°C to +85°C extended temperature range. | Use Scenario: Massive MIMO precoding and channel estimation prototyping for 3GPP NR FR1 base stations. IC Role / Device Role / Timing Role: Configurable DSP pipeline executes 64×64 matrix inversion and QAM demodulation using native 25×18 multipliers. Use Value: 2,050 DSP slices sustain 2.4 GOPS @ 400 MHz for real-time 100-MHz bandwidth processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture; 1,124K logic cells, 5,520 DSP slices, higher transceiver count (64 GTY), but larger 2577-pin package. | Better suited for next-gen 400G Ethernet and AI inference acceleration where logic density and bandwidth exceed XC7VX415T limits. | Select XCVU13P when migrating beyond 400K LUT capacity or requiring >13.1 Gb/s transceivers (e.g., 25G KR4). |
| XC7VX690T-3FFG1927E | Virtex-7 family; 693,120 logic cells, same -3 speed grade and GTY transceivers, but 1927-pin FFG package and higher TDP (67 W). | Used in ultra-high-channel-count medical imaging and test equipment where additional BRAM (48.9 Mb) and I/O count (800+) are mandatory. | Choose XC7VX690T only if design requires >415K LUTs and can accommodate larger board footprint and thermal load. |
Compared with XC7VX415T-3FFG1157E, the XCVU13P offers scalable bandwidth and logic for future-proofing, while the XC7VX690T provides raw resource headroom within the same 28 nm process-both require PCB redesign due to non-identical packages and power delivery networks.
Availability
XC7VX415T-3FFG1157E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for XC7VX415T-3FFG1157E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Virtex-7 family-including XC7VX415T-3FFG1157E-is designed for high-bandwidth, compute-intensive applications such as wired communications infrastructure, defense radar, and scientific instrumentation.
FAQ
What is the maximum transceiver line rate supported by XC7VX415T-3FFG1157E?
The XC7VX415T-3FFG1157E supports a maximum transceiver line rate of 13.1 Gb/s using its GTY transceivers. This enables compliance with PCIe Gen3 x8, 10G Ethernet KR, and SATA 6G standards. The rate is guaranteed under -3 speed grade conditions with proper reference clock jitter and board layout adherence to AMD's IBIS-AMI models.
Does XC7VX415T-3FFG1157E include an integrated ARM processor?
No, XC7VX415T-3FFG1157E is a Virtex-7 FPGA-only device and does not contain embedded ARM processors. Unlike Zynq-7000 SoCs, it provides programmable logic, DSP slices, and transceivers without hard CPU cores. System-level processing must be implemented externally or via soft-core microcontrollers instantiated in the FPGA fabric.
What is the thermal design power (TDP) of XC7VX415T-3FFG1157E?
The thermal design power of XC7VX415T-3FFG1157E is 49 W under typical full-utilization conditions. This value assumes operation at junction temperature ≤100°C with adequate airflow and a 6-layer PCB featuring thermal vias beneath the FFG1157 package. Actual power varies with design utilization, clock frequency, and I/O activity.
Which configuration modes does XC7VX415T-3FFG1157E support?
XC7VX415T-3FFG1157E supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Configuration bitstreams can be loaded from external flash (e.g., Micron MT25QL series) or through boundary-scan debug interfaces. The device also supports fallback and multi-boot configurations using dedicated boot address pins.
Is XC7VX415T-3FFG1157E qualified for extended temperature operation?
Yes, the "E" suffix in XC7VX415T-3FFG1157E denotes extended temperature qualification (-40°C to +100°C junction). This variant undergoes screening per AMD's extended temp reliability test plan and is approved for use in avionics, downhole oil/gas, and outdoor telecom infrastructure where ambient extremes exceed commercial grade limits.
XC7VX415T-3FFG1157E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32200
- Number of Logic Elements/Cells:
- 412160
- Total RAM Bits:
- 32440320
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX415T-3FFG1157E FAQ
1.How can I place an order for XC7VX415T-3FFG1157E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX415T-3FFG1157E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX415T-3FFG1157E reliable?
The price and inventory of XC7VX415T-3FFG1157E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX415T-3FFG1157E is usually 5 days.
3.What payment methods are accepted for XC7VX415T-3FFG1157E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX415T-3FFG1157E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX415T-3FFG1157E?
XC7VX415T-3FFG1157E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX415T-3FFG1157E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX415T-3FFG1157E?
For technical support, including XC7VX415T-3FFG1157E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX415T-3FFG1157E requirements.
6.How does Aetrix verify that XC7VX415T-3FFG1157E is sourced from the original manufacturer or authorized distributors?
All XC7VX415T-3FFG1157E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX415T-3FFG1157E meets industry standards.
7.What is the process for return or replacement of XC7VX415T-3FFG1157E?
All XC7VX415T-3FFG1157E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX415T-3FFG1157E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX415T-3FFG1157E part is unused and in its original packaging.
Return procedure for XC7VX415T-3FFG1157E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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