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AMD XC7VX485T-1FFG1157C
- Part No.:
- XC7VX485T-1FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-1FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,201
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Product details
Overview
XC7VX485T-1FFG1157C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 34.8 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s, supports PCIe Gen3 x8, and is used in high-end radar signal processing systems requiring deterministic low-latency data path acceleration.
For engineers reviewing the XC7VX485T-1FFG1157C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility (1.2 V to 1.8 V), and thermal performance under sustained 28 W typical power dissipation.
Technical Context
This FPGA implements a segmented architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and hardened IP including PCIe Gen3 endpoints, 10/100/1000 Ethernet MACs, and AXI interconnects. It supports partial reconfiguration and built-in system monitoring via on-die temperature and supply sensors.
The device uses SelectIO technology with support for LVDS, SSTL, HSTL, and MIPI D-PHY I/O standards across 36 I/O banks. Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption enabled through AES-256 and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for complex control and datapath functions |
| DSP Slices | 2,825 - enables parallel execution of multiply-accumulate operations for real-time filtering and FFT processing |
| Block RAM | 34.8 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage without external memory latency |
| GT Transceivers | 700 lanes @ up to 13.1 Gb/s - supports multi-lane serial protocols including CPRI, JESD204B, and 10G Ethernet |
| I/O Banks | 36 - allows independent voltage assignment per bank for mixed-voltage interface bridging (e.g., 1.2 V ASIC to 1.8 V memory) |
| Configuration Interface | Quad-SPI / BPI / JTAG - enables flexible, secure, and field-upgradable bitstream loading |
| Speed Grade | -1 - specifies guaranteed timing closure at default voltage/temperature conditions (85°C junction, 1.0V core) |
Pinout & Package
The XC7VX485T-1FFG1157C is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm ball pitch, and standard thermal lid. It supports industrial temperature range (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0 V ±3% supply for CLBs, DSP, and routing fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 1.8 V supply for configuration logic, clock management tiles, and transceiver analog circuitry |
| VCCO_0 | I/O Bank Power | Programmable 1.2–1.8 V supply per bank; sets output swing and input threshold for connected peripherals |
| MGTAVCC | Transceiver Analog Supply | 1.0 V analog supply for GT transceiver PLLs and serializers; sensitive to ripple and noise |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration status; pulled high externally during normal operation |
| CCLK | Configuration Clock | Input clock for master SPI configuration mode; frequency ≤ 50 MHz; drives internal configuration state machine |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset-critical for adaptive radar waveform updates and protocol stack upgrades |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning by encrypting configuration data stored in external flash memory |
| On-Die Temperature Sensor | Provides ±2°C accuracy thermal monitoring for closed-loop thermal throttling and reliability-aware power management |
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and timing closure risk for host interface connectivity in embedded computing platforms |
| AXI4 Interconnect Fabric | Delivers standardized, scalable, and pipelined memory-mapped communication between processors, accelerators, and peripherals |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GT transceivers interface with ADC/DAC FMC modules at 5+ GSPS aggregate bandwidth. Use Value: Deterministic sub-100 ns latency and hardware-accelerated FFTs enable adaptive target tracking under dynamic RF conditions. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers capturing transient RF events. IC Role / Device Role / Timing Role: Synchronizes >32 channels of 14-bit, 1 GSPS ADCs; buffers raw samples in block RAM before compression and streaming. Use Value: On-chip 34.8 Mb RAM eliminates external DDR bottleneck, enabling continuous 200+ ms capture at full rate. |
| Avionics Data Concentrators | 5G Baseband Prototyping |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B network aggregation in flight control computers. IC Role / Device Role / Timing Role: Implements dual-redundant AFDX end systems with deterministic latency < 15 μs and CRC-32 error detection. Use Value: Hardened Ethernet MACs and AXI interconnect reduce integration risk and certification effort for DO-254 Level A designs. | Use Scenario: Massive MIMO precoding and channel estimation algorithm validation in lab testbeds. IC Role / Device Role / Timing Role: Accelerates matrix inversion and QR decomposition using 2,825 DSP slices; interfaces with RFSoC DACs via JESD204B v1.3. Use Value: 13.1 Gb/s GT transceivers sustain 8× JESD204B lanes for 16-stream 12-bit IQ data at 2.4576 GSPS per lane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; higher logic density (2,586K LC), lower power per DSP slice, but no native PCIe Gen3 endpoint | Better suited for AI inference acceleration; less optimal for legacy PCIe Gen3 host interfacing | Select when migrating to newer process node and prioritizing power efficiency over drop-in PCIe compatibility |
| XC7VX690T-2FFG1927I | Larger footprint (1927-pin), higher logic count (693,120 LC), same 28 nm process and -2 speed grade | Used where additional I/O count (>700 pins) and larger block RAM (48.5 Mb) are required for multi-FPGA partitioning | Choose when board layout accommodates larger package and system demands greater resource headroom |
Compared with XC7VX485T-1FFG1157C, the XCVU9P-2FLGA2104I offers superior compute density and energy efficiency but requires redesign for PCIe integration, while the XC7VX690T-2FFG1927I delivers direct scalability within the same architecture and toolchain at the cost of increased PCB area and thermal load.
