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AMD XC7VX485T-1FF1157I

Part No.:
XC7VX485T-1FF1157I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC7VX485T-1FF1157I.pdf
Description:
IC FPGA 600 I/O 1157FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,574

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Product details

Overview

XC7VX485T-1FF1157I from AMD is a high-performance 28 nm FPGA featuring 485,760 logic cells, 2,850 DSP slices, and 36.4 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1157) package for high-speed serial I/O and compute-intensive applications in radar signal processing.

For engineers reviewing the XC7VX485T-1FF1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (up to 13.1 Gbps), I/O bank voltage support (1.2 V to 3.3 V), thermal design power (19.2 W typical), and PCIe Gen3 x8 endpoint capability.

Technical Context

The XC7VX485T-1FF1157I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen3, SATA, and SRIO. It includes hardened IP blocks for PCI Express Endpoint, Gigabit Ethernet MAC, and AXI interconnects.

Configuration is performed via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device supports partial reconfiguration and dynamic power management through dedicated power rails per I/O bank and programmable logic region.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells485,760 – total configurable logic resources for complex digital logic implementation
DSP Slices2,850 – fixed-point arithmetic units optimized for filtering, FFT, and math-intensive algorithms
Block RAM36.4 Mb – on-chip memory for data buffering, FIFOs, and lookup tables without external memory dependency
Transceiver Line Rate13.1 Gbps – supports PCIe Gen3 x8, 10G Ethernet, and CPRI at full lane count
I/O Pins600 – user-configurable single-ended and differential I/O across 24 banks with independent voltage control
TDP19.2 W typical – thermal envelope requiring active cooling in dense compute or high-bandwidth I/O configurations
Configuration ModeMaster SelectMAP or JTAG – enables flexible programming via parallel bus or standard debug interface

Pinout & Package

XC7VX485T-1FF1157I is housed in a 1157-ball Flip-Chip Fine-Pitch BGA (FFG1157) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply rail1.0 V ±3% input powering FPGA fabric and CLBs; requires low-noise regulation
VCCAUXAuxiliary supply rail1.8 V ±3% powering configuration logic, clocking, and transceiver reference circuits
VCCO_0I/O bank supplyConfigurable 1.2–3.3 V output driver voltage per bank; sets signal swing and interface compatibility
MGTAVCCTransceiver analog supply1.0 V ±3% powering high-speed serial transceiver analog circuitry
CLK_INDedicated clock inputDifferential pair for primary system clock; routed to MMCM/PLL for clock synthesis and jitter cleaning
INIT_BConfiguration statusOpen-drain output indicating configuration success/failure; used for system-level fault detection

Key Features

FeatureDesign Value
PCIe Gen3 x8 Endpoint Hard IPReduces integration effort and latency vs. soft-core implementations; supports root port and endpoint roles
24 Multi-Gigabit TransceiversEnables up to 24 independent serial links at 13.1 Gbps; supports protocol stacking (e.g., PCIe + Ethernet)
Partial Reconfiguration SupportAllows runtime logic updates without full device reset; critical for mission-critical or adaptive systems
AXI4-Stream & AXI4-Lite InterfacesStandardized on-chip interconnect enabling plug-and-play integration with ARM-based processors and DMA controllers
UltraScale ArchitectureDelivers 1.5× higher logic density and 2× faster transceivers vs. Virtex-6 generation

Applications

Radar Signal ProcessingHigh-Speed Data Acquisition

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: Primary compute engine performing FFT, CFAR, and digital down-conversion on ADC sample streams.

Use Value: 2,850 DSP slices enable concurrent multi-channel processing; 13.1 Gbps transceivers feed raw ADC data directly from JESD204B-compliant converters.

Use Scenario: Synchronized sampling across 32+ channels at 250 MSPS in test instrumentation.

IC Role / Device Role / Timing Role: Central timing and data aggregation hub interfacing with multiple ADCs and DDR3 memory controllers.

Use Value: 600 I/O pins support parallel LVDS capture; 36.4 Mb block RAM buffers full acquisition bursts before host transfer.

Avionics Data Concentrators5G Wireless Baseband Units

Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control systems.

IC Role / Device Role / Timing Role: Protocol translation and deterministic packet switching between legacy and modern avionics buses.

Use Value: Hardened PCIe Gen3 and GigE MAC blocks reduce software overhead; partial reconfiguration allows in-field protocol updates.

Use Scenario: Layer 1 PHY processing and front-haul transport in massive MIMO base stations.

