AMD XC7VX485T-1FFG1157I

Overview

XC7VX485T-1FFG1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 36.9 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s, integrated PCIe Gen3 x8 endpoint, and supports DDR3 memory interfaces up to 1866 Mbps. It is used in high-speed data acquisition systems requiring deterministic low-latency processing.

For engineers reviewing the XC7VX485T-1FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, logic cell density, on-chip memory bandwidth, PCIe Gen3 integration, and thermal performance in air-cooled rack-mount enclosures.

Technical Context

The XC7VX485T-1FFG1157I implements a 28 nm HPL (High-Performance Low-Power) process-based architecture with configurable logic blocks (CLBs), 6-input LUTs, and distributed RAM. It integrates hardened IP including PCIe Gen3 x8 endpoint, 10/100/1000 Ethernet MACs, and clock management tiles (CMT) with MMCM and PLL.

It supports multi-voltage I/O banks (1.2 V to 3.3 V), SelectIO™ technology with SSTL, HSTL, LVCMOS, and differential standards (LVDS, TMDS), and partial reconfiguration via ICAP interface. Configuration is performed through JTAG, SPIx4, or BPI parallel mode.

Key Specifications

Pinout & Package

XC7VX485T-1FFG1157I is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm pitch, and thermal lid. The package supports dual heat sink attachment and meets JEDEC J-STD-020 moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU115-2FLVD1517I and XCVU37P-2FLGC2104I, the XC7VX485T-1FFG1157I offers balanced transceiver count, logic density, and memory for radar and test equipment where deterministic latency and PCIe Gen3 integration are critical - not just raw compute or bandwidth.

Availability

XC7VX485T-1FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC7VX485T-1FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Virtex-7 family was designed for demanding high-speed serial I/O, signal processing, and deterministic real-time computing in defense, instrumentation, and scientific systems.

FAQ

What is the maximum supported data rate for GTY transceivers in XC7VX485T-1FFG1157I?

The XC7VX485T-1FFG1157I supports GTY transceivers operating at up to 13.1 Gb/s per lane. This rate is validated under specified temperature, voltage, and PCB trace loss conditions per AMD UG476 v1.14. The XC7VX485T-1FFG1157I achieves this performance using adaptive equalization and low-jitter clocking architecture integrated into each GTY tile.

Does XC7VX485T-1FFG1157I support partial reconfiguration?

Yes, the XC7VX485T-1FFG1157I supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This capability allows dynamic module swapping while maintaining operation of other design regions. The XC7VX485T-1FFG1157I requires bitstream partitioning and placement constraints defined in Vivado to ensure timing closure across reconfigurable boundaries.

What PCIe generation and lane count does XC7VX485T-1FFG1157I implement?

The XC7VX485T-1FFG1157I integrates a hardened PCIe Gen3 endpoint supporting up to x8 lane configuration. It complies with PCI Express Base Specification Revision 3.0 and supports advanced features including ASPM L0s/L1, ECRC, and atomic operations. The XC7VX485T-1FFG1157I uses dedicated hard IP to minimize latency and reduce resource utilization versus soft-core implementations.

What is the I/O voltage range supported by XC7VX485T-1FFG1157I?

The XC7VX485T-1FFG1157I supports I/O voltages from 1.2 V to 3.3 V across independently configurable banks. Each bank can be set to SSTL-15, SSTL-18, HSTL-I, HSTL-II, LVCMOS, or differential standards including LVDS and TMDS. The XC7VX485T-1FFG1157I requires proper VCCO assignment per bank during place-and-route to avoid I/O contention or damage.

Is XC7VX485T-1FFG1157I qualified for extended temperature operation?

Yes, the XC7VX485T-1FFG1157I is rated for industrial temperature range (–40 °C to +100 °C junction). This rating applies to the -1 speed grade in the FFG1157 package. The XC7VX485T-1FFG1157I meets JEDEC JESD22-A104 reliability testing requirements for extended temperature operation, including thermal cycling and high-temperature operating life.