Availability
XC7VX485T-1FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, avionics data concentrators, and 5G baseband prototyping requiring stable component supply across extended product lifecycles.
Supply support for XC7VX485T-1FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense electronics, scientific instrumentation, and wired/wireless infrastructure equipment.
FAQ
What is the maximum supported transceiver data rate for XC7VX485T-1FFG1157C?
The XC7VX485T-1FFG1157C supports GT transceivers operating up to 13.1 Gb/s per lane. This rate is validated under industrial temperature conditions and with proper reference clock jitter compliance (≤ 1.0 ps RMS). The XC7VX485T-1FFG1157C achieves this performance using its dedicated 2.5 V MGTAVCC supply and calibrated PLL settings specified in UG476.
Does XC7VX485T-1FFG1157C support partial reconfiguration?
Yes, the XC7VX485T-1FFG1157C fully supports partial reconfiguration as defined in Xilinx UG908. This capability allows dynamic replacement of logical modules without resetting the entire device, enabling runtime adaptation in radar waveform generation and protocol stack updates. The XC7VX485T-1FFG1157C implements this using frame-based bitstream loading and hierarchical design constraints.
What configuration modes are supported by XC7VX485T-1FFG1157C?
The XC7VX485T-1FFG1157C supports master SPI, slave parallel (BPI), and JTAG configuration modes. Quad-SPI is commonly used for compact, encrypted bitstream storage in single-flash devices. The XC7VX485T-1FFG1157C also supports fallback configuration and multi-boot via external mode pins, as detailed in UG470.
What is the industrial temperature range rating for XC7VX485T-1FFG1157C?
The XC7VX485T-1FFG1157C is rated for operation from –40°C to +100°C junction temperature. This industrial-grade specification is verified per JEDEC JESD22-A104 and applies to the FFG1157 package variant. Thermal derating curves for VCCINT and MGTAVCC supplies are provided in the XC7VX485T-1FFG1157C data sheet DS182.
How many I/O banks does XC7VX485T-1FFG1157C have, and what voltage levels are supported?
The XC7VX485T-1FFG1157C contains 36 SelectIO banks, each independently configurable for 1.2 V, 1.35 V, 1.5 V, or 1.8 V VCCO. This enables mixed-voltage interface bridging-for example, connecting 1.2 V ASICs to 1.8 V DDR3 memory. The XC7VX485T-1FFG1157C supports LVDS, SSTL-15, and HSTL-I standards across these banks as documented in UG471.
XC7VX485T-1FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX485T-1FFG1157C FAQ
1.How can I place an order for XC7VX485T-1FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-1FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-1FFG1157C reliable?
The price and inventory of XC7VX485T-1FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-1FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7VX485T-1FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-1FFG1157C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-1FFG1157C?
XC7VX485T-1FFG1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-1FFG1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-1FFG1157C?
For technical support, including XC7VX485T-1FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-1FFG1157C requirements.
6.How does Aetrix verify that XC7VX485T-1FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-1FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-1FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7VX485T-1FFG1157C?
All XC7VX485T-1FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-1FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-1FFG1157C part is unused and in its original packaging.
Return procedure for XC7VX485T-1FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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