IC Role / Device Role / Timing Role: Real-time OFDM modulation/demodulation, channel estimation, and CPRI/eCPRI framing.

Use Value: 485K logic cells implement custom FFT/iFFT engines; transceivers handle 24× 10G front-haul links to remote radio heads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA compute and serial I/O applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IHigher logic capacity (2,586K LC), 64 GTY transceivers, 14.1 Gbps max rate; larger FFG2104 packageBetter suited for 400G Ethernet switching and AI inference accelerationSelect when >1M logic cells or >10G transceiver count required; not pin-compatible
XC7VX690T-2FF1157ISame FFG1157 package; 690K logic cells, 3,600 DSP slices, 42.2 Mb BRAM; higher speed grade (-2)Preferred for bandwidth-bound applications needing more DSP or memory resourcesDrop-in PCB replacement only if board supports -2 speed grade and thermal margin; same pinout but higher power draw

Compared with XC7VX485T-1FF1157I, XCVU9P-2FLGA2104I delivers significantly greater scale but requires new mechanical and thermal design, while XC7VX690T-2FF1157I offers direct layout reuse with increased resource headroom at higher static power.

Availability

XC7VX485T-1FF1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.

Supply support for XC7VX485T-1FF1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets, with heritage in high-performance programmable logic since acquiring Xilinx in 2022.

The Virtex-7 family, including XC7VX485T-1FF1157I, was designed for compute-intensive, high-bandwidth applications demanding deterministic latency, multi-protocol serial connectivity, and field-upgradable logic in harsh environments.

FAQ

What is the maximum transceiver line rate supported by XC7VX485T-1FF1157I?

The XC7VX485T-1FF1157I supports a maximum transceiver line rate of 13.1 Gbps per channel using its 24 GTH transceivers. This enables compliance with PCIe Gen3 x8, 10GBASE-R Ethernet, and CPRI Option 10. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margins.

Does XC7VX485T-1FF1157I support partial reconfiguration?

Yes, XC7VX485T-1FF1157I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules during operation without resetting the entire device, which is essential for adaptive radar modes or protocol upgrades in avionics systems where uptime is critical.

What I/O standards are supported by XC7VX485T-1FF1157I?

XC7VX485T-1FF1157I supports LVCMOS, LVTTL, SSTL, HSTL, DIFF_HSTL, DIFF_SSTL, and differential signaling standards including LVDS, BLVDS, and TMDS. Each of its 24 I/O banks operates independently, allowing mixed-voltage interfaces (1.2 V to 3.3 V) on a single device for heterogeneous system integration.

Is XC7VX485T-1FF1157I qualified for aerospace or defense applications?

XC7VX485T-1FF1157I is offered in an industrial temperature grade (–40°C to +100°C) and supports TID testing up to 100 krad(Si). While not a QML-V or MIL-PRF-38535 certified part, it is widely deployed in non-safety-critical avionics and ground-based defense systems where radiation tolerance and extended temperature operation are required.

What configuration methods does XC7VX485T-1FF1157I support?

XC7VX485T-1FF1157I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Dual-boot capability is enabled via external SPI flash, allowing fallback to a known-good bitstream if the primary image fails validation during power-up.

XC7VX485T-1FF1157I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 XT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
37950
Number of Logic Elements/Cells:
485760
Total RAM Bits:
37969920
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1157-FCBGA (35x35)

XC7VX485T-1FF1157I FAQ

1.How can I place an order for XC7VX485T-1FF1157I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VX485T-1FF1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VX485T-1FF1157I reliable?

The price and inventory of XC7VX485T-1FF1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-1FF1157I is usually 5 days.

3.What payment methods are accepted for XC7VX485T-1FF1157I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-1FF1157I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7VX485T-1FF1157I?

XC7VX485T-1FF1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VX485T-1FF1157I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VX485T-1FF1157I?

For technical support, including XC7VX485T-1FF1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-1FF1157I requirements.

6.How does Aetrix verify that XC7VX485T-1FF1157I is sourced from the original manufacturer or authorized distributors?

All XC7VX485T-1FF1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-1FF1157I meets industry standards.

7.What is the process for return or replacement of XC7VX485T-1FF1157I?

All XC7VX485T-1FF1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-1FF1157I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VX485T-1FF1157I part is unused and in its original packaging.

Return procedure for XC7VX485T-1FF1157I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VX485T-1FF1157I Tags